Abstract: A semiconductor package structure includes an interposer substrate formed over a package substrate. The structure also includes a die disposed over the interposer substrate. The structure also includes a first heat spreader disposed over the package substrate. The structure also includes a second heat spreader disposed over the die and connected to the first heat spreader. The coefficient of thermal expansion (CTE) of the first heat spreader and the coefficient of thermal expansion of the second heat spreader are different.

Abstract: A semiconductor package structure includes an interposer substrate formed over a package substrate. The structure also includes a die disposed over the interposer substrate. The structure also includes a first heat spreader disposed over the package substrate. The structure also includes a second heat spreader disposed over the die and connected to the first heat spreader. The coefficient of thermal expansion (CTE) of the first heat spreader and the coefficient of thermal expansion of the second heat spreader are different.

Abstract: A reading device for capacitive sensing element comprises a differential capacitive sensing element, a modulator, a charge-voltage conversion circuit, a phase adjustment circuit, a demodulator and a low-pass filter. The modulator outputs a modulation signal to the common node of the capacitive sensing element and modulates the output signal of the capacitive sensing element. The two input terminals of the charge-to-voltage conversion circuit are connected to two non-common nodes of the capacitive sensing element. The charge-to-voltage converter read the output charge of the capacitive sensing element and convert it into a voltage signal. The modulator generates a demodulation signal through the phase adjustment circuit. The demodulator receives the demodulation signal from the phase adjustment circuit and demodulates the output of the charge-to-voltage conversion circuit. The low-pass filter is connected to the output of the demodulator for filtering the demodulated voltage signal to output the read signal.

Abstract: A display may have an array of pixels each of which has a light-emitting diode such as an organic light-emitting diode. A drive transistor and an emission transistor may be coupled in series with the light-emitting diode of each pixel between a positive power supply and a ground power supply. The pixels may include first and second switching transistors. A data storage capacitor may be coupled between a gate and source of the drive transistor in each pixel. Signal lines may be provided in columns of pixels to route signals such as data signals, sensed drive currents from the drive transistors, and predetermined voltages between display driver circuitry and the pixels. The switching transistors, emission transistors, and drive transistors may include semiconducting-oxide transistors and silicon transistors and may be n-channel transistors or p-channel transistors.

Abstract: A circuit board structure includes a circuit substrate having opposing first and second sides, a redistribution structure disposed at the first side, and a dielectric structure disposed at the second side. The circuit substrate includes a first circuit layer disposed at the first side and a second circuit layer disposed at the second side. The redistribution structure is electrically coupled to the circuit substrate and includes a first leveling dielectric layer covering the first circuit layer, a first thin-film dielectric layer disposed on the first leveling dielectric layer and having a material different from the first leveling dielectric layer, and a first redistributive layer disposed on the first thin-film dielectric layer and penetrating through the first thin-film dielectric layer and the first leveling dielectric layer to be in contact with the first circuit layer. The dielectric structure includes a second leveling dielectric layer disposed below the second circuit layer.

Abstract: An HOD device, comprising: a framework; covering material, covering the frame work; at least one conductive region, provided on or in the covering material; wherein the conductive region is coupled to a capacitance detection circuit or a predetermined voltage level. The HOD device can be a vehicle control device such as a steering wheel. The conductive region comprises conductive wires which can be threads of the covering material. By this way, the arrangements of the conductive wires can be changed corresponding to the size or the shape of the frame work or any other requirements. Also, the interference caused by unstable factors can be improved since the conductive wires can be coupled to a ground source of the vehicle to provide a short capacitance sensing path.

Abstract: An embodiment interfacial bonding test structure may include a first substrate having a first planar surface, a second substrate having a second planar surface that is parallel to the first planar surface, a first semiconductor die, and a second semiconductor die, each semiconductor die bonded between the first substrate and the second substrate thereby forming a sandwich structure. The first semiconductor die and the second semiconductor die may be bonded to the first surface with a first adhesive and may be bonded to the second surface with a second adhesive. The first semiconductor die and the second semiconductor die may be displaced from one another by a first separation along a direction parallel to the first planar surface and the second planar surface. The second substrate may include a notch having an area that overlaps with an area of the first separation in a plan view.

Abstract: A radar signal processing system with a self-interference cancelling function includes an analog front end (AFE) processor, an analog to digital converter (ADC), an adaptive interference canceller (AIC), and a digital to analog converter (DAC). The AFE processor receives an original input signal and generates an analog input signal. The ADC converts the analog input signal to a digital input signal. The AIC generates a digital interference signal digital interference signal by performing an adaptive interference cancellation process according to the digital input signal. The DAC converts the digital interference signal to an analog interference signal. Finally, the analog interference signal is fed back to the AFE and cancelled from the original input signal in the AFE processor while performing the front end process, reducing the interference of the static interference from the leaking of a close-by transmitter during the front end process.

Abstract: A method for forming a chip package structure. The method includes bonding first connectors over a front surface of a semiconductor wafer. The method also includes dicing the semiconductor wafer from a rear surface of the semiconductor wafer to form semiconductor dies and mounting first and second semiconductor dies in the semiconductor dies over a top surface of the interposer substrate. The method further forming an encapsulating layer over the top surface of the interposer substrate to cover the first semiconductor die and the second semiconductor die. A first sidewall of the first semiconductor die faces a second sidewall of the second semiconductor die, and upper portions of the first sidewall and the second sidewall have a tapered contour, to define a top die-to-die distance and a bottom die-to-die distance that is less than the top die-to-die distance.

Abstract: An semiconductor package includes a redistribution structure, a first semiconductor device, a second semiconductor device, an underfill layer and an encapsulant. The first semiconductor device is disposed on and electrically connected with the redistribution structure, wherein the first semiconductor device has a first bottom surface, a first top surface and a first side surface connecting with the first bottom surface and the first top surface, the first side surface comprises a first sub-surface and a second sub-surface connected with each other, the first sub-surface is connected with the first bottom surface, and a first obtuse angle is between the first sub-surface and the second sub-surface.

Abstract: A semiconductor package provided herein includes a wiring substrate, a semiconductor component, conductor terminals, a bottom stiffener and a top stiffener. The wiring substrate has a first surface and a second surface opposite to the first surface. The semiconductor component is disposed on the first surface of the wiring substrate. The conductor terminals are disposed on the second surface of the wiring substrate and electrically connected to the semiconductor component through the wiring substrate. The bottom stiffener is disposed on the second surface of the wiring substrate and positioned between the conductor terminals. The top stiffener is disposed on the first surface of the wiring substrate. The top stiffener is laterally spaced further away from the semiconductor component than the bottom stiffener.

Abstract: The disclosure provides an electronic device, including a circuit board, multiple semiconductor components, a first light reflecting structure, and a second light reflecting structure. The circuit board includes a substrate, and the substrate may have a first surface and at least one side surface. The multiple semiconductor components are disposed on the first surface. The first light reflecting structure is disposed on the first surface. The second light reflecting structure is disposed on the first surface and the at least one side surface.

Abstract: A method of orthopedic treatment includes steps of: by using a computer aided design (CAD) tool based on profile data that is related to a to-be-treated part of a bone of a patient, obtaining a model of a preliminary instrument that substantially fits the to-be-treated part; by using the CAD tool, obtaining a model of a patient specific instrument (PSI) based on the model of the preliminary instrument; producing the PSI based on the model of the PSI, the PSI being adjustable; performing medical operation on the to-be-treated part, and then attaching the PSI to the to-be-treated part; after attaching the PSI to the to-be-treated part, adjusting the PSI such that the PSI is adapted to real conditions of the to-be-treated part.

Abstract: A method and system are devised for quickly detecting an abnormal concentration of potassium ions in blood from an electrocardiogram. The system includes at least one vector-converting device that includes a processor, a transmitter, at least one memory and at least one storage unit. The at least one storage includes a model data module and a predicting and converting module. The model data module includes data of a model of the concentration of potassium in the blood. The model of the concentration of potassium in the blood includes at least one reference electrocardiogram and corresponding reference data of the concentration of potassium in the blood. The predicting and converting module converts an electrocardiogram into a corresponding predicted concentration of potassium in the blood according to the reference concentration of potassium in blood. The vector conversions device is connected to at least one electrocardiogram generator and at least one monitor.

Abstract: In a vehicle mobile device mounting assembly and its auxiliary structure, the auxiliary structure is used with a vehicle mounting kit and mounted together on a rod-like portion of a bicycle. The vehicle mounting kit includes a fastening band. The auxiliary structure includes a fastening body, a joining portion integrally formed with the fastening body. The fastening body includes multiple fastening portions on its outer edges and a fastening space in the fastening body. Multiple fastening openings communicating with the fastening space are formed between the fastening portions. The auxiliary structure is mounted on the rod-like portion of the bicycle by inserting the fastening band of the vehicle mounting kit through a joining portion.

Abstract: A protective cover is used for covering and fixing a mobile device selectively fixed to a fastener having a first or second female part. The protective cover includes an elastic protective-cover main body, a first rigid male part and a second rigid male part. The first and second rigid male parts to match first and second female parts of the fastener are selectively engaged with the elastic protective-cover main body. In addition, a protective cover kit is provided to include an elastic protective-cover main body, a rigid male part and a female-part carrier assembly. The female-part carrier assembly includes a universal female part and a female-part carrier. The universal female part, detachably connected with the female-part carrier, is universally used for detachably engaging the first or second connection part of the rigid male part. Thereupon, poor commonality between the male and female parts can be resolved.

Abstract: A protective cover is used for covering and fixing a mobile device selectively fixed to a fastener having a first or second female part. The protective cover includes an elastic protective-cover main body, a first rigid male part and a second rigid male part. The first and second rigid male parts to match first and second female parts of the fastener are selectively engaged with the elastic protective-cover main body. In addition, a protective cover kit is provided to include an elastic protective-cover main body, a rigid male part and a female-part carrier assembly. The female-part carrier assembly includes a universal female part and a female-part carrier. The universal female part, detachably connected with the female-part carrier, is universally used for detachably engaging the first or second connection part of the rigid male part. Thereupon, poor commonality between the male and female parts can be resolved.

Abstract: A strap-type elastic phone-hand connector, for fixedly wrapping a central-lens-type or corner-lens-type mobile device, includes an elastic main body and a fixation structure. The elastic main body includes first and second strap units. The first strap unit, located at a side of the elastic main body, forms two neighboring first accommodation holes. The second strap unit, connecting the first strap unit and located at another side of the elastic main body, forms a central hole and two opposing second accommodation holes. The fixation structure, connecting the elastic main body, is used for defining a penetration space for allowing part of a hand to penetrate through. With the first accommodation hole and the central hole to expose a corner lens assembly and a central lens assembly, this invention can be commonly used for both the corner-lens-type mobile device and the central-lens-type mobile device, respectively, without shading the lens assembly.

Abstract: A strap-type elastic phone-hand connector, for fixedly wrapping a central-lens-type or corner-lens-type mobile device, includes an elastic main body and a fixation structure. The elastic main body includes first and second strap units. The first strap unit, located at a side of the elastic main body, forms two neighboring first accommodation holes. The second strap unit, connecting the first strap unit and located at another side of the elastic main body, forms a central hole and two opposing second accommodation holes. The fixation structure, connecting the elastic main body, is used for defining a penetration space for allowing part of a hand to penetrate through. With the first accommodation hole and the central hole to expose a corner lens assembly and a central lens assembly, this invention can be commonly used for both the corner-lens-type mobile device and the central-lens-type mobile device, respectively, without shading the lens assembly.

Abstract: In a vehicle mobile device mounting assembly and its auxiliary structure, the auxiliary structure is used with a vehicle mounting kit and mounted together on a rod-like portion of a bicycle. The vehicle mounting kit includes a fastening band. The auxiliary structure includes a fastening body, a joining portion integrally formed with the fastening body. The fastening body includes multiple fastening portions on its outer edges and a fastening space in the fastening body. Multiple fastening openings communicating with the fastening space are formed between the fastening portions. The auxiliary structure is mounted on the rod-like portion of the bicycle by inserting the fastening band of the vehicle mounting kit through a joining portion.