Patents by Inventor Ching-Bai Huang

Ching-Bai Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipating device with metal foam
    Publication number: 20060137862
    Abstract: A heat dissipating device for removing heat from a heat-generating electronic component includes at least one heat transfer device and metal foams combined to the heat transfer device. The heat transfer device may be a heat pipe. The heat generated by the electronic component is transferred to the metal foams through the heat transfer device. The metal foams are used for dissipating the heat to atmosphere.
    Type: Application
    Filed: June 24, 2005
    Publication date: June 29, 2006
    Applicant: Foxconn Technology CO., LTD.
    Inventors: Ching-Bai Huang, Xi-Jian Zhu