Abstract: A method for forming a package structure is provided. The method includes disposing a semiconductor die over a carrier substrate, wherein a removable film is formed over the semiconductor die, disposing a first stacked die package structure over the carrier substrate, wherein a top surface of the removable film is higher than a top surface of the first stacked die package structure, and removing the removable film to expose a top surface of the semiconductor die, wherein a top surface of the semiconductor die is lower than the top surface of the first stacked die package structure.

Abstract: An semiconductor package includes a redistribution structure, a first semiconductor device, a second semiconductor device, an underfill layer and an encapsulant. The first semiconductor device is disposed on and electrically connected with the redistribution structure, wherein the first semiconductor device has a first bottom surface, a first top surface and a first side surface connecting with the first bottom surface and the first top surface, the first side surface comprises a first sub-surface and a second sub-surface connected with each other, the first sub-surface is connected with the first bottom surface, and a first obtuse angle is between the first sub-surface and the second sub-surface.

Abstract: A method for forming a package structure is provided, including forming an interconnect structure over a carrier substrate and forming a semiconductor die over a first side of the interconnect structure. A removable film is formed over the semiconductor die. The method includes forming a first stacked die package structure over the first side of the interconnect structure. A top surface of the removable film is higher than a top surface of the first stacked die package structure. The method includes forming a package layer, removing a portion of the package layer to expose a portion of the removable film, removing the removable film to form a recess, forming a lid structure over the semiconductor die and the first stacked die package structure. The lid structure has a main portion and a protruding portion disposed in the recess and extending from the main portion.

Abstract: A droplet-generating device is provided. The droplet-generating device comprises a first microchannel and a second microchannel. The first microchannel includes a first fluid inlet and a second fluid inlet. The second microchannel crossing over and communicating with the first microchannel at an intersectional region includes a third fluid inlet, a fourth fluid inlet, a fluid outlet, a three-way junction and a side wall. The intersectional region is configured between the third fluid inlet and the three-way junction, and the side wall is disposed between the fourth fluid inlet and the fluid outlet and extended downward. A method of producing a droplet is also provided.

Abstract: A droplet-generating device is provided. The droplet-generating device comprises a first microchannel and a second microchannel. The first microchannel includes a first fluid inlet and a second fluid inlet. The second microchannel crossing over and communicating with the first microchannel at an intersectional region includes a third fluid inlet, a fourth fluid inlet, a fluid outlet, a three-way junction and a side wall. The intersectional region is configured between the third fluid inlet and the three-way junction, and the side wall is disposed between the fourth fluid inlet and the fluid outlet and extended downward. A method of producing a droplet is also provided.