Abstract: A particle removal method for removing particles on the backside of a reticle is provided. The method includes disposing the reticle on a reticle holder. In addition, the method includes moving a baffle defining an enclosed area that encompasses a particle to be removed on a backside of the reticle. The method further includes spraying, by a solution spraying module of a particle removal device, a solution onto the particle. The method further includes sucking, by a sucking module of the particle removal device, the solution on the reticle with the particle. The method further includes emitting, by the particle removal device, a gas onto the backside of the reticle for drying the backside.

Abstract: An electronic device with a plug includes a casing, a connection member and a circuit board. The connection member is combined with the casing. The connection member includes a first surface, a second surface, at least two perforations and at least two insertion parts. The first surface and the second surface are opposed to each other. The at least two perforations run through the first surface and the second surface. The at least two insertion parts are fixed on the first surface, protruded externally from the first surface and aligned with the corresponding perforations. The circuit board is accommodated within an accommodation space of the casing, and includes at least two conducting terminals. The conducting terminals are penetrated through the corresponding perforations from the second surface of the connection member, received within the corresponding insertion parts and partially protruded out of the corresponding insertion parts.

Abstract: An electronic device with a plug includes a casing, a connection member and a circuit board. The connection member is combined with the casing. The connection member includes a first surface, a second surface, at least two perforations and at least two insertion parts. The first surface and the second surface are opposed to each other. The at least two perforations run through the first surface and the second surface. The at least two insertion parts are fixed on the first surface, protruded externally from the first surface and aligned with the corresponding perforations. The circuit board is accommodated within an accommodation space of the casing, and includes at least two conducting terminals. The conducting terminals are penetrated through the corresponding perforations from the second surface of the connection member, received within the corresponding insertion parts and partially protruded out of the corresponding insertion parts.

Abstract: A limiting current circuit that has output short circuit protection is connected to an external voltage source and comprises an output terminal, an input current unit, a driving transistor, a voltage control resistor, a voltage control transistor and a delay unit. The output terminal is connected to a load and has an output current. The driving transistor has an internal resistance, a drain current and a gate voltage. The voltage control resistor has a resistor voltage. The voltage control transistor has an internal resistance and a parasitic capacitance. The delay unit makes the resistor voltage charging the parasitic capacitance to extend the period of lower internal resistance of the voltage control transistor and the period of higher internal resistance of the driving transistor, makes the internal resistance of the voltage control transistor is less than the internal resistance of the driving transistor when the load is shorted.

Abstract: A package-base structure of a luminescent diode and its fabricating process. The package-base structure includes a substrate having thereon a holding space; an insulating layer extending from a bottom surface of the holding space to the bottom of the substrate; an through hole defined in the insulating layer; and a conductive layer disposed over the insulating layer. The insulating layer decouples the current flow and heat flow to increase the lifetime of the package-base structure together with the luminescent diode. In the fabricating process, the insulating layer is formed by anodic etching to allow the insulating layer have a porous structure.

Abstract: A driving circuit for light emitting elements comprises a rectifying unit, a first constant current unit, a first driving transistor, a first voltage control unit and at least one first light emitting element. The rectifying unit has a first terminal and a second terminal, is connected to an external power source that provides alternating current power that is sinusoidal and has alternating negative and positive segments, inverts the negative segments of the AC power to positive segments and forms a pulsating direct current voltage. The first constant current unit has a first end and a second end. The first driving transistor comprises a first gate, a first drain and a first source. The first voltage control unit comprises a first variable resistor and a first bias control element. The first light emitting element has a first end and a second end.

Abstract: The invention provides a light emitting device driving circuit, comprising a rectification unit, a current limiting unit and a load. The load comprises a first light emitting device, a reverse voltage providing unit and a second light emitting device connected in serial. When the rectification unit rectifies an alternate current voltage to output a direct current voltage, and the current limiting unit limits the direct current in a predetermined value, the direct current is provided to the first light emitting device or the second light emitting device for operation. The reverse voltage providing unit provides a reverse voltage to reduce the total operating voltage of the light emitting devices in order to enhance the driving efficiency and the power factor.

Abstract: A carrier structure for mounting at least an LED chip includes at least a lead and a base. The LED chip housed inside the base is coupled parallel with an electronic element. The lead is connected electrically to the LED chip at one end, while another end is exposed to the atmosphere. The base encaving the lead further has a shallow accommodation room to mount the electronic element at a surface not the same with the surface that mounts the LED chip.

Abstract: An electric shock protection device is provided, including a voltage input unit, a rectifier unit, a determine unit, an output control unit and a switch unit. The voltage input unit receives an AC voltage, and the rectifier unit rectifies the AC voltage to time-varying DC voltage. The determining unit determines whether the time-varying DC voltage is less than or greater than the preset voltage and selectively chooses an output control signal to determine whether there is an external receptor connected in series with the input power. The output control unit is driven by the control signal to make the switch unit control whether the time-varying DC voltage is provided to the electrical load, and to sustain or interrupt the conductive circuit loop. Accordingly, the receptor can be avoided from being subjected to an electric shock from high AC voltage.

Abstract: A limiting current circuit that has output short circuit protection is connected to an external voltage source and comprises an output terminal, an input current unit, a driving transistor, a voltage control resistor, a voltage control transistor and a delay unit. The output terminal is connected to a load and has an output current. The driving transistor has an internal resistance, a drain current and a gate voltage. The voltage control resistor has a resistor voltage. The voltage control transistor has an internal resistance and a parasitic capacitance. The delay unit makes the resistor voltage charging the parasitic capacitance to extend the period of lower internal resistance of the voltage control transistor and the period of higher internal resistance of the driving transistor, makes the internal resistance of the voltage control transistor is less than the internal resistance of the driving transistor when the load is shorted.

Abstract: The LED driver of the present invention comprises multiple LED arrays, at least one dividing diode, a power module, a driving module, at least one switch pair and a voltage sensing module. Each LED array comprises multiple LEDs connected in series. The dividing diode is mounted between adjacent LED arrays. The power module is connected to an external power source and forms a pulsating direct current (DC) voltage. The driving module receives the pulsating DC voltage outputs a constant current to the LED arrays. The voltage sensing module closes and opens the switch pairs that changes electrical configuration of the LED arrays. The LED driving method of the present invention comprises setting multiple voltage drops and at least one reference voltage; sensing an incoming voltage to compare with the reference voltage; and changing ways of connections of LED arrays based on the reference voltage and the incoming voltage.

Abstract: A driving circuit for light emitting elements comprises a rectifying unit, a first constant current unit, a first driving transistor, a first voltage control unit and at least one first light emitting element. The rectifying unit has a first terminal and a second terminal, is connected to an external power source that provides alternating current power that is sinusoidal and has alternating negative and positive segments, inverts the negative segments of the AC power to positive segments and forms a pulsating direct current voltage. The first constant current unit has a first end and a second end. The first driving transistor comprises a first gate, a first drain and a first source. The first voltage control unit comprises a first variable resistor and a first bias control element. The first light emitting element has a first end and a second end.

Abstract: The invention provides a light emitting device driving circuit, comprising a rectification unit, a current limiting unit and a load. The load comprises a first light emitting device, a reverse voltage providing unit and a second light emitting device connected in serial. When the rectification unit rectifies an alternate current voltage to output a direct current voltage, and the current limiting unit limits the direct current in a predetermined value, the direct current is provided to the first light emitting device or the second light emitting device for operation. The reverse voltage providing unit provides a reverse voltage to reduce the total operating voltage of the light emitting devices in order to enhance the driving efficiency and the power factor.

Abstract: A package base structure of a light emitting device and associated manufacturing method is provided. The method includes steps of forming a first mask layer and a second mask layer on a first surface and a second surface of a substrate; defining a first opening and a second opening on the first mask layer and the second mask layer wherein the first opening is larger than the second opening; etching the substrate to form the package base structure having a holding space and at least two through holes. The upper opening of the holding space is located on the first surface of the substrate, and the bottom of the holding space can support the light emitting device. The lower openings of the through holes are located on the second surface of the substrate, and the tops of the through holes reach the bottom of the holding space. There is at least one slant structure at the contact between sidewalls of the through holes and the bottom of the holding space.

Abstract: A constant current device in accordance with the present invention is connected to an external voltage source and comprises an input unit, a driving transistor and a voltage control unit. The input unit is connected to the external voltage source. The driving transistor is used to output constant current. The voltage control unit makes the driving output constant current and comprises at least one resistor and a semiconductor load, and has a resistor voltage, the resistor comprising an input and an output.

Abstract: A carrier structure for mounting at least an LED chip includes at least a lead and a base. The LED chip housed inside the base is coupled parallel with an electronic element. The lead is connected electrically to the LED chip at one end, while another end is exposed to the atmosphere. The base encaving the lead further has a shallow accommodation room to mount the electronic element at a surface not the same with the surface that mounts the LED chip.

Abstract: An AC LED module with an improved power factor for coupling with an AC source includes a plurality of LED strings and a plurality of connecting-to-middle drive elements. The LED strings are coupled in parallel between two ends of the AC source, and each of the LED strings further includes a respective number of LEDs connected in series. The connecting-to-middle drive element assigned to a respective LED string has two connection point, one connected to one end of the AC source while another being connected with a middle point between two consecutive LEDs in the same LED string.

Abstract: An AC LED module includes a substrate, a bridge rectifier unit a constant current unit and an LED chip set. The bridge rectifier unit mounted on the substrate further includes an output and an input coupled with an AC source. The constant current unit, mounted on the substrate and coupled with the output of the bridge rectifier unit, further includes at least one current regulative diode. The LED chip set mounted also on the substrate is electrically coupled with the constant current unit.

Abstract: A side-view optical diode package is mounted on a printed circuit board with at least a solder bump. The side-view optical diode package includes a silicon substrate, a holding space, a bonding surface and a positioning structure. The silicon substrate has a first surface and a second surface. The holding space has a top opening in the first surface and a bottom for holding an optical diode thereon. The bonding surface is disposed at a lateral side of the silicon substrate and bonded onto the printed circuit board. The positioning structure has at least a solder-receiving portion beside the bonding surface and corresponding to the solder bump. The solder bump is molten during a soldering process and received in the solder-receiving portion, thereby facilitating positioning the silicon substrate on the printed circuit board.

Abstract: A package-base structure of a luminescent diode and its fabricating process. The package-base structure includes a substrate having thereon a holding space; an insulating layer extending from a bottom surface of the holding space to the bottom of the substrate; an through hole defined in the insulating layer; and a conductive layer disposed over the insulating layer. The insulating layer decouples the current flow and heat flow to increase the lifetime of the package-base structure together with the luminescent diode. In the fabricating process, the insulating layer is formed by anodic etching to allow the insulating layer have a porous structure.