Patents by Inventor Ching-Chang Chien
Ching-Chang Chien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10562218Abstract: The present disclosure provides a method for operating a molding system. The molding system includes a molding machine and a mold disposed on the molding machine, wherein the mold has a mold cavity for being filled with a molding material from the molding machine. The method comprises a step of obtaining a predetermined state waveform expressing a predetermined volumetric variation of the molding material. Next, the method further comprises obtaining a measured pressure and a measured temperature of the molding material in the mold cavity while performing a molding process for filling the molding material into the mold cavity. Next, the method includes obtaining a detected volumetric property of the molding material corresponding to the measured pressure and the measured temperature. Subsequently, the method comprises displaying the detected volumetric property of the molding material with the predetermined state waveform.Type: GrantFiled: August 6, 2018Date of Patent: February 18, 2020Assignee: CORETECH SYSTEM CO., LTD.Inventors: Yuing Chang, Rong-Yeu Chang, Chia-Hsiang Hsu, Chuan-Wei Chang, Ching-Chang Chien
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Patent number: 10384386Abstract: The present disclosure provides a method for setting up a molding system, wherein the molding system includes a molding machine and a mold disposed on the molding machine, and the mold has a mold cavity to be filled with a molding resin from the molding machine. The method includes generating first and second state waveforms using a predetermined packing pressure profile; obtaining an updated packing pressure profile based on the first and the second state waveforms; and setting up the molding machine based on the updated packing pressure profile to perform an actual molding process to prepare the molding product. The first and the second state waveforms express a relationship between an in-mold pressure and an in-mold temperature at different sensing sites of the molding resin.Type: GrantFiled: June 18, 2018Date of Patent: August 20, 2019Assignee: CORETECH SYSTEM CO., LTD.Inventors: Yuing Chang, Rong-Yeu Chang, Chia-Hsiang Hsu, Chuan-Wei Chang, Ching-Chang Chien
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Publication number: 20190152113Abstract: The present disclosure provides a method for setting up a molding system, wherein the molding system includes a molding machine and a mold disposed on the molding machine, and the mold has a mold cavity to be filled with a molding resin from the molding machine. The method includes generating first and second state waveforms using a predetermined packing pressure profile; obtaining an updated packing pressure profile based on the first and the second state waveforms; and setting up the molding machine based on the updated packing pressure profile to perform an actual molding process to prepare the molding product. The first and the second state waveforms express a relationship between an in-mold pressure and an in-mold temperature at different sensing sites of the molding resin.Type: ApplicationFiled: June 18, 2018Publication date: May 23, 2019Inventors: Yuing CHANG, Rong-Yeu CHANG, Chia-Hsiang HSU, Chuan-Wei CHANG, Ching-Chang CHIEN
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Publication number: 20190152114Abstract: The present disclosure provides a method for operating a molding system. The molding system includes a molding machine and a mold disposed on the molding machine, wherein the mold has a mold cavity for being filled with a molding material from the molding machine. The method comprises a step of obtaining a predetermined state waveform expressing a predetermined volumetric variation of the molding material. Next, the method further comprises obtaining a measured pressure and a measured temperature of the molding material in the mold cavity while performing a molding process for filling the molding material into the mold cavity. Next, the method includes obtaining a detected volumetric property of the molding material corresponding to the measured pressure and the measured temperature. Subsequently, the method comprises displaying the detected volumetric property of the molding material with the predetermined state waveform.Type: ApplicationFiled: August 6, 2018Publication date: May 23, 2019Inventors: Yuing CHANG, Rong-Yeu CHANG, Chia-Hsiang HSU, Chuan-Wei CHANG, Ching-Chang CHIEN
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Patent number: 10076862Abstract: A molding system includes a molding machine, a mold disposed on the molding machine and having a mold cavity to be filled with a molding resin from the molding machine, and a computing apparatus connected to the molding machine. The computing apparatus is configured to perform operations for setting the molding machine to prepare a molding product, wherein the operations comprise: generating a first and a second state waveforms using a setting packing pressure profile; obtaining an updated packing pressure profile based on the first and the second state waveforms; and setting the molding machine based on the updated packing pressure profile to perform an actual molding process to prepare the molding product. The first and the second state waveforms express a relationship between an in-mold pressure and an in-mold temperature at different sensing sites of the molding resin.Type: GrantFiled: November 23, 2017Date of Patent: September 18, 2018Assignee: CORETECH SYSTEM CO., LTD.Inventors: Yuing Chang, Rong-Yeu Chang, Chia-Hsiang Hsu, Chuan-Wei Chang, Ching-Chang Chien
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Publication number: 20180031790Abstract: An optical coupling structure and an optical communication apparatus using the same are provided. The optical coupling structure includes a light incident portion, a light splitting portion, a first light emitting portion, and a second light emitting portion. An initial optical signal entering the optical coupling structure through the light incident portion is divided into a first beam and second beam by the light splitting portion, which includes a first reflective surface and a second reflective surface, and the slopes of the first and second reflective surfaces are both positive or both negative. The first beam is converted by the first light emitting portion into a first optical signal for transmitting to an optical transmission unit. The second beam is converted by the second light emitting portion into a second optical signal for transmitting to a photodetector.Type: ApplicationFiled: March 29, 2017Publication date: February 1, 2018Inventors: CHENG-TA CHEN, CHIA-HAO HSIEH, CHIA-CHING CHANG CHIEN
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Patent number: 9854141Abstract: A thin optical imaging module of a biometric apparatus includes a first glass substrate, a first optical prism film, a second optical prism film, and an image sensor. The first glass substrate further includes a fingerprint imaging area, a vein imaging area, a contact surface, a reflective interface, and an attaching surface. The first optical prism film adhered to the attaching surface is located under the fingerprint imaging area. The second optical prism film is adhered to a position under the first optical prism film. The image sensor disposed in correspondence to the first glass substrate is located under the attaching surface.Type: GrantFiled: January 29, 2015Date of Patent: December 26, 2017Assignee: TrueLight CorporationInventors: Chia Ching Chang Chien, Chih Cheng Chen, Zhi Kuei Huang, Jin Shan Pan
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Patent number: 9830498Abstract: A biometric authentication device uses IR-VCSELs as light sources for performing biometric authentication by providing clear images. A light guide module is introduced to minimize the size of the device. Moreover, the biometric authentication device uses a single image sensing module to gather a vein image and a fingerprint image into the same detection signal which is then analyzed and compared with the pre-stored vein feature data and fingerprint feature data.Type: GrantFiled: December 21, 2015Date of Patent: November 28, 2017Assignee: TrueLight CorporationInventors: Jin Shan Pan, Chih Cheng Chen, Chia Ching Chang Chien
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Patent number: 9684295Abstract: A method for operating a molding machine includes specifying a simulating domain corresponding to a genuine domain in a mold disposed on the molding machine. The method proceeds to perform a virtual molding by using a setting packing pressure profile to generate a simulated state waveform, generating a designed state waveform including an isobaric phase and an isochoric phase while taking into consideration the simulated state waveform, and obtaining an updated packing pressure profile for applying a molding pressure to a portion of the genuine domain while taking into consideration a difference between the simulated state waveform and the designed state waveform. Subsequently, the method proceeds to set the molding machine while taking into consideration the updated packing pressure profile to perform an actual molding by applying an actual molding pressure to the at least a portion of the genuine domain to prepare the molding product.Type: GrantFiled: July 12, 2016Date of Patent: June 20, 2017Assignee: CORETECH SYSTEM CO., LTD.Inventors: Yuing Chang, Chuan Wei Chang, Rong Yeu Chang, Chia Hsiang Hsu, Ching Chang Chien, Hsien Sen Chiu
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Patent number: 9555571Abstract: A method for operating a molding machine includes steps of specifying a simulating domain corresponding to a genuine domain in a mold disposed on the molding machine; performing a virtual molding by using an initial packing pressure profile to generate an initial state waveform expressing a relationship between an in-mold pressure and an in-mold temperature of the molding resin; obtaining an updated packing pressure profile for applying a molding pressure to at least a portion of the genuine domain while taking into consideration the initial state waveform; repeating the virtual molding while taking into consideration the updated packing pressure profile to generate an updated state waveform of the molding resin; and setting the molding machine taking into consideration the updated packing pressure profile to perform an actual molding by applying an actual molding pressure to the at least a portion of the genuine domain to prepare the molding product.Type: GrantFiled: November 5, 2015Date of Patent: January 31, 2017Assignee: CORETECH SYSTEM CO., LTD.Inventors: Yuing Chang, Rong Yeu Chang, Chia Hsiang Hsu, Chuan Wei Chang, Ching Chang Chien, Hsien Sen Chiu
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Publication number: 20170015040Abstract: A method for operating a molding machine includes specifying a simulating domain corresponding to a genuine domain in a mold disposed on the molding machine. The method proceeds to perform a virtual molding by using a setting packing pressure profile to generate a simulated state waveform, generating a designed state waveform including an isobaric phase and an isochoric phase while taking into consideration the simulated state waveform, and obtaining an updated packing pressure profile for applying a molding pressure to a portion of the genuine domain while taking into consideration a difference between the simulated state waveform and the designed state waveform. Subsequently, the method proceeds to set the molding machine while taking into consideration the updated packing pressure profile to perform an actual molding by applying an actual molding pressure to the at least a portion of the genuine domain to prepare the molding product.Type: ApplicationFiled: July 12, 2016Publication date: January 19, 2017Inventors: YUING CHANG, CHUAN WEI CHANG, RONG YEU CHANG, CHIA HSIANG HSU, CHING CHANG CHIEN, HSIEN SEN CHIU
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Computer-implemented simulation method and non-transitory computer medium for use in molding process
Patent number: 9409335Abstract: A molding method includes the steps of specifying a simulating domain having a resin part and a mold part, wherein the simulating domain corresponds to a genuine domain on a molding machine; setting an initial resin temperature of the resin part and an initial mold temperature of the mold part; performing a transient state analysis to calculate a plurality of temperature distributions at different times between the resin part and the mold part; calculating at least one heat transfer coefficient between the resin part and the mold part taking into consideration the plurality of temperature distributions at different times; simulating the molding process of a molding resin that is injected into the simulating domain by using the at least one heat transfer coefficient to generate a plurality of molding conditions; and performing the molding process by using the plurality of molding conditions to the genuine domain on the molding machine.Type: GrantFiled: September 30, 2015Date of Patent: August 9, 2016Assignee: CORETECH SYSTEM CO., LTD.Inventors: Tung Huan Su, Hsien Sen Chiu, Rong Yeu Chang, Chia Hsiang Hsu, Ching Chang Chien, Chih Chung Hsu -
Publication number: 20160227081Abstract: A thin optical imaging module of a biometric apparatus includes a first glass substrate, a first optical prism film, a second optical prism film, and an image sensor. The first glass substrate further includes a fingerprint imaging area, a vein imaging area, a contact surface, a reflective interface, and an attaching surface. The first optical prism film adhered to the attaching surface is located under the fingerprint imaging area. The second optical prism film is adhered to a position under the first optical prism film. The image sensor disposed in correspondence to the first glass substrate is located under the attaching surface.Type: ApplicationFiled: January 29, 2015Publication date: August 4, 2016Applicant: TrueLight CorporationInventors: Chia Ching CHANG CHIEN, Chih Cheng CHEN, Zhi Kuei HUANG, Jin Shan PAN
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Publication number: 20160104028Abstract: A biometric authentication device uses IR-VCSELs as light sources for performing a better biometric authentication by providing clearer images. A light guide module is introduced to minimize the size of the device. Moreover, the biometric authentication device uses a single image sensing module to gather the vein image and the fingerprint image into the same detection signal which is then analyzed and compared with the pre-stored vein feature data and fingerprint feature data. Therefore, the biometric authentication device can achieve an approach in lowering hardware costs, simplifying circuit designs and providing an outstanding performance.Type: ApplicationFiled: December 21, 2015Publication date: April 14, 2016Applicant: TrueLight CorporationInventors: Jin Shan Pan, Chih Cheng Chen, Chia Ching Chang Chien
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Patent number: 9245164Abstract: A biometric authentication device uses IR-VCSELs as light sources for performing a better biometric authentication by providing clearer images. A light guide module is introduced to minimize the size of the device. Moreover, the biometric authentication device uses a single image sensing module to gather the vein image and the fingerprint image into the same detection signal which is then analyzed and compared with the pre-stored vein feature data and fingerprint feature data. Therefore, the biometric authentication device can achieve an approach in lowering hardware costs, simplifying circuit designs and providing an outstanding performance.Type: GrantFiled: March 7, 2013Date of Patent: January 26, 2016Assignee: TrueLight CorporationInventors: Jin Shan Pan, Chih Cheng Chen, Chia Ching Chang Chien
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Publication number: 20140086459Abstract: A biometric authentication device uses IR-VCSELs as light sources for performing a better biometric authentication by providing clearer images. A light guide module is introduced to minimize the size of the device. Moreover, the biometric authentication device uses a single image sensing module to gather the vein image and the fingerprint image into the same detection signal which is then analyzed and compared with the pre-stored vein feature data and fingerprint feature data. Therefore, the biometric authentication device can achieve an approach in lowering hardware costs, simplifying circuit designs and providing an outstanding performance.Type: ApplicationFiled: March 7, 2013Publication date: March 27, 2014Applicant: TrueLight CorporationInventors: Jin Shan Pan, Chih Cheng Chen, Chia Ching Chang Chien
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Publication number: 20090264495Abstract: An oral sustained-release pharmaceutical composition of indapamide and a process for producing the foregoing pharmaceutical composition are provided. The pharmaceutical composition comprises indapamide in an amount between 0.2% and 4% (w/w) of the composition, a hydrophilic polymer in an amount between 10 % and 30% (w/w) of the composition, a dry binding agent in an amount between 2% and 20% (w/w) of the composition, and an erosion modifier in an amount between 40% and 80% (w/w) of the composition. The sustained-release pharmaceutical composition of indapamide could be obtained at lower expenditure and produced in a safe and economical manner.Type: ApplicationFiled: June 26, 2009Publication date: October 22, 2009Applicant: STANDARD CHEM. & PHARM. CO., LTD.Inventors: Chunyi YEH, Yi-Lung WANG, Ya-Sheng YANG, Ya-Ching CHANG CHIEN
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Publication number: 20080138412Abstract: A sustained release alfuzosin hydrochloride formulation contains alfuzosin hydrochloride as about 1% to about 5% by weight of the formulation, hydrophilic polymers as about 35% to about 75% by weight of the formulation, hydrophobic polymers as about 10% to about 30% by weight of the formulation, disintegrating agents as 10% to 30% by weight of the formulation and a binder as about 2% to about 12% by weight of the formulation. The hydrophilic and hydrophobic polymers are used as the release-modulating agent to control the dissolution profile of the alfuzosin hydrochloride formulation so that the formulation releases alfuzosin hydrochloride slowly and continuously as the formulation passed through the gastrointestinal tract. The present invention also relates to a method for preparing the above formulation.Type: ApplicationFiled: December 6, 2006Publication date: June 12, 2008Inventors: Fu-Yung Lin, Fang-Hsiung Hsiao, Ya-Ching Chang Chien
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Publication number: 20080113030Abstract: A sustained release tamsulosin formulation contains tamsulosin, a hydrophobic polymer, a microsphere forming agent and a diluent. The hydrophobic polymers include pH-dependent and pH-independent polymers are used as the release-modulating agent to control the dissolution profile of tamsulosin formulation so that the formulation releases tamsulosin slowly and continuously as the formulation passed through the stomach and gastrointestinal tract. The present invention further relates to a method for preparing the sustained release tamsulosin formulation.Type: ApplicationFiled: November 9, 2006Publication date: May 15, 2008Inventors: Ching-Fen Hsiao, Sung-Jen Chen, Ya-Ching Chang Chien
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Patent number: D790582Type: GrantFiled: August 23, 2016Date of Patent: June 27, 2017Assignee: CORETECH SYSTEM CO., LTD.Inventors: Yuing Chang, Rong Yeu Chang, Chia Hsiang Hsu, Ching Chang Chien, Chuan Wei Chang