Abstract: A semiconductor package structure includes an interposer substrate formed over a package substrate. The structure also includes a die disposed over the interposer substrate. The structure also includes a first heat spreader disposed over the package substrate. The structure also includes a second heat spreader disposed over the die and connected to the first heat spreader. The coefficient of thermal expansion (CTE) of the first heat spreader and the coefficient of thermal expansion of the second heat spreader are different.

Abstract: A semiconductor package structure includes an interposer substrate formed over a package substrate. The structure also includes a die disposed over the interposer substrate. The structure also includes a first heat spreader disposed over the package substrate. The structure also includes a second heat spreader disposed over the die and connected to the first heat spreader. The coefficient of thermal expansion (CTE) of the first heat spreader and the coefficient of thermal expansion of the second heat spreader are different.

Abstract: A method for forming a chip package structure. The method includes bonding first connectors over a front surface of a semiconductor wafer. The method also includes dicing the semiconductor wafer from a rear surface of the semiconductor wafer to form semiconductor dies and mounting first and second semiconductor dies in the semiconductor dies over a top surface of the interposer substrate. The method further forming an encapsulating layer over the top surface of the interposer substrate to cover the first semiconductor die and the second semiconductor die. A first sidewall of the first semiconductor die faces a second sidewall of the second semiconductor die, and upper portions of the first sidewall and the second sidewall have a tapered contour, to define a top die-to-die distance and a bottom die-to-die distance that is less than the top die-to-die distance.

Abstract: An semiconductor package includes a redistribution structure, a first semiconductor device, a second semiconductor device, an underfill layer and an encapsulant. The first semiconductor device is disposed on and electrically connected with the redistribution structure, wherein the first semiconductor device has a first bottom surface, a first top surface and a first side surface connecting with the first bottom surface and the first top surface, the first side surface comprises a first sub-surface and a second sub-surface connected with each other, the first sub-surface is connected with the first bottom surface, and a first obtuse angle is between the first sub-surface and the second sub-surface.

Abstract: A semiconductor package provided herein includes a wiring substrate, a semiconductor component, conductor terminals, a bottom stiffener and a top stiffener. The wiring substrate has a first surface and a second surface opposite to the first surface. The semiconductor component is disposed on the first surface of the wiring substrate. The conductor terminals are disposed on the second surface of the wiring substrate and electrically connected to the semiconductor component through the wiring substrate. The bottom stiffener is disposed on the second surface of the wiring substrate and positioned between the conductor terminals. The top stiffener is disposed on the first surface of the wiring substrate. The top stiffener is laterally spaced further away from the semiconductor component than the bottom stiffener.

Abstract: A interactive product recommendation method is provided, including: selecting a target product from the plurality of products; loading the product information of the target product; generating a product list according to the product characteristics corresponding to the target product and the user preferences corresponding to at least one user; generating a first label list based on at least one product characteristics corresponding to the target product and the user preferences corresponding to the user, where the first label list has a plurality of first labels corresponding to different product features; and displaying the product information, the product list and the first label list in a user interface. When clicking the icon, displaying another user interface corresponding to the clicked icon. When clicking the first label, updating the product list according to the clicked first label.

Abstract: An online cloud-based service processing system, an online evaluation method and a computer program product thereof are provided. The online evaluation method includes: running at least one application service unit of the processing system; executing at least one evaluation registration procedure for at least one application service evaluation unit of the processing system in response to at least one registration request; running the at least one application service evaluation unit; dispatching at least one online service request respectively to the at least one application service unit and the at least one application service evaluation unit, and generating at least one output result corresponding to the at least one online service request; and calculating at least one ranking for each of the at least one application service evaluation unit based on output result(s) generated by the at least one application service evaluation unit among the at least one output result.

Abstract: A interactive product recommendation method is provided, including: selecting a target product from the plurality of products; loading the product information of the target product; generating a product list according to the product characteristics corresponding to the target product and the user preferences corresponding to at least one user, where the product list includes a plurality of icons corresponding to different products; generating a first label list based on at least one product characteristics corresponding to the target product and the user preferences corresponding to the user, where the first label list has a plurality of first labels corresponding to different product features; and displaying the product information, the product list and the first label list in a user interface. When clicking the icon, displaying another user interface corresponding to the clicked icon. When clicking the first label, updating the product list according to the clicked first label.

Abstract: An online cloud-based service processing system, an online evaluation method and a computer program product thereof are provided. The online evaluation method includes: running at least one application service unit of the processing system; executing at least one evaluation registration procedure for at least one application service evaluation unit of the processing system in response to at least one registration request; running the at least one application service evaluation unit; dispatching at least one online service request respectively to the at least one application service unit and the at least one application service evaluation unit, and generating at least one output result corresponding to the at least one online service request; and calculating at least one ranking for each of the at least one application service evaluation unit based on output result(s) generated by the at least one application service evaluation unit among the at least one output result.