Abstract: A semiconductor package includes a substrate, first bumps, a first chip, metal pillars, second bumps and a second chip. The substrate includes first and second conductive pads which are located on a top surface of the substrate. Both ends of the first bumps are connected to the first conductive pads and the first chip, respectively. Both ends of the metal pillars are connected to the second conductive pads and one end of the second bumps, respectively. A cross-sectional area of each of the metal pillars is larger than that of each of the second bumps. The second chip is connected to the other end of the second bumps and located above the first chip.

Abstract: A method for assessing occurrence of heart failure includes the following steps. A heart failure assessment program established is provided. A target ECG signal data of the subject is provided, wherein the target ECG signal data includes a plurality of target heartbeat waveform data and a plurality of target heart rate data. A data pre-processing step is performed, wherein the target ECG signal data is pre-processed by the data processing module so as to obtain a processed target ECG signal data. An analyzing step is performed, wherein the processed target ECG signal data is analyzed by the heart failure assessment program so as to obtain a heart failure occurrence assessing result, and the heart failure occurrence assessing result presents a heart failure occurring condition and the severity of the heart failure of the subject.

Abstract: An electronic system and a security authority delegation method thereof are provided. The electronic system includes a first host device, a second host device, a first security device, and a second security device. The first security device is connected to the first host device. The second security device is connected to the second host device and the first security device. The first security device performs an attestation process on the second security device. If the second security device passes the attestation process, the first security device enables the second security device to verify executable images of the second host device. If the second security device does not pass the attestation process, the first security device disables a function of the second security device, and the function includes verifying the executable image of the second host device.

Abstract: A data security verification method and an electronic apparatus are provided. In the data security verification method, when the electronic apparatus is powered on, a verification circuit verifies integrity of an executable image in a storage device. If verification fails, the verification circuit stops a host processor from executing the executable image. If the verification is successful, the verification circuit releases a host reset, and a processor reads and executes the executable image. When the processor reads the executable image, the verification circuit re-verifies the executable image, and the processor executes the executable image according to a verification result.

Abstract: An electronic device and data transmission protection device thereof are provided. The data transmission protection device includes an input clock signal detector and a control signal generator. The input clock signal detector receives a reference clock signal, and detects a frequency of an input clock signal provided by a host end according to the reference clock signal, and frequencies of the reference clock signal and the input clock signal are different. The control signal generator enables a generated control signal when the frequency of the input clock signal is larger than a safety setting value. The control signal is used to disable the host end to perform a data accessing operation on a protected circuit.

Abstract: The present invention discloses a method and a system of wafer protection of a chemical mechanical process. It takes an image on the polishing pad, and analyzes and identifies the image. If the wafer is out of a polishing head, a signal will be sent to the chemical mechanical polishing station to respond adequately. Otherwise, repeats the image obtaining and its following analysis and identification. The present invention can avoid broken wafers and reduce the station recovery time. Hence, it can increase the up time and the throughput of the station.

Abstract: The present invention discloses a method and a system of wafer protection of a chemical mechanical process. It takes an image on the polishing pad, and analyzes and identifies the image. If the wafer is out of a polishing head, a signal will be sent to the chemical mechanical polishing station to respond adequately. Otherwise, repeats the image obtaining and its following analysis and identification. The present invention can avoid broken wafers and reduce the station recovery time. Hence, it can increase the up time and the throughput of the station.