Patents by Inventor Chin-Kai Sun

Chin-Kai Sun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10234915
    Abstract: A graphite thermal conductor includes graphite bands laminated in the thickness direction. The thermal conductivity coefficient of each graphite band in the extending path is greater than the thermal conductivity coefficient thereof in the thickness direction. The extending path of each graphite band has at least one first bend in a plane which is perpendicular to the thickness direction. An electronic device applying the above graphite thermal conductor and a method for manufacturing graphite thermal conductor are also provided.
    Type: Grant
    Filed: September 9, 2015
    Date of Patent: March 19, 2019
    Assignee: HTC Corporation
    Inventors: Chin-Kai Sun, Jen-Cheng Lai, Jia-Yuan Hsu, Yi-Chang Huang, Chieh-Pei Chou
  • Patent number: 10070552
    Abstract: An electronic device and a component module thereof are provided, wherein the electronic device includes a housing, a component and a flexible substrate. The housing has a mounting region, and the component is disposed in the mounting region. The flexible substrate includes a bonding portion and an extending portion, wherein the bonding portion is disposed between the component and a carrying surface of the mounting region. The mounting portion has a first surface and a second surface opposite to the first surface, wherein the first surface is bonded to the component, and the second surface is bonded to the carrying surface. The extending portion is connected to the bonding portion and extended to the outside of the mounting region.
    Type: Grant
    Filed: September 17, 2015
    Date of Patent: September 4, 2018
    Assignee: HTC Corporation
    Inventors: Sheng-Ming Liu, Chin-Kai Sun
  • Publication number: 20170086323
    Abstract: An electronic device and a component module thereof are provided, wherein the electronic device includes a housing, a component and a flexible substrate. The housing has a mounting region, and the component is disposed in the mounting region. The flexible substrate includes a bonding portion and an extending portion, wherein the bonding portion is disposed between the component and a carrying surface of the mounting region. The mounting portion has a first surface and a second surface opposite to the first surface, wherein the first surface is bonded to the component, and the second surface is bonded to the carrying surface. The extending portion is connected to the bonding portion and extended to the outside of the mounting region.
    Type: Application
    Filed: September 17, 2015
    Publication date: March 23, 2017
    Inventors: Sheng-Ming Liu, Chin-Kai Sun
  • Publication number: 20170067701
    Abstract: A graphite thermal conductor includes graphite bands laminated in the thickness direction. The thermal conductivity coefficient of each graphite band in the extending path is greater than the thermal conductivity coefficient thereof in the thickness direction. The extending path of each graphite band has at least one first bend in a plane which is perpendicular to the thickness direction. An electronic device applying the above graphite thermal conductor and a method for manufacturing graphite thermal conductor are also provided.
    Type: Application
    Filed: September 9, 2015
    Publication date: March 9, 2017
    Inventors: Chin-Kai Sun, Jen-Cheng Lai, Jia-Yuan Hsu, Yi-Chang Huang, Chieh-Pei Chou
  • Patent number: 9568255
    Abstract: An electronic apparatus and a heat dissipation plate are provided. The electronic device includes a frame or a housing, at least one heat generating unit and a heat pipe, wherein the heat dissipation plate includes the frame and the heat pipe. The heat pipe is disposed on the frame or the housing. An orthogonal projection of the heat pipe on the frame or on the housing is partially overlapped with an orthogonal projection of the heat generating device on the frame or on the housing.
    Type: Grant
    Filed: April 21, 2014
    Date of Patent: February 14, 2017
    Assignee: HTC Corporation
    Inventors: Tzu-Chia Tan, Chin-Kai Sun, Jen-Cheng Lai, Chih-Lin Chang
  • Patent number: 9374515
    Abstract: An electronic element supporting base and an electronic device applying the same are provided. The electronic element supporting base comprises a fixing portion and a carrying part. The fixing portion is suitable for being fixed to a frame of the electronic device as a fulcrum for the electronic element supporting base. The carrying part is suitable for carrying a plurality of electronic elements, wherein a gap exists between the carrying part and the frame, and a gap exists between the carrying part and the circuit board. When the electronic device receives an impact, the suspended design of the electronic element supporting base allows the carrying part to oscillate through the gaps, and the electronic element supporting base will not be squeezed, which prevents the electronic elements on the electronic element supporting base from being shifted.
    Type: Grant
    Filed: July 4, 2014
    Date of Patent: June 21, 2016
    Assignee: HTC Corporation
    Inventors: I-Te Chen, Wei-Cheng Liu, Chun Tseng, Jia-Yuan Hsu, Jen-Cheng Lai, Cheng-Chieh Chuang, Chin-Kai Sun
  • Publication number: 20150300750
    Abstract: An electronic apparatus and a heat dissipation plate are provided. The electronic device includes a frame or a housing, at least one heat generating unit and a heat pipe, wherein the heat dissipation plate includes the frame and the heat pipe. The heat pipe is disposed on the frame or the housing. An orthogonal projection of the heat pipe on the frame or on the housing is partially overlapped with an orthogonal projection of the heat generating device on the frame or on the housing.
    Type: Application
    Filed: April 21, 2014
    Publication date: October 22, 2015
    Applicant: HTC Corporation
    Inventors: Tzu-Chia Tan, Chin-Kai Sun, Jen-Cheng Lai, Chih-Lin Chang
  • Publication number: 20150249776
    Abstract: An electronic element supporting base and an electronic device applying the same are provided. The electronic element supporting base comprises a fixing portion and a carrying part. The fixing portion is suitable for being fixed to a frame of the electronic device as a fulcrum for the electronic element supporting base. The carrying part is suitable for carrying a plurality of electronic elements, wherein a gap exists between the carrying part and the frame, and a gap exists between the carrying part and the circuit board. When the electronic device receives an impact, the suspended design of the electronic element supporting base allows the carrying part to oscillate through the gaps, and the electronic element supporting base will not be squeezed, which prevents the electronic elements on the electronic element supporting base from being shifted.
    Type: Application
    Filed: July 4, 2014
    Publication date: September 3, 2015
    Inventors: I-Te Chen, Wei-Cheng Liu, Chun Tseng, Jia-Yuan Hsu, Jen-Cheng Lai, Cheng-Chieh Chuang, Chin-Kai Sun
  • Patent number: 7457407
    Abstract: A mobile phone and a battery-fixing device. The mobile phone comprises a body, a battery, and a positioning device. The body includes a first guiding member. The battery is disposed on the body in a detachable manner, and includes a second guiding member corresponding to the first guiding member. The battery moves in the body by the second guiding member moving along the first guiding member. The positioning device is disposed on the body, and fixes the battery in the body.
    Type: Grant
    Filed: August 26, 2004
    Date of Patent: November 25, 2008
    Assignee: Qisda Corporation
    Inventors: Chin-Kai Sun, Shun-Fan Cheng
  • Patent number: 7063540
    Abstract: A connector for electrically connecting a first circuit board and a second circuit board includes an L-shaped main body, a first contacting spring, a second contacting spring and a positioning spring. The L-shaped main body has a lateral side, a bottom side and a supporting portion. The first contacting spring is disposed on the lateral side and is electrically connected to the first circuit board disposed on the supporting portion. The second contacting spring is disposed on the bottom side and is electrically connected to the first contacting spring and the second circuit board. The positioning spring is disposed on the lateral side and on the top of the first contacting spring. The first circuit board is confined and positioned along a first direction as a result of the presence of the positioning spring.
    Type: Grant
    Filed: March 22, 2005
    Date of Patent: June 20, 2006
    Assignee: BenQ Corporation
    Inventors: Chin-Kai Sun, Wen-Hsiung Shih
  • Patent number: 6983168
    Abstract: The present invention relates to a mobile phone including a main printed circuit board. A first connector and a second connector are welded respectively onto a first predetermined location and a second predetermined location of the main printed circuit board, wherein a first power supply and a second power supply are provided respectively by the first connector and the second connector. The main printed circuit board includes a first portion corresponding to a keypad module and a second portion corresponding to an LCM module. The mobile phone also provides a holder, wherein a space is included in the holder to accommodate the LCM module. A slit is formed at a predetermined location of the holder. The mobile phone further includes a secondary printed circuit board carrying a plurality of LEDs to provide a back light source. The secondary printed circuit disposed within the aforementioned slit includes a first contact point and a second contact point.
    Type: Grant
    Filed: March 23, 2001
    Date of Patent: January 3, 2006
    Assignee: BenQ Corporation
    Inventors: Wei-Chih Chen, Chin-Kai Sun
  • Publication number: 20050221632
    Abstract: A connector for electrically connecting a first circuit board and a second circuit board includes an L-shaped main body, a first contacting spring, a second contacting spring and a positioning spring. The L-shaped main body has a lateral side, a bottom side and a supporting portion. The first contacting spring is disposed on the lateral side and is electrically connected to the first circuit board disposed on the supporting portion. The second contacting spring is disposed on the bottom side and is electrically connected to the first contacting spring and the second circuit board. The positioning spring is disposed on the lateral side and on the top of the first contacting spring. The first circuit board is confined and positioned along a first direction as a result of the presence of the positioning spring.
    Type: Application
    Filed: March 22, 2005
    Publication date: October 6, 2005
    Inventors: Chin-Kai Sun, Wen-Hsiung Shih
  • Patent number: 6875041
    Abstract: An ejecting apparatus for ejecting a data card and releasing a first object from an electrical device. The ejecting apparatus includes a latch movably connected to the ejecting apparatus. The latch contains a retaining member adapted for insertion into a corresponding groove on the first object for engaging with the first object, and a releasing knob monolithically formed with the retaining member, and adapted to move the latch with respect to the ejecting apparatus for releasing the retaining member from the groove of the first object and enabling the first object to be removed from the electrical device. The ejecting apparatus also includes a pivoting shaft for pivotally connecting the ejecting apparatus to the electrical device, and at least one ejector leg for pushing the data card from the electrical device to eject the data card as the ejecting apparatus is rotated from the electrical device about the pivoting shaft.
    Type: Grant
    Filed: September 15, 2003
    Date of Patent: April 5, 2005
    Assignee: BenQ Corporation
    Inventors: Yu-Chuan Chang, Chin-Kai Sun, Leo Lai
  • Patent number: 6872104
    Abstract: An electrical connector includes an integrally formed conductive terminal having a first contact portion, a second contact portion, and a bent retaining portion with an upper end connected to the first contact portion and a lower end disposed below the upper end and connected to the second contact portion. An electronic apparatus incorporating the electrical connector is also disclosed.
    Type: Grant
    Filed: May 13, 2003
    Date of Patent: March 29, 2005
    Assignee: Benq Corporation
    Inventor: Chin-Kai Sun
  • Publication number: 20050058284
    Abstract: A mobile phone and a battery-fixing device. The mobile phone comprises a body, a battery, and a positioning device. The body includes a first guiding member. The battery is disposed on the body in a detachable manner, and includes a second guiding member corresponding to the first guiding member. The battery moves in the body by the second guiding member moving along the first guiding member. The positioning device is disposed on the body, and fixes the battery in the body.
    Type: Application
    Filed: August 26, 2004
    Publication date: March 17, 2005
    Applicant: BENQ CORPORATION
    Inventors: Chin-Kai Sun, Shun-Fan Cheng
  • Publication number: 20050059289
    Abstract: An ejecting apparatus for ejecting a data card and releasing a first object from an electrical device. The ejecting apparatus includes a latch movably connected to the ejecting apparatus. The latch contains a retaining member adapted for insertion into a corresponding groove on the first object for engaging with the first object, and a releasing knob monolithically formed with the retaining member, and adapted to move the latch with respect to the ejecting apparatus for releasing the retaining member from the groove of the first object and enabling the first object to be removed from the electrical device. The ejecting apparatus also includes a pivoting shaft for pivotally connecting the ejecting apparatus to the electrical device, and at least one ejector leg for pushing the data card from the electrical device to eject the data card as the ejecting apparatus is rotated from the electrical device about the pivoting shaft.
    Type: Application
    Filed: September 15, 2003
    Publication date: March 17, 2005
    Inventors: Yu-Chuan Chang, Chin-Kai Sun, Jen-Cheng Lai
  • Publication number: 20050002520
    Abstract: A housing fabricating mechanism is used for fabricating a first housing and a second housing of a wireless communication devices, and the housing fabricating mechanism comprises a first fabricating surface of the first housing and a second fabricating surface of the second housing. Where the first fabricating surface of the first housing comprises a first hook and an inserted ditch, the second fabricating surface of the second housing comprises a second hook, an inserting end and a stopper for combining with the first housing fabricating surface. The second hook is located in the opposite position of the first hook and has an opening on the second housing for accommodating and wedging the first hook when the first housing and the second housing are fabricated together. The stopper is used for plugging the opening when the first housing and the second housing are fabricated together so as to prevent the first hook from detaching from the second hook after the two are wedged together.
    Type: Application
    Filed: June 18, 2004
    Publication date: January 6, 2005
    Inventors: Chin-Kai Sun, Chia-Ming Hsieh
  • Publication number: 20040209659
    Abstract: A mobile phone and a device for fixing a battery thereof. The mobile phone includes a body and a battery. The body includes a first engaging portion, and the battery includes a second engaging portion. The battery is rotated to a predetermined position and is thereby fixed on the body.
    Type: Application
    Filed: April 13, 2004
    Publication date: October 21, 2004
    Applicant: BENQ Corporation
    Inventors: Chin-Kai Sun, Shun-Fan Cheng
  • Publication number: 20040160749
    Abstract: A mechanism for connecting a horizontal upper circuit board to a horizontal lower circuit board includes two insulating bodies fixed respectively on two opposite side portions of the lower circuit board, and two flexible retaining hooks fixed respectively on and projecting respectively and upwardly from the insulating bodies. Each of the insulating bodies has an inner side surface that is formed with a row of pin holes, each of which has a resilient conductive pin mounted therein. The upper circuit board is retained between the retaining hooks, and is clamped between abutment faces of the retaining hooks and upper contact portions of the conductive pins.
    Type: Application
    Filed: February 13, 2004
    Publication date: August 19, 2004
    Applicant: BENQ CORPORATION
    Inventors: Chin-Kai Sun, Chia-Ming Hsieh
  • Publication number: 20040021630
    Abstract: The present invention discloses a LCD apparatus and a back light module thereof. The back light module and a printed circuit board are disposed within a housing having a depression. The back light module includes a back light plate and light source disposed on the printed circuit board. The back light plate and the housing are formed in integral. The back light plate includes a plurality of holes allowing passage of the light generated by the light source.
    Type: Application
    Filed: July 18, 2003
    Publication date: February 5, 2004
    Inventors: Jen-Cheng Lai, Chin-Kai Sun