Abstract: A packaging apparatus comprising a foam buffer that provides protection of a computer system component during transit, provides ease of use during pre-packing and packing of the component for transport, does not require the need for additional packing components in combination with the packaging assembly, provides shock and vibration protection during transport, and the foam buffer is configured for ease of manufacture, for reduced manufacturing time and for reduced cost. The foam buffer comprises a foam block formed at least in part from a nonplanar foam extrusion to protect the computer system components during transport. A component socket is provided in the foam block for the reception of the component, and the geometry of the foam surrounding the received computer is configured to provide protection and for ease of manufacture.