Abstract: A LED power supply with bi-level dimming receives an input voltage to supply power to an LED lamp, and adjusts the brightness of the LED lamp according to whether an external detection switch is triggered to be turned on. The LED power supply includes a conversion circuit, a switch, and an oscillation circuit. The conversion circuit converts the input voltage into an output voltage, and provides the output voltage to supply power to the LED lamp so as to control the LED lamp to provide a first brightness. The oscillation circuit provides a dimming signal with a fixed frequency and a duty cycle to the switch when the external detection switch is turned on so as to turn on and turn off the switch. The switch correspondingly adjusts the output voltage according to the dimming signal to control the LED lamp to provide a second brightness.

Abstract: A system, method and computer product for training a neural network system. The method comprises applying an audio signal to the neural network system, the audio signal including a vocal component and a non-vocal component. The method also comprises comparing an output of the neural network system to a target signal, and adjusting at least one parameter of the neural network system to reduce a result of the comparing, for training the neural network system to estimate one of the vocal component and the non-vocal component. In one example embodiment, the system comprises a U-Net architecture. After training, the system can estimate vocal or instrumental components of an audio signal, depending on which type of component the system is trained to estimate.

Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a dielectric structure sandwiched between a first electrode and a bottom electrode. A passivation layer overlies the second electrode and the dielectric structure. The passivation layer comprises a horizontal surface vertically below a top surface of the passivation layer. The horizontal surface is disposed above a top surface of the dielectric structure.

Abstract: A heat sink and an electronic device are provided. The electronic device includes a circuit board and a heat sink. The circuit board has a heat source, and the heat sink contacts the heat source to dissipate the heat. The heat sink includes a heat dissipating plate and a cover plate. The heat dissipating plate has an inlet region, an outlet region and a vaporization region between the inlet region and the outlet region. The vaporization region is disposed corresponding to the heat source. The cover plate covers on the heat dissipating plate, and a space between the cover plate and the heat dissipating plate forms a channel with an inlet and an outlet. A cooling liquid flows into the channel from the inlet, is vaporized to a gas while passing through the vaporization region, and the vaporized gas dissipates outside the channel through the outlet.

Abstract: A method for flattening a three-dimensional shoe upper template is provided. The method includes providing a three-dimensional last model, obtaining a three-dimensional grid model, obtaining a three-dimensional thickened grid model, obtaining a two-dimensional initial-value grid model, and obtaining a two-dimensional grid model with the smallest energy value. A system and a non-transitory computer-readable medium for performing the method are also provided. The method makes it possible to precisely flatten a three-dimensional last model with a non-developable surface and thereby convert the three-dimensional last model into a two-dimensional grid model.

Abstract: An ultra-short focus projection lens is configured to receive an image beam from an image source side and project the image beam toward a projection surface. The ultra-short focus projection lens has an optical axis. The ultra-short focus projection lens includes a reflective optical element, a first lens group, a stop, and a second lens group arranged in sequence along the optical axis. The image beam from the image source side passes through the second lens group, the stop, and the first lens group in sequence, and is reflected by the reflective optical element and projected to the projection surface. The first lens group includes a plurality of lenses having diopters. The second lens group 10 includes a plurality of lenses having diopters. The first lens group and the second lens group include ten lenses having diopters in total. A projection device is also provided.

Abstract: A light source device includes a light guide plate, an optical adhesive, and a light source element. The light guide plate includes a light guide substrate and an enhancement layer. The light guide substrate has a light incident surface, a first surface, and a second surface. The first surface is opposite to the second surface, and the light incident surface extends between the first surface and the second surface. The enhancement layer is disposed on the light guide substrate. A thickness of the enhancement layer is from 1 micrometer to 25 micrometers and a first refractive index of the light guide substrate is greater than a second refractive index of the enhancement layer. The optical adhesive is interposed between the first surface of the light guide substrate and the optical adhesive. The light source element is disposed beside the light incident surface to emit light toward the light incident surface.

Abstract: A projection lens projecting an image beam provided by a light valve onto a screen is provided. The projection lens includes first to fourth lenses in order from a screen side to a display side along an optical axis. Each lens has a screen side surface facing the screen side and allowing the image beam to pass, and a display side surface facing the display side and allowing the image beam to pass. The first and third lenses have a negative refractive power, and the second and fourth lenses have a positive refractive power. The projection lens satisfies 2<TTL/f<5. TTL is a distance from the screen side surface of the first lens to the display side surface of the fourth lens on the optical axis. f is an effective focal length of the projection lens. The projection lens covers a wide range of operating temperatures while being lightweight.

Abstract: A LED power supply with bi-level dimming receives an input voltage to supply power to an LED lamp, and adjusts the brightness of the LED lamp according to whether an external detection switch is triggered to be turned on. The LED power supply includes a conversion circuit, a switch, and an oscillation circuit. The conversion circuit converts the input voltage into an output voltage, and provides the output voltage to supply power to the LED lamp so as to control the LED lamp to provide a first brightness. The oscillation circuit provides a dimming signal with a fixed frequency and a duty cycle to the switch when the external detection switch is turned on so as to turn on and turn off the switch. The switch correspondingly adjusts the output voltage according to the dimming signal to control the LED lamp to provide a second brightness.

Abstract: A bi-level dimming LED power supply equipment adjusts the brightness of a plurality of LED lights according to whether an external detection switch is triggered turned on. The LED power supply equipment includes a plurality of LED power supplies, and the LED power supplies respectively include an input end and an output end. The input end receives an input voltage, and the output end includes a bus positive end, a bus negative end and a dimming end. The dimming end is commonly coupled to a first end of the external detection switch, and one of the bus positive end or the bus negative end is commonly coupled to a second end of the external detection switch and one end of the LED lights, and the other one of the bus positive end or the bus negative end is respectively coupled to the other ends of the LED lights.

Abstract: A fan-out semiconductor device includes stacked semiconductor dies having die bond pads arranged in columns exposed at a sidewall of the stacked semiconductor dies. The stacked dies are encapsulated in a photo imageable dielectric (PID) material, which is developed to form through-hole cavities that expose the columns of bond pads of each die at the sidewall. The through-hole cavities are plated or filled with an electrical conductor to form conductive through-holes coupling die bond pads within the columns to each other.

Abstract: An electric frothing device includes a driving unit, a connecting rod, and a frothing unit. The driving unit has a housing, and a drive motor disposed in the housing. The drive motor has a power outputting shaft. The connecting rod is fixed to the power outputting shaft of the drive motor. The frothing unit has a fan fixed to the connecting rod and having blades, and a coil spring disposed with an interval from the blades of the fan.

Abstract: Devices and methods are described for reducing etching due to Galvanic Effect within a printed circuit board (PCB) that may be used in an electronic device. Specifically, a contact trace is coupled to a contact finger that has a substantially larger surface area than the contact trace. The contact finger is configured to couple the electronic device to a host device. The contact trace is electrically isolated from the rest of the PCB circuitry during a fabrication process by a separation distance between an exposed portion of the contact trace and an impedance trace. The contact finger and the exposed portion of the contact trace are plated with a common material to reduce galvanic etching of the contact trace during fabrication. The contact trace is then connected to the impedance trace using a solder joint.

Abstract: A heat dissipation system adapted to dissipate heat for an electronic device includes a tank, a first heat exchanger, and a fluid delivery device. The tank includes a first zone and a second zone. A cooling fluid is located in the first and second zones. The electronic device is adapted to be disposed in the first zone and immersed in the cooling fluid. The first heat exchanger is located at a junction of the first and second zones to reduce a temperature of the cooling fluid. The cooling fluid flows from the first zone to the second zone through the fluid delivery device. The cooling fluid is adapted to flow to the first zone from the second zone after passing through the first heat exchanger, so as to dissipate heat for the electronic device, and then flows to the second zone through the fluid delivery device, such that a cycle is formed.

Abstract: A two-phase immersion-cooling system, adapted for accommodating and cooling at least one heat source, includes a container, a pressure vessel, and a vapor compressor, the container includes a liquid-storing area and a vapor area, the liquid-phase coolant is configured for in thermal contact with at least one heat source and to be vaporized into a gas-phase coolant towards the vapor area and mixed with an air and a water vapor in the vapor area into a mixed gas. The pressure vessel is connected to the vapor area via a gas channel, the vapor compressor is disposed on the gas channel and configured to draw the mixed gas in the vapor area so as to decrease pressure of the vapor area and to inject the mixed gas into the pressure vessel so as to increase pressure of the pressure vessel.

Abstract: An electrically controlled optical screen including a switchable scattering element and an electrically controlled decorating module is provided. The switchable scattering element is disposed on a side of the electrically controlled decorating module and is configured to switch between a scattering state and a transparent state. The electrically controlled decorating module includes a first polarizer, a first quarter-wave plate, a cholesteric liquid crystal layer, an electrically controlled wave plate, a second quarter-wave plate and a second polarizer, which are sequentially stacked. The electrically controlled wave plate has a liquid crystal layer. The second polarizer is disposed between the switchable scattering element and the second quarter-wave plate.

Abstract: A game packet delivery method and a game packet delivery system are provided. The method includes executing a game program by a user device; and transmitting at least one game packet related to the game program between the user device and a game server via a telecom server and a shared router in response to the execution of the game program. The shared router belongs to a decentralized network node, and the transmission of at least one game packet does not involve any server provided by cloud service providers. Therefore, the efficiency of transferring game packets between the user device and the game server can be improved, thereby improving the game experience of the end user. Besides, because the transmission of game packets does not go through the backbone network of the cloud service providers, it can also ensure the privacy of online games for users.

Abstract: A system, method and computer product for training a neural network system. The method comprises applying an audio signal to the neural network system, the audio signal including a vocal component and a non-vocal component. The method also comprises comparing an output of the neural network system to a target signal, and adjusting at least one parameter of the neural network system to reduce a result of the comparing, for training the neural network system to estimate one of the vocal component and the non-vocal component. In one example embodiment, the system comprises a U-Net architecture. After training, the system can estimate vocal or instrumental components of an audio signal, depending on which type of component the system is trained to estimate.

Abstract: Devices and methods are described for reducing etching due to Galvanic Effect within a printed circuit board (PCB) that may be used in an electronic device. Specifically, a contact trace is coupled to a contact finger that has a substantially larger surface area than the contact trace. The contact finger is configured to couple the electronic device to a host device. The contact trace is electrically isolated from the rest of the PCB circuitry during a fabrication process by a separation distance between an exposed portion of the contact trace and an impedance trace. The contact finger and the exposed portion of the contact trace are plated with a common material to reduce galvanic etching of the contact trace during fabrication. The contact trace is then connected to the impedance trace using a solder joint.

Abstract: A controller includes a first sensing pin receiving a first sensing signal indicating a level of an input voltage of a resonant converter, a second sensing pin receiving a second sensing signal indicating a level of an input current of the resonant converter, a feedback pin receiving a feedback signal indicating a level of an output voltage of the resonant converter, and a first driving pin and a second driving pin controlling a high side switch and a low side switch of the resonant converter, respectively. The controller generates a compensated signal based on the first sensing signal, compares the compensated signal with a peak value of the second sensing signal to generate a first comparison result, compares the feedback signal with a threshold to generate a second comparison result, and controls the high side low side switches based on the first and the second comparison results.