Abstract: Embodiments of process kits for use in a substrate process chamber are provided herein. A process kit for a substrate process chamber including: a cover ring configured to extend over unprotected dicing tape of a tape frame substrate during use and having a central opening configured to expose a semiconductor wafer supported on the dicing tape during use; and a metallic shield disposed adjacent to at least a portion of a lower surface of the cover ring such that the metallic shield at least partially lines the lower surface.