Abstract: A semiconductor device and a method of forming the same are provided. The method includes forming a bottom electrode layer over a substrate. A magnetic tunnel junction (MTJ) layers are formed over the bottom electrode layer. A top electrode layer is formed over the MTJ layers. The top electrode layer is patterned. After patterning the top electrode layer, one or more process cycles are performed on the MTJ layers and the bottom electrode layer. A patterned top electrode layer, patterned MTJ layers and a patterned bottom electrode layer form MTJ structures. Each of the one or more process cycles includes performing an etching process on the MTJ layers and the bottom electrode layer for a first duration and performing a magnetic treatment on the MTJ layers and the bottom electrode layer for a second duration.

Abstract: A fabric feature predicting method includes following operations: measuring multiple first fabrics to generate multiple first fabric actual feature value groups; storing the first fabric actual feature value groups and multiple first fabric information groups of the first fabrics; selecting multiple third fabrics from the first fabrics according to a second fabric information group of a second fabric; generating at least one equation according to multiple third fabric actual feature value groups of the third fabrics and multiple third fabric information groups of the third fabrics; generating a second fabric predicted feature value group of the second fabric according to the at least one equation and the second fabric information group. The first fabric actual feature value groups include the third fabric actual feature value groups. The first fabric information groups include the third fabric information groups.

Abstract: A method for determining a plant growth curve includes obtaining color images and depth images of a plant to be detected at different time points, performing alignment processing on each color image and each depth image to obtain an alignment image, detecting the color image through a pre-trained target detection model to obtain a target bounding box, calculating an area ratio of the target bounding box in the color image, determining a depth value of all pixel points in the target boundary frame according to the aligned image, performing denoising processing on each depth value to obtain a target depth value, generating a first growth curve of the plant to be detected according to the target depth values and corresponding time points, and generating a second growth curve of the plant to be detected according to the area ratios and the corresponding time points.

Abstract: Provided herein are encoded microcarriers for analyte detection in multiplex assays. The microcarriers are encoded with an analog code for identification and comprise a capture agent for analyte detection and a substantially transparent magnetic polymer. The analog code is generated by a two-dimensional shape of a substantially non-transparent layer. Also provided are methods of making the encoded microcarriers disclosed herein. Further provided are methods and kits for conducting a multiplex assay using the microcarriers described herein.

Abstract: A method for determining a height of a plant, an electronic device, and a storage medium are disclosed. In the method, a target image is obtained by mapping an obtained color image with an obtained depth image. The electronic device processes the color image by using a pre-trained mobilenet-ssd network, obtains a detection box appearance of the plant, and extracts target contours of the plant to be detected from the detection box. The electronic device determines a depth value of each of pixel points in the target contour according to the target image. Target depth values are obtained by performing a de-noising on depth values of the pixel points, and a height of the plant to be detected is determined according to the target depth value. The method improves accuracy of height determination of a plant.

Abstract: An integrated circuit device includes a device layer having devices spaced in accordance with a predetermined device pitch, a first metal interconnection layer disposed above the device layer and coupled to the device layer, and a second metal interconnection layer disposed above the first metal interconnection layer and coupled to the first metal interconnection layer through a first via layer. The second metal interconnection layer has metal lines spaced in accordance with a predetermined metal line pitch, and a ratio of the predetermined metal line pitch to predetermined device pitch is less than 1.

Abstract: A feedback control numerical machine tool and a method thereof are provided. The machine tool includes at least two spindles, an acoustic frequency detecting module, at least two spindle position detecting modules, and a control module. The spindles machine a workpiece. The acoustic frequency detecting module detects an acoustic frequency of the spindles when machining the workpiece. The spindle position detecting modules detects position information of the spindles when machining the workpiece. The control module acquires the acoustic frequency and the position information of the spindles, monitors whether any of the spindles chatters according to the acoustic frequency of the spindles, and performs chattering avoidance to the spindle that chatters according to the position information of the spindles. As such, the present disclosure performs chattering monitoring to a plurality of spindles and avoids the chattering immediately.

Abstract: A chatter avoidance method and device is provided, including steps of: providing a stable operating condition plot; partially removing a first layer of a workpiece with a predetermined first removal depth according to a safe removal depth of the stable operating condition plot and sensing a chatter caused by the removal operation; if no chatter is sensed, completing the removal operation, otherwise, continuing to partially remove the first layer with a second removal depth less than the predetermined first removal depth; and determining a minimum removal depth according to the removal operation, and removing a last layer of the workpiece with a last removal depth less than or equal to the minimum removal depth, allowing the workpiece to have a target thickness. The disclosure prevents a chatter from continuously occurring without requiring a shut-down and thereby maintains a desired production rate.

Abstract: A chatter avoidance method and device is provided, including steps of: providing a stable operating condition plot; partially removing a first layer of a workpiece with a predetermined first removal depth according to a safe removal depth of the stable operating condition plot and sensing a chatter caused by the removal operation; if no chatter is sensed, completing the removal operation, otherwise, continuing to partially remove the first layer with a second removal depth less than the predetermined first removal depth; and determining a minimum removal depth according to the removal operation, and removing a last layer of the workpiece with a last removal depth less than or equal to the minimum removal depth, allowing the workpiece to have a target thickness. The disclosure prevents a chatter from continuously occurring without requiring a shut-down and thereby maintains a desired production rate.

Abstract: A machining path modification method includes the following steps: analyzing the machining path of a machining program to decide whether any point of the machining path is an avoidant point; obtaining an abnormal point of the machining path; and if the abnormal point exists, modifying the machining program to add an abnormality avoidant path on the avoidant point of the machining path.

Abstract: A feedback control numerical machine tool and a method thereof are provided. The machine tool includes at least two spindles, an acoustic frequency detecting module, at least two spindle position detecting modules, and a control module. The spindles machine a workpiece. The acoustic frequency detecting module detects an acoustic frequency of the spindles when machining the workpiece. The spindle position detecting modules detects position information of the spindles when machining the workpiece. The control module acquires the acoustic frequency and the position information of the spindles, monitors whether any of the spindles chatters according to the acoustic frequency of the spindles, and performs chattering avoidance to the spindle that chatters according to the position information of the spindles. As such, the present disclosure performs chattering monitoring to a plurality of spindles and avoids the chattering immediately.

Abstract: A machine tool design method includes: receiving a finite element model of tool-spindle system including a cutting tool, a working spindle speed range, and a target cutting depth; providing a simplified finite element model of main frames of machine tool and initializing its configuration parameters including an equivalent stiffness and an equivalent mass; combining the simplified finite element model of main frames of machine tool with the finite element model of tool-spindle system to construct an equivalent machine tool model; according to a response of the configuration parameters, proceeding a cutting stability prediction of the equivalent machine tool model, and computing an objective function value based on a predicted result; and determining whether the objective function value meets a preset design requirement, if yes, employing the configuration parameters to be references to design a machine tool, if not, updating the configuration parameters and proceeding the cutting stability prediction again.

Abstract: A rotary positive displacement control system and apparatus includes a transmission assembly, at least a compression assembly and buffer assembly, and an expansion assembly, the buffer assembly disposed between the compression and expansion assembly. The compression assembly includes multiple compression rotors with lobes intermeshing with each other, and the expansion assembly including expansion rotors with lobes intermeshing with each other. An intake and exhaust port respectively located at the compression assembly and expansion assembly. The buffer assembly has a buffer chamber being able to efficiently lead compressed gases to the expansion assembly; meanwhile, residual gases can be discharged from a first and second exhaust slots both disposed on the expansion assembly.