Patents by Inventor Chin Wen Wang

Chin Wen Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110192576
    Abstract: A vapor chamber includes a first cover and a second cover covering on the first cover. The first cover has its periphery bent to form a first folded edge, and the second cover has its periphery bent to form a second folded edge. The second folded edge is superposed on the first folded edge. The first folded edge is bent to cover the second folded edge. A wick structure is arranged inside the first cover and the second cover. A working fluid is filled between the first cover and the second cover. By this structure, the tightness of the sealing edges of the vapor chamber is enhanced. The production yield of the vapor chamber is increased and the production cost is reduced.
    Type: Application
    Filed: December 29, 2010
    Publication date: August 11, 2011
    Inventor: Chin-Wen WANG
  • Publication number: 20110192004
    Abstract: A method for sealing edges of a vapor chamber includes steps of: providing a first cover and a second cover, the first cover having its periphery bent to form a first folded edge, the second cover having its periphery bent to form a second folded edge; providing a supporting structure and a wick structure between the first cover and the second cover; covering the second cover on the first cover with the second folded edge being superposed on the first folded edge; bending the first folded edge to cover on the second folded edge; and providing a pressing die to press the first folded edge, thereby tightly connecting the first folded edge to the second folded edge. In this way, excellent tightness of sealing edges of the vapor chamber is achieved. Further, the production yield of the vapor chamber is increased with a reduced cost.
    Type: Application
    Filed: December 29, 2010
    Publication date: August 11, 2011
    Inventor: Chin-Wen WANG
  • Patent number: 7770631
    Abstract: A supporting body within an isothermal plate includes a flat plate having two surfaces, and a plurality of bosses and pits arranged on both surfaces of the plate. The plate is provided thereon with a plurality of through holes. The though holes are located between the bosses and pits respectively. A portion of the bosses and pits protrudes from one surface of the plate, and the other portion thereof protrudes from the other surface of the plate.
    Type: Grant
    Filed: March 19, 2008
    Date of Patent: August 10, 2010
    Assignees: Hyper-Green Industrial Co., Ltd.
    Inventor: Chin-Wen Wang
  • Patent number: 7610947
    Abstract: A heat-dissipating model includes a heat-conducting member and a heat-dissipating body. The heat-conducting member has a hollow cylinder with a closed end. The interior of the wall of the cylinder is formed with a vacuum chamber. The vacuum chamber is provided with a capillary structure and a working fluid therein. The heat-dissipating body has a through hole for connecting to the outer periphery of the heat-conducting member. Further, the periphery of the heat-dissipating body is provided with a plurality of heat-dissipating fins. With the above arrangement, the heat generated by the heat source can be dissipated to a far place, so that it can be continuously operated at a lower temperature. As a result, the effect of heat conduction or dissipation can be improved and the life is extended.
    Type: Grant
    Filed: July 24, 2006
    Date of Patent: November 3, 2009
    Assignee: Pyroswift Holding Co., Limited
    Inventors: Chin-Wen Wang, Ching-Chung Wang, Pei-Choa Wang
  • Publication number: 20090236085
    Abstract: A supporting body within an isothermal plate includes a flat plate having two surfaces, and a plurality of bosses and pits arranged on both surfaces of the plate. The plate is provided thereon with a plurality of through holes. The though holes are located between the bosses and pits respectively. A portion of the bosses and pits protrudes from one surface of the plate, and the other portion thereof protrudes from the other surface of the plate.
    Type: Application
    Filed: March 19, 2008
    Publication date: September 24, 2009
    Inventor: Chin-Wen Wang
  • Publication number: 20090178784
    Abstract: A manufacturing method of a isothermal vapor chamber and a product thereof are to use an integrated manner to form an orifice directly on a plate body of a isothermal vapor chamber. Through the orifice, the operations of injecting working fluid and degassing or vacuating can be proceeded. The orifice is functionally similar to a degassing tube or a vacuating tube of the prior arts. However, since the orifice is integrated on the plate body of the isothermal vapor chamber body, it can be pressed to seal the isothermal vapor chamber after an operation of degassing. Therefore, the vacuity in the isothermal vapor chamber and the stored amount of the working fluid, and it is easier for manufacture.
    Type: Application
    Filed: January 15, 2008
    Publication date: July 16, 2009
    Inventor: Chin-Wen WANG
  • Publication number: 20080089070
    Abstract: An exemplary LED lamp module includes an LED lamp, a fixed base, and a plurality of elastic member. The LED lamp includes a base and an LED module. The base includes a plurality of connecting portions, and the fixed base includes a plate and a plurality of fixed poles corresponding to the connecting portions so as to form a space therebetween for accommodating the LED lamp. Each of the fixed poles includes a plurality of locating grooves. One end of each of the elastic member is connected to the connecting portions of the base, and the other end of each of the elastic member is adjustably fixed to the locating grooves of the fixed poles. The illuminating angle of the LED module may be conveniently adjusted according to different height of the lamp post and the different of the angles between the LED lamp modules relative to the ground.
    Type: Application
    Filed: October 12, 2006
    Publication date: April 17, 2008
    Inventor: Chin-Wen Wang
  • Publication number: 20080089071
    Abstract: An LED lamp structure with adjustable projection angle includes an aluminum extrusion lamp housing, an LED module, and a rotating rack. The lamp housing has a base, a plurality of heat sinks extended from the base, and a receiving portion formed on an external side of the base. The LED module includes a fixing base, a lampshade on a side of the fixing base, and a plurality of LED lamps in the lampshade, and the fixing base is coupled in the base of the lamp housing. The rotating rack has a hollow cylindrical body, a fixing board extended from a side of the cylindrical body, and a connecting portion formed on the fixing board and connected to the corresponding receiving portion, so that the projection angle of the LED module can be adjusted according to the illumination requirements for different positions and provide the light required for the illumination area.
    Type: Application
    Filed: October 12, 2006
    Publication date: April 17, 2008
    Inventor: Chin-Wen Wang
  • Publication number: 20080080188
    Abstract: A modulized assembly for a large-sized LED lamp includes a shell, a cover, a light-transmitting mirror and a plurality of LED modules. The interior of the shell is formed with a separation plate. The separation plate is provided with a plurality of through troughs thereon. The cover is covered and connected above the shell, and formed with venting troughs in communication with the outside air thereon. Further, the light-transmitting mirror is sealed and connected to the underside of the shell. The LED module includes a plate body and a LED lamp set connected to the plate body. The plate body is correspondingly sealed and connected to individual trough troughs of the separation plate. Among the shell, the light-transmitting mirror and the plate body, a sealed space is enclosed. The LED lamp set is accommodated in the sealed space and illuminates toward the light-transmitting mirror. With the above arrangement, the assembling process between each LED module and the associated shell becomes much easier.
    Type: Application
    Filed: September 29, 2006
    Publication date: April 3, 2008
    Inventor: Chin-Wen Wang
  • Publication number: 20080043472
    Abstract: An LED lamp having a heat dissipating structure for dissipating the heat of the LED lamp includes a lamp casing, an LED lamp module, an isothermal board and a heat pipe. The lamp casing has an opening, and the LED lamp module is fixed to a side of the opening of the lamp casing and includes a circuit board and a plurality of LED fixed on a plane of a circuit board, and another plane of the circuit board is attached on the isothermal board, and a circular groove is formed on the isothermal board. The heat pipe has a heat receiving end attached onto an internal surface of the groove of the isothermal board, so as to significantly enhance the heat conducting and dissipating effect and omit the manufacturing process of flattening a portion of the heat pipe to lower the manufacturing cost.
    Type: Application
    Filed: August 17, 2006
    Publication date: February 21, 2008
    Inventor: Chin-Wen Wang
  • Publication number: 20080019129
    Abstract: In an LED lamp illumination projecting structure, an LED lamp includes a casing, an LED lamp set and a light transmitting lens. The casing has an LED lamp set with a base board mounted in the casing and several LED lamp connected to the base board, and the light transmitting lens is installed in the light projecting direction of the LED lamp set and sealed onto a side of the casing, and several pits arranged with an interval apart and formed on the internal surface at a position corresponding to the projected position of each LED lamp for collecting and emitting the light of each LED lamp through the pit, so as to provide a better directionality of the light of the LED lamp and an evener brightness for a projecting area.
    Type: Application
    Filed: July 24, 2006
    Publication date: January 24, 2008
    Inventor: Chin-Wen Wang
  • Publication number: 20080001059
    Abstract: A solar energy current collection mechanism with a timer and its structure includes a light collector, a retaining base and a base body. The light collector includes a base, a solar panel at the top of the base, a conical light collecting hood around the periphery of the base, a plurality of supporting stands around the light collecting hood and an axle passing though the light collecting hood. The retaining base is disposed under the light collector, and both ends of the retaining base are connected to both ends of the axle. The retaining base includes the timer connected to the axle for driving the light collector to rotate, and the retaining base is disposed on a base body, and the base body includes a control unit and a battery unit electrically connected to a solar panel for controlling and storing the electric power produced by the solar panel.
    Type: Application
    Filed: June 29, 2006
    Publication date: January 3, 2008
    Inventor: Chin-Wen Wang
  • Publication number: 20070079954
    Abstract: A heat-dissipating model includes a heat-conducting member and a heat-dissipating body. The heat-conducting member has a hollow cylinder with a closed end. The interior of the wall of the cylinder is formed with a vacuum chamber. The vacuum chamber is provided with a capillary structure and a working fluid therein. The heat-dissipating body has a through hole for connecting to the outer periphery of the heat-conducting member. Further, the periphery of the heat-dissipating body is provided with a plurality of heat-dissipating fins. With the above arrangement, the heat generated by the heat source can be dissipated to a far place, so that it can be continuously operated at a lower temperature. As a result, the effect of heat conduction or dissipation can be improved and the life is extended.
    Type: Application
    Filed: July 24, 2006
    Publication date: April 12, 2007
    Inventors: Chin-Wen Wang, Ching-Chung Wang, Pei-Choa Wang
  • Publication number: 20070022773
    Abstract: A cooling energy saving structure, capable of connecting to a PCB multi-axial driller, includes a chiller, a freezing dryer, and a thermal superconductive recycling device, where the chiller has a liquid outward piping and a liquid inward piping, the freezing dryer has a gas outward piping and a gas inward piping, and the thermal superconductive recycling device accommodates the liquid inward piping of the chiller and the gas outward piping of the dryer. The device further features cooling the liquid in the inward piping before it flows back to the chiller, and heating the gas in the outward piping before it is discharged. The heat exchange performed between the flow back liquid of the chiller and the discharged gas of the dryer takes advantage of the device, which proves to have substantially cut down energy consumption and power expenditure for a very effective use of energy resources.
    Type: Application
    Filed: April 17, 2006
    Publication date: February 1, 2007
    Inventors: Chin-Wen Wang, Ching-Chung Wang, Pei-Choa Wang
  • Publication number: 20060290891
    Abstract: A device for cooling a light emitting diode projector includes a first cooling unit that includes a hollow portion. One end of the hollow portion includes a third cooling body and a reflection cover. The light emitting unit is adhered to one surface of the third cooling body, while the light source is projected corresponding to the reflection cover. A connection unit is disposed on the other end of the hollow portion, which can convey power source to the light emitting unit. The heat generated from the light emitting unit is directly absorbed into the third cooling body, and is transferred to the first cooling unit for performing heat exchange. The light emitting diode projector can thus obtain a better cooling effect.
    Type: Application
    Filed: June 23, 2005
    Publication date: December 28, 2006
    Inventors: Chin-Wen Wang, Ching-Chung Wang, Pei-Choa Wang
  • Patent number: 7032652
    Abstract: A heat conductive plate includes a hollow case and a plurality of grooves respectively formed on the inner top wall and the inner bottom wall of the case. In addition, a plurality of supporting members are positioned in the case by way of powder sintering, wherein each surface of the supporting members has a porous wick structure formed thereon. Thus, the case can be sustained by the supports with each wick structure firmly mounted in the grooves of the inner walls thereof. When performing heat transferring, the working fluid is heated to be formed as vapor by the electronic element mounted on the outer bottom surface so as to flow toward the inner top surface of the case. The working fluid is then cooled to be liquid again to be absorbed by the wick structures of the supporting members and be transported toward the inner bottom of the case.
    Type: Grant
    Filed: July 6, 2004
    Date of Patent: April 25, 2006
    Assignee: Augux Co., Ltd.
    Inventors: Chin Wen Wang, Pei Choa Wang, Ching Chung Wang
  • Patent number: 7025124
    Abstract: An improved supporting structure for a planar heat pipe, having a housing and a supporting member installed in the shell is disclosed. The housing has an upper lid and a lower lid engaged with each other to form a hollow chamber therein. The hollow chamber is filled with a working fluid. The supporting member is a planar member perforated with a plurality of holes. The supporting member is sintered with the upper and lower lids in the hollow chamber. Therefore, the housing and the supporting member are integrated together.
    Type: Grant
    Filed: October 24, 2003
    Date of Patent: April 11, 2006
    Inventors: Chin Wen Wang, Pei Choa Wang, Ching Chung Wang
  • Patent number: 6913070
    Abstract: An improved structure of a planar heat pipe, having a top lid and a bottom lid. The bottom lid can be engaged with the top lid. A wick structure and a working fluid are installed in the heat pipe. The top lid has a top panel, which has a central flat area and a plurality of independent heat dissipating fins spirally arranged around the flat area. Each of the heat dissipating fins has a cone shape, and the height of the heat dissipating fins gradually increases from the center to the periphery of the top lid. A spiral heat circulating path is thus formed on the top lid. Thereby, when the cooling fan generates cooling air flow downwardly, an air impingement is formed upon the flat region of the top lid. The heat accumulated in the central flat region is then dissipated by the heat dissipating fins with an enhanced efficiency.
    Type: Grant
    Filed: September 3, 2003
    Date of Patent: July 5, 2005
    Inventors: Chin Wen Wang, Pei Choa Wang, Ching Chung Wang
  • Patent number: 6782942
    Abstract: A tabular heat pipe structure with support bodies has a housing, working fluid received in the housing and support bodies. The top and bottom faces of the support bodies are zigzag faces having a plurality of contact points. The support bodies use these contact points to adhere to the housing by means of welding. The tabular heat pipe structure is uniform and intact, has a high rigidity, will not cave in and deform due to back pressure in the heat pipe, and will not let the housing separate from the support bodies because of expansion at high temperatures. Therefore, the tabular heat pipe structure has the advantages like a better heat-conducting characteristic, a smaller contact heat resistance, a simple processing procedure, a quick manufacturing speed, a lower cost, and a simple and stable operation of flat adhesion.
    Type: Grant
    Filed: May 1, 2003
    Date of Patent: August 31, 2004
    Inventors: Chin-Wen Wang, Ching Chung Wang, Pei-Choa Wang
  • Patent number: 6702002
    Abstract: The present invention provides a hydronic pump type heat radiator, which comprises an outer ring heat spreader, a plurality of outer heat-radiating fins, a plurality of inner heat-radiating fins, a cavity, and a pump. The outer ring heat spreader has an annular wall. The inside of the annular wall has a receiving space. The outer heat-radiating fins are disposed outside the outer ring heat spreader. The inner heat-radiating fins are disposed inside the receiving space of the outer ring heat spreader. The cavity is disposed between the inner heat-radiating fins and the outer ring heat spreader. The cavity is used to receive cooling liquid therein. The pump is properly connected to the cavity, and can drive the cooling liquid in the cavity to make circulative flow so as to quickly transfer heat source and have the heat-radiating function of compulsory flow of liquid.
    Type: Grant
    Filed: June 3, 2002
    Date of Patent: March 9, 2004
    Inventor: Chin-Wen Wang