Patents by Inventor Ching-Feng Hsiao

Ching-Feng Hsiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKAGE STRUCTURE
    Publication number: 20240080984
    Abstract: A package structure, including a circuit board, multiple circuit structure layers, at least one bridge structure, and at least one supporting structure, is provided. The circuit structure layer is disposed on the circuit board. The bridge structure is connected between the two adjacent circuit structure layers. The supporting structure is located between the two adjacent circuit structure layers, and the supporting structure has a first end and a second end opposite to each other and respectively connecting the bridge structure and the circuit board.
    Type: Application
    Filed: January 3, 2023
    Publication date: March 7, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Yu-Wei Huang, Ching-Feng Yu, Chih-Cheng Hsiao
  • Insect repellent lamp
    Patent number: D651327
    Type: Grant
    Filed: March 8, 2011
    Date of Patent: December 27, 2011
    Assignees: Unibond Technology Corp., Nantec Technologies Corporation
    Inventors: Ching-Feng Hsiao, Jui-Kung Wu