Abstract: An electrical device package structure and manufacturing method thereof is disclosed. The manufacturing method comprises: providing an electrical device body having at least two electrodes, wherein an outer surface of the electrical device body is partially covered by the electrodes, and outer surfaces of the electrodes are covered by a plastic material; forming a first protective layer including phosphate salt at least on the exposed outer surface of the electrical device body; and forming a second protective layer including glass at least on an exposed outer surface of the first protective layer. The present invention can prevent the electrical device body and/or the electrodes from being damaged on their manufacturing process, and avoid a forming high impedance layer on an electrode.

Abstract: An electrical device package structure and manufacturing method thereof is disclosed. The manufacturing method comprises: providing an electrical device body having at least two electrodes, wherein an outer surface of the electrical device body is partially covered by the electrodes, and outer surfaces of the electrodes are covered by a plastic material; forming a first protective layer including phosphate salt at least on the exposed outer surface of the electrical device body; and forming a second protective layer including glass at least on an exposed outer surface of the first protective layer. The present invention can prevent the electrical device body and/or the electrodes from being damaged on their manufacturing process, and avoid a forming high impedance layer on an electrode.

Abstract: A novel packaging method for attached (SMD-type) single small-size and array type chip semiconductor components is disclosed. The configuration of circuit board(s) with double-side interconnections includes reserving two or more connection endpoints on the inner and outer layers of a double-sided circuit board, and interconnecting the circuits on the inner and outer layers by hole drilling and electroplating, such that the two or more connection endpoints on the inner layer are used as inner electrodes for connecting with a semiconductor die, whereas the two or more connection endpoints on the outer layer are used as outer electrodes for SMT soldering.

Abstract: A novel method of preparation of easily stripped off temporary wound dressing material is disclosed. In this process, the-N-isopropyl acrylamide (NIPAAm) monomer is successfully grafted on the non-woven cloths by copolymerization. It is initiated by .gamma.-ray irradiation to activate the surface of the non-woven cloth. NIPAAm is then grafted onto the surface of the non-woven cloth. The free radical or peroxide is produced by Co-60 .gamma.-ray, then grafted on the non-woven cloths. The lower critical solution temperature (LCST) in thermoresponsive poly-N-isopropylacrylamide (NIPAAm) is still retained after the grafting. This will make the dressing cloth stripped off easily and without hurting the tissue. The material process is very simple and has medically applicable value.

Abstract: The invention relates to a method for synthesis of poly(L-leucine). Without any initiator and solvent poly(L-leucine) has been made from L-leucine-N-carboxy anhydride as starting material in the solid state by irradiation with gamma ray. There is only one step in the entire synthetic processing, and the polymerization yield is 100% and the process is a very simple, safe and convenient method. The poly(L-leucine) is one of the best materials for temporary wound dressing.