Patents by Inventor Chin-Ting Wang

Chin-Ting Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11984669
    Abstract: Provided is an antenna module including a first planar inverted-F antenna radiator, a first ground plane, a second ground plane, and a conductor. The first planar inverted-F antenna radiator includes a first feeding terminal and a first ground terminal. The first ground terminal is connected to the first ground plane. The second ground plane is located on one side of the first ground plane. A gap exists between the first ground plane and the second ground plane. The conductor is located between the first ground plane and the second ground plane and connects the first ground plane with the second ground plane.
    Type: Grant
    Filed: July 11, 2022
    Date of Patent: May 14, 2024
    Assignee: PEGATRON CORPORATION
    Inventors: Chin-Ting Huang, Chun-Kai Wang, Hsi-Kai Hung, Sony Chayadi
  • Publication number: 20240134968
    Abstract: An electronic system and a security authority delegation method thereof are provided. The electronic system includes a first host device, a second host device, a first security device, and a second security device. The first security device is connected to the first host device. The second security device is connected to the second host device and the first security device. The first security device performs an attestation process on the second security device. If the second security device passes the attestation process, the first security device enables the second security device to verify executable images of the second host device. If the second security device does not pass the attestation process, the first security device disables a function of the second security device, and the function includes verifying the executable image of the second host device.
    Type: Application
    Filed: December 15, 2022
    Publication date: April 25, 2024
    Applicant: ASPEED Technology Inc.
    Inventors: Chin-Ting Kuo, Chia-Wei Wang, Hung Liu
  • Patent number: 5538554
    Abstract: An apparatus for dispensing ink onto a semiconductor chip in a semiconductor device tester, the apparatus comprising a ring shaped support for attachment to the inside wall of a test head of the semiconductor tester; a pedestal slidably supported on the ring shaped support; vertical, lateral, and angular adjustment mechanisms on the ring shaped support for adjusting the position of the pedestal; locking screws to secure the vertical, lateral and angular adjustments: and a mounting bracket for mounting an ink dispenser on the end of pedestal away from the ring shaped support whereby the ink dispenser can be aligned using the adjusting mechanism to place ink on a semiconductor chip.
    Type: Grant
    Filed: December 27, 1994
    Date of Patent: July 23, 1996
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Chin-Ting Wang, Chia-Pin Liu