Patents by Inventor Chin-Yu Chen

Chin-Yu Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180109019
    Abstract: A card connector includes: an insulative housing (2) for receiving a card tray inserted in a front-to-back direction; and plural contacts (31) secured to the insulative housing, each contact including a frame portion (311), a curved portion connected inside the frame portion, and a tail portion (312) connected outside the frame portion, the curved portion including a first anchoring portion (315) and a second anchoring portion (315) respectively connected to the frame portion, a first arm (313) and a second arm (314) respectively continuing the first and second anchoring portions, a front connecting portion (317) and a rear connecting portion (318) respectively connected to the first and second arms, and a contacting portion (316) connected between the front and rear connecting portions.
    Type: Application
    Filed: October 18, 2017
    Publication date: April 19, 2018
    Inventor: CHIN-YU CHEN
  • Patent number: 9893483
    Abstract: A card connector assembly includes: an electrical connector including an insulative housing, plural terminals secured to the insulative housing, and a shell covering the insulative housing to form a receiving cavity; and a card tray removably received in the receiving cavity, the card tray including an insulative frame and a metallic plate, the metallic plate has a recessed portion for engaging the electrical connector and an opening bordering the recessed portion.
    Type: Grant
    Filed: January 12, 2017
    Date of Patent: February 13, 2018
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Chin-Yu Chen, Shun-Jung Chuang
  • Patent number: 9819105
    Abstract: A card connector assembly includes: an electrical connector for being mounted behind an opening in a housing of an electronic device, the electrical connector including a cam groove, a slider, a biasing member, and a cam bar coupled between the cam groove and the slider; and a card tray insertable into the electrical connector through the housing opening for moving the slider from the ejected position to the inserted position; wherein the cam bar has a push portion; the card tray includes a latch, the latch being adapted to be stopped by the electronic device housing when the slider is at the inserted position; and when pushing the card tray to move the slider from the inserted position to the ejected position, the push portion of the cam bar releases the latch for the slider together with the card tray to move to the ejected position.
    Type: Grant
    Filed: January 18, 2017
    Date of Patent: November 14, 2017
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Chin-Yu Chen, Hendrikus P. G. Van der Steen
  • Publication number: 20170317182
    Abstract: A semiconductor device and method of manufacturing same are described. A first hafnium oxide (HfO2) layer is formed on a substrate. A titanium (Ti) layer is formed over the first hafnium oxide layer. A second hafnium oxide layer is formed over the titanium layer. The composite device structure is thermally annealed to produce a high-k dielectric structure having a hafnium titanium oxide (HfxTi1-xO2) layer interposed between the first hafnium oxide layer and the second hafnium oxide layer.
    Type: Application
    Filed: September 1, 2016
    Publication date: November 2, 2017
    Inventors: I-Chen Huang, Yi-Ju Hsu, Chi-Wen Liu, Kuang-Hsin Chen, Yung-Hsien Wu, Chin-Yu Chen
  • Publication number: 20170302037
    Abstract: An electrical connector includes: an insulative housing comprising a base portion defining a rearward surface and a tongue portion extending forwardly from the base portion; plural conductive terminals affixed to the insulative housing and each having a contacting portion exposed to the top and bottom surfaces of the tongue portion, a fixing portion embedded in the base portion, and a soldering portion extending backwardly out of the base portion; a shielding plate affixed to the insulative housing; a shielding shell covering the insulative housing and defining a sol space with the rearward surface of the base portion; and a waterproof sheet; wherein the base portion further comprises a stepped portion in the sol space, the waterproof sheet is formed by solidification of liquid insulative material flowing from the stepped portion to the rearward surface, and the waterproof sheet encloses the stepped portion.
    Type: Application
    Filed: April 18, 2017
    Publication date: October 19, 2017
    Inventors: TAO YAO, Hendrikus P.G. Van der Steen, CHIN-YU CHEN
  • Publication number: 20170207591
    Abstract: A card connector assembly includes: an electrical connector including an insulative housing, plural terminals secured to the insulative housing, and a shell covering the insulative housing to form a receiving cavity; and a card tray removably received in the receiving cavity, the card tray including an insulative frame and a metallic plate, the metallic plate has a recessed portion for engaging the electrical connector and an opening bordering the recessed portion.
    Type: Application
    Filed: January 12, 2017
    Publication date: July 20, 2017
    Inventors: CHIN-YU CHEN, SHUN-JUNG CHUANG
  • Publication number: 20170207558
    Abstract: A card connector assembly includes: an electrical connector for being mounted behind an opening in a housing of an electronic device, the electrical connector including a cam groove, a slider, a biasing member, and a cam bar coupled between the cam groove and the slider; and a card tray insertable into the electrical connector through the housing opening for moving the slider from the ejected position to the inserted position; wherein the cam bar has a push portion; the card tray includes a latch, the latch being adapted to be stopped by the electronic device housing when the slider is at the inserted position; and when pushing the card tray to move the slider from the inserted position to the ejected position, the push portion of the cam bar releases the latch for the slider together with the card tray to move to the ejected position.
    Type: Application
    Filed: January 18, 2017
    Publication date: July 20, 2017
    Inventors: CHIN-YU CHEN, Hendrikus P.G. Van der Steen
  • Patent number: 9685735
    Abstract: An electrical connector includes a module and a shell enclosing the module. The module includes an insulative housing and a number of terminals affixed to the insulative housing, the insulative housing having a base portion and a tongue portion extending forwardly from the base portion, each terminal having a contact portion exposed on the tongue portion. The shell defines a mating port at a front portion thereof for mating with a mating connector, and a card receiving cavity at a rear portion thereof for loading a card.
    Type: Grant
    Filed: April 12, 2016
    Date of Patent: June 20, 2017
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Chin-Yu Chen, Tien-Chieh Su
  • Publication number: 20170061447
    Abstract: A marketing system of collecting and exchanging point includes a server side device, a plurality of shop side devices, and a plurality of consumption side devices. The server side device stores shop accounts, information of collecting and exchanging point, customer accounts, and customer point information. Each shop side device is respectively corresponding to one shop account. Each consumption side device is respectively corresponding to one customer account. Each consumption side device respectively has a point collecting module and a point exchanging module for executing a point collecting action and a point exchanging action. The server side device gathers and computes exchangeable points being collected and exchanged with regard to a plurality of the shop accounts. The exchangeable points of the customer account are divided into a plurality of exchangeable points specialized for each of the shop accounts.
    Type: Application
    Filed: August 27, 2015
    Publication date: March 2, 2017
    Inventors: Fu-Kuang Wang, Hsiang-Chun Tseng, Li-Hua Huang, Chih-Chang Lin, Chin-Yu Chen
  • Patent number: 9330670
    Abstract: A computing device provides a resonance algorithm to process digital signal data according to a principle of physical resonance. The resonance algorithm determines a division length n of digital signal data according to a frequency f1 of an audio signal to be detected and a sampling frequency f2, which is used for sampling the digital signal data by a coder. Furthermore, the resonance algorithm divides the digital signal data into a serial of data segments by the division length n, and obtains enhanced digital signal data by accumulating a number m of the data segments.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: May 3, 2016
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Ching-Wei Ho, Mu-San Chung, Chun-Hsien Lin, Che-Yi Chu, Chin-Yu Chen, Min-Bing Shia
  • Patent number: 9293354
    Abstract: A calibration wafer may bear one or more different mark types to facilitate inspection of a lithography process. A first mark type may be located on the outer peripheral portion of the wafer to indicate the desired boundary of an edge bead removal (EBR) region. A second mark type may be located on an outer peripheral portion of the wafer to indicate the desired boundary of a wafer edge expose region (WEE). A third mark type may indicate the border of a portion of the wafer expected to bear a wafer identification mark. A fourth mark type may be located at the center of the wafer to allow for precise and uniform application of liquid photoresist material to the calibration wafer. The calibration wafer may be employed in methods of rapidly and easily assessing the accuracy of various phases of photolithography processes.
    Type: Grant
    Filed: September 27, 2010
    Date of Patent: March 22, 2016
    Assignee: Semiconductor Manufacturing International (Shanghai) Corporation
    Inventors: Sai Hung Lam, Wei Zhu, Chin Yu Chen
  • Patent number: 9249465
    Abstract: Molecular markers for lung and colorectal carcinomas and methods of using them in blood sample assays are disclosed. The method comprises measuring the expression of the markers in a blood sample from a subject for detecting the presence and/or severity of lung and/or colorectal cancer, and for monitoring and/or assessing the prognosis of the subject's response to a cancer therapy. Also disclosed are kits for detecting, diagnosing, and/or monitoring lung or colorectal carcinomas.
    Type: Grant
    Filed: August 28, 2009
    Date of Patent: February 2, 2016
    Assignee: Advpharma, Inc.
    Inventors: Harn-Jing Terng, Woan-Jen Lee, Chin-Yu Chen
  • Patent number: 9184531
    Abstract: A receptacle connector is provided and includes an insulating case, a securing device and a cover. The insulating casing includes a plurality of terminal receiving passageways, a plug receiving space, a pair of protrusions on two sides of the plug receiving space. A securing device receiving space is disposed on one of the two sides. The securing device includes a horizontal portion, a first vertical portion and a second vertical portion extending downward from the horizontal portion, a first soldering portion extending horizontally from the first vertical portion, a second soldering portion extending horizontally from the second vertical portion. An engagement portion is positioned between the first vertical portion and the second vertical portion. The cover is pivotally connected to the insulating casing and includes a first protrusion receiving passageway and a second protrusion receiving passageway which communicate with each other and correspond in position with the pair of protrusions.
    Type: Grant
    Filed: November 16, 2012
    Date of Patent: November 10, 2015
    Assignee: Tyco Electronics Holdings (Bermuda) No. 7 Ltd.
    Inventor: Chin Yu Chen
  • Publication number: 20140067382
    Abstract: In a method for detecting an event occurred in a monitoring area, the method defines a reference characteristic parameter for a specific event, and stores the reference characteristic parameter in a storage device of the computing device. The method further obtains a voice stream of the specific event from an IP camera through a wireless network in real time, and extracts a characteristic parameter from the voice stream using a predefined algorithm. The method compares the extracted characteristic parameter with the reference characteristic parameter, and determines that the specific event occurs in the monitoring area if the extracted characteristic parameter accords with the reference characteristic parameter.
    Type: Application
    Filed: February 27, 2013
    Publication date: March 6, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: CHING-WEI HO, MU-SAN CHUNG, CHUN-HSIEN LIN, CHE-YI CHU, CHIN-YU CHEN, MIN-BING SHIA
  • Publication number: 20140032225
    Abstract: A computing device provides a resonance algorithm to process digital signal data according to a principle of physical resonance. The resonance algorithm determines a division length n of digital signal data according to a frequency f1 of an audio signal to be detected and a sampling frequency f2, which is used for sampling the digital signal data by a coder. Furthermore, the resonance algorithm divides the digital signal data into a serial of data segments by the division length n, and obtains enhanced digital signal data by accumulating a number m of the data segments.
    Type: Application
    Filed: June 28, 2013
    Publication date: January 30, 2014
    Inventors: CHING-WEI HO, MU-SAN CHUNG, CHUN-HSIEN LIN, CHE-YI CHU, CHIN-YU CHEN, MIN-BING SHIA
  • Patent number: 8444428
    Abstract: A card-edge connector is provided for securing and electrically connecting an electronic card to a circuit board. The card-edge connector includes an insulating housing a pair of arms, and a pair of card-latching members. The insulating housing includes a receiving wall defining a slot there within. Each arm extends from ends of the receiving wall. A supporting base is disposed on and extending along a first side of each arm, and a guiding rail disposed on a second side of each arm. Furthermore, a fastener receiving passageway is disposed on each of an upper surface and a lower surface of each of the pair of arms.
    Type: Grant
    Filed: November 22, 2011
    Date of Patent: May 21, 2013
    Assignee: Tyco Electronics Holding (Bermuda) No. 7 Limited
    Inventor: Chin Yu Chen
  • Publication number: 20130098548
    Abstract: A lamination method of optical substrates, particularly a method of laminating two optical substrates by an optical curable resin (OCR), includes the steps of: coating a layer of liquid adhesive onto a first optical substrate through ultraviolet projection and curing, and the liquid adhesive is mixed with bead particles; stacking the first optical substrate with a second optical substrate, such that each particle is separated between the first and second optical substrates; and projecting an ultraviolet light onto the first and second optical substrates to cure the liquid adhesive, so that the particles between the first and second optical substrates are separated with gaps of an equal height to improve the lamination efficiency and quality of the optical substrates.
    Type: Application
    Filed: October 20, 2011
    Publication date: April 25, 2013
    Inventor: CHIN-YU CHEN
  • Publication number: 20130101827
    Abstract: In an optical curable resin (OCR) composite for laminating optical substrates and a method of using the OCR composite to laminating two optical substrates, the OCR composite is formed by projecting an ultraviolet light to cure a liquid adhesive containing a plurality of bead-shaped elastic particles, and the method includes the steps of coating the liquid adhesive onto a first optical substrate, stacking the first optical substrate to a second optical substrate, such that each particle is separated between the first and second optical substrates, and projecting the ultraviolet light onto the first and second optical substrate again to cure the liquid adhesive, so that the particles are separated to form a gap with equal heights between the first and second optical substrates to enhance the lamination efficiency and quality of the optical substrates.
    Type: Application
    Filed: October 20, 2011
    Publication date: April 25, 2013
    Inventor: CHIN-YU CHEN
  • Publication number: 20120129377
    Abstract: A card-edge connector is provided for securing and electrically connecting an electronic card to a circuit board. The card-edge connector includes an insulating housing a pair of arms, and a pair of card-latching members. The insulating housing includes a receiving wall defining a slot there within. Each arm extends from ends of the receiving wall. A supporting base is disposed on and extending along a first side of each arm, and a guiding rail disposed on a second side of each arm. Furthermore, a fastener receiving passageway is disposed on each of an upper surface and a lower surface of each of the pair of arms.
    Type: Application
    Filed: November 22, 2011
    Publication date: May 24, 2012
    Inventor: Chin Yu Chen
  • Publication number: 20110279797
    Abstract: A calibration wafer may bear one or more different mark types to facilitate inspection of a lithography process. A first mark type may be located on the outer peripheral portion of the wafer to indicate the desired boundary of an edge bead removal (EBR) region. A second mark type may be located on an outer peripheral portion of the wafer to indicate the desired boundary of a wafer edge expose region (WEE). A third mark type may indicate the border of a portion of the wafer expected to bear a wafer identification mark. A fourth mark type may be located at the center of the wafer to allow for precise and uniform application of liquid photoresist material to the calibration wafer. The calibration wafer may be employed in methods of rapidly and easily assessing the accuracy of various phases of photolithography processes.
    Type: Application
    Filed: September 27, 2010
    Publication date: November 17, 2011
    Applicant: Semiconductor Manufacturing International (Shanghai) Corporation
    Inventors: CHUN CHI CHEN, Sai Hung Lam, Wei Zhu, Chin Yu Chen