Abstract: The present disclosure provides a method for preparing a semiconductor device with a copper-manganese liner. The method includes forming an opening structure in a first dielectric layer, wherein the opening structure has a first portion, a second portion and a third portion disposed between and physically connecting the first portion and the second portion; forming a lining material lining the first portion and the second portion of the opening structure and completely filling the third portion of the opening structure, wherein the lining material includes copper-manganese (CuMn); filling the first portion and the second portion of the opening structure with a conductive material after the lining material is formed; and performing a planarization process on the lining material and the conductive material.

Abstract: A semiconductor device is provided. The semiconductor device includes a body and an interconnection structure. The body has a first lateral surface and a second lateral surface angled relative to the first lateral surface. The interconnection structure is configured to make electrical connection between the semiconductor device and a first electronic component mounted to the first lateral surface of the body of the semiconductor device and to make electrical connection between the semiconductor device and a second electronic component mounted to the second lateral surface of the body of the semiconductor device.

Abstract: A semiconductor device is provided. The semiconductor device includes a body and an interconnection structure. The body has a first lateral surface and a second lateral surface angled relative to the first lateral surface. The interconnection structure is configured to make electrical connection between the semiconductor device and a first electronic component mounted to the first lateral surface of the body of the semiconductor device and to make electrical connection between the semiconductor device and a second electronic component mounted to the second lateral surface of the body of the semiconductor device.

Abstract: The present application discloses a method for fabricating a semiconductor device. The method includes providing a substrate, forming a peak portion on the substrate, forming a gate insulating layer on the substrate and the peak portion, forming a gate bottom conductive layer on the gate insulating layer, and forming a first doped region in the substrate and adjacent to one end of the gate insulating layer.

Abstract: The present disclosure provides a method for preparing a semiconductor device with a copper-manganese liner. The method includes forming an opening structure in a first dielectric layer, wherein the opening structure has a first portion, a second portion and a third portion disposed between and physically connecting the first portion and the second portion; forming a lining material lining the first portion and the second portion of the opening structure and completely filling the third portion of the opening structure, wherein the lining material includes copper-manganese (CuMn); filling the first portion and the second portion of the opening structure with a conductive material after the lining material is formed; and performing a planarization process on the lining material and the conductive material.

Abstract: The present disclosure provides a semiconductor device with a fuse structure and an anti-fuse structure and a method for forming the semiconductor device. The semiconductor device includes a first dielectric layer disposed over a semiconductor substrate, and a first electrode disposed over the first dielectric layer. The semiconductor device also includes a fuse link disposed over the first electrode, and a second electrode disposed over the fuse link. The semiconductor device further includes a third electrode disposed adjacent to the first electrode, and a second dielectric layer separating the first electrode from the first dielectric layer and the third electrode. The first electrode, the fuse link, and the second electrode form a fuse structure, and the first electrode, the third electrode, and a portion of the second dielectric layer between the first electrode and the third electrode form an anti-fuse structure.

Abstract: The present application provides a programmable memory device. The programmable memory device includes: an access transistor, comprising an active region formed in a substrate and a gate structure formed on the substrate, wherein the active region has a linear top view shape, the gate structure has a first portion and a second portion, the first portion is intersected with a section of the active region away from end portions of the active region, and the second portion is laterally spaced apart from the active region; and a capacitor, using a portion of the active region as a terminal, and further comprising an electrode and a dielectric layer, wherein the electrode is disposed on the portion of the active region and spaced apart from the gate structure, and at least a portion of the dielectric layer is sandwiched between the electrode and the portion of the active region.

Abstract: The present disclosure provides a semiconductor device with a copper-manganese liner and a method for preparing the semiconductor device. The semiconductor device includes a first well region and a second well region disposed in a semiconductor substrate. The semiconductor device also includes a first dielectric layer disposed over the semiconductor substrate and covering the first well region and the second well region, and a gate structure disposed over the first dielectric layer and between the first well region and the second well region. The semiconductor device further includes a conductive structure disposed over and separated from the first well region by a portion of the first dielectric layer. The conductive feature includes a barrier layer and a conductive plug disposed over the barrier layer, and the barrier layer is made of copper-manganese (CuMn). The first well region, the conductive structure and the portion of the first dielectric layer form an anti-fuse structure.

Abstract: The present disclosure provides a semiconductor device with a copper-manganese liner and a method for forming the semiconductor device. The semiconductor device includes a first electrode and a second electrode disposed in a first dielectric layer. The semiconductor device also includes a first liner separating the first electrode from the first dielectric layer. The semiconductor device further includes a fuse link disposed in the first dielectric layer. The fuse link is disposed between and electrically connected to the first electrode and the second electrode, and the fuse link and the first liner are made of copper-manganese (CuMn).

Abstract: The present disclosure provides a semiconductor device with air gaps between adjacent conductive lines and a method for forming the semiconductor device. The semiconductor device with air gaps between adjacent conductive lines and a method for forming the semiconductor device. The semiconductor device includes a first dielectric layer disposed over a semiconductor substrate, and a first electrode disposed over the first dielectric layer. The semiconductor device also includes a fuse link disposed over the first electrode, and a second electrode disposed over the fuse link. The semiconductor device further includes a third electrode disposed adjacent to the first electrode, and a second dielectric layer separating the first electrode from the first dielectric layer and the third electrode.

Abstract: The present disclosure provides a method for manufacturing a semiconductor structure having a vertical fin with an oxidized sidewall. The method of manufacturing the semiconductor structure includes the steps of providing a substrate having a bottom source/drain and a bottom cathode/anode; forming a channel fin on the bottom source/drain of the substrate and a vertical fin on the cathode/anode of the substrate; forming a top source/drain on the channel fin and a top cathode/anode on the vertical fin; forming a gate structure on the channel fin; and forming an oxidized sidewall on the vertical fin.

Abstract: The present application discloses a method for fabricating a semiconductor device includes providing a substrate, forming a gate stack on the substrate and a pair of heavily-doped regions in the substrate, forming a programmable contact having a first width on the gate stack, and forming a first contact having a second width, which is greater than the first width, on one of the pair of heavily-doped regions.

Abstract: The present disclosure provides a semiconductor device with a fuse structure and an anti-fuse structure and a method for forming the semiconductor device. The semiconductor device includes a first dielectric layer disposed over a semiconductor substrate, and a first electrode disposed over the first dielectric layer. The semiconductor device also includes a fuse link disposed over the first electrode, and a second electrode disposed over the fuse link. The semiconductor device further includes a third electrode disposed adjacent to the first electrode, and a second dielectric layer separating the first electrode from the first dielectric layer and the third electrode. The first electrode, the fuse link, and the second electrode form a fuse structure, and the first electrode, the third electrode, and a portion of the second dielectric layer between the first electrode and the third electrode form an anti-fuse structure.

Abstract: The present application discloses a method for fabricating a semiconductor device with a programmable feature such as anti-fuse The method includes forming a semiconductor fin on a buried insulating layer; forming a dummy gate structure on the semiconductor fin; forming a top insulating layer over the semiconductor fin and covering the dummy gate structure; removing the dummy gate structure and concurrently forming a first trench in the top insulating layer; performing an etch process in the first trench to form a tapered pit separating the semiconductor fin; forming a first insulating layer to completely fill the first trench and the tapered pit; and replacing the semiconductor fin with first conductive blocks.

Abstract: The present disclosure provides a semiconductor device with a copper-manganese liner and a method for forming the semiconductor device. The semiconductor device includes a first electrode and a second electrode disposed in a first dielectric layer. The semiconductor device also includes a first liner separating the first electrode from the first dielectric layer. The semiconductor device further includes a fuse link disposed in the first dielectric layer. The fuse link is disposed between and electrically connected to the first electrode and the second electrode, and the fuse link and the first liner are made of copper-manganese (CuMn).

Abstract: The present disclosure provides a semiconductor device with a copper-manganese liner and a method for preparing the semiconductor device. The semiconductor device includes a first well region and a second well region disposed in a semiconductor substrate. The semiconductor device also includes a first dielectric layer disposed over the semiconductor substrate and covering the first well region and the second well region, and a gate structure disposed over the first dielectric layer and between the first well region and the second well region. The semiconductor device further includes a conductive structure disposed over and separated from the first well region by a portion of the first dielectric layer. The conductive feature includes a barrier layer and a conductive plug disposed over the barrier layer, and the barrier layer is made of copper-manganese (CuMn). The first well region, the conductive structure and the portion of the first dielectric layer form an anti-fuse structure.

Abstract: The present disclosure provides a semiconductor device with a fuse structure and an anti-fuse structure and a method for forming the semiconductor device. The semiconductor device includes a first dielectric layer disposed over a semiconductor substrate, and a first electrode disposed over the first dielectric layer. The semiconductor device also includes a fuse link disposed over the first electrode, and a second electrode disposed over the fuse link. The semiconductor device further includes a third electrode disposed adjacent to the first electrode, and a second dielectric layer separating the first electrode from the first dielectric layer and the third electrode. The first electrode, the fuse link, and the second electrode form a fuse structure, and the first electrode, the third electrode, and a portion of the second dielectric layer between the first electrode and the third electrode form an anti-fuse structure.

Abstract: The present application discloses a semiconductor device with a programmable feature such as anti-fuse and a method for fabricating the semiconductor device. The semiconductor device includes a first insulating layer including a peak portion and an upper portion positioned on the peak portion, and first conductive blocks positioned on two sides of the peak portion. A width of the peak portion is gradually decreased toward a direction opposite to the upper portion, and the first conductive blocks are spaced apart by the peak portion.

Abstract: The present disclosure provides a semiconductor structure having a vertical fin with an oxidized sidewall and a method for preparing the semiconductor structure. The semiconductor structure includes a substrate, a top source/drain, a channel fin, a gate structure, a top cathode/anode, and a vertical fin. The substrate has a bottom source/drain and a bottom cathode/anode. The top source/drain is disposed above the bottom source/drain of the substrate, and the channel fin connects the top source/drain to the bottom source/drain of the substrate. The gate structure is disposed on the channel fin. The top cathode/anode is disposed above the bottom cathode/anode of the substrate, and the vertical fin connects the top cathode/anode to the bottom cathode/anode of the substrate, wherein the vertical fin has an oxidized sidewall.

Abstract: The present disclosure provides a semiconductor device with air gaps between adjacent conductive lines and a method for forming the semiconductor device. The semiconductor device with air gaps between adjacent conductive lines and a method for forming the semiconductor device. The semiconductor device includes a first dielectric layer disposed over a semiconductor substrate, and a first electrode disposed over the first dielectric layer. The semiconductor device also includes a fuse link disposed over the first electrode, and a second electrode disposed over the fuse link. The semiconductor device further includes a third electrode disposed adjacent to the first electrode, and a second dielectric layer separating the first electrode from the first dielectric layer and the third electrode.