Patents by Inventor Ching-Hsiang Chen

Ching-Hsiang Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240178620
    Abstract: An electrical connector comprises an outer housing, an insulating housing installed on the outer housing, a pair of terminal assemblies, and a shielding member. The terminal assemblies are installed in the insulating housing and are spaced apart from each other in a first direction to define an insertion space therebetween adapted to receive a connection terminal of a mating connector. Each terminal assembly includes a plurality of conductive terminals arranged in rows in a second direction perpendicular to the first direction. The plurality of conductive terminals of each terminal assembly include a signal terminal and a ground terminal. The shielding member is positioned at least partially between the two terminal assemblies in the first direction and includes a contact arm in electrical contact with the ground terminal.
    Type: Application
    Filed: November 30, 2023
    Publication date: May 30, 2024
    Applicants: Tyco Electronics Holdings (Bermuda) No. 7 Limited, Tyco Electronics (Shanghai) Co., Ltd.
    Inventors: Lizhou (Leo) Li, Xinjie (David) Zhang, Kehao (Asroc) Chen, Ching Hsiang Chang
  • Patent number: 11972537
    Abstract: A method for flattening a three-dimensional shoe upper template is provided. The method includes providing a three-dimensional last model, obtaining a three-dimensional grid model, obtaining a three-dimensional thickened grid model, obtaining a two-dimensional initial-value grid model, and obtaining a two-dimensional grid model with the smallest energy value. A system and a non-transitory computer-readable medium for performing the method are also provided. The method makes it possible to precisely flatten a three-dimensional last model with a non-developable surface and thereby convert the three-dimensional last model into a two-dimensional grid model.
    Type: Grant
    Filed: August 19, 2022
    Date of Patent: April 30, 2024
    Assignee: YU JUNG CHANG TECHNOLOGY CO., LTD.
    Inventors: Chih-Chuan Chen, Wei-Hsiang Tsai, Chin-Yu Chen, Ching-Cherng Sun, Jann-Long Chern, Yu-Kai Lin
  • Patent number: 11967591
    Abstract: A method of forming a semiconductor device includes forming a first interconnect structure over a carrier; forming a thermal dissipation block over the carrier; forming metal posts over the first interconnect structure; attaching a first integrated circuit die over the first interconnect structure and the thermal dissipation block; removing the carrier; attaching a semiconductor package to the first interconnect structure and the thermal dissipation block using first electrical connectors and thermal dissipation connectors; and forming external electrical connectors, the external electrical connectors being configured to transmit each external electrical connection into the semiconductor device, the thermal dissipation block being electrically isolated from each external electrical connection.
    Type: Grant
    Filed: August 6, 2021
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Hao Chen, Fong-Yuan Chang, Po-Hsiang Huang, Ching-Yi Lin, Jyh Chwen Frank Lee
  • Patent number: 11964358
    Abstract: A method includes placing a polisher head on platen, the polisher head including a set of first magnets, and controlling a set of second magnets to rotate the polisher head on the platen, wherein controlling the set of second magnets includes reversing the polarity of at least one second magnet of the set of second magnets to produce a magnetic force on at least one first magnet of the set of first magnets, wherein the set of second magnets are external to the polisher head.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shang-Yu Wang, Chun-Hao Kung, Ching-Hsiang Tsai, Kei-Wei Chen, Hui-Chi Huang
  • Patent number: 11955460
    Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.
    Type: Grant
    Filed: October 5, 2020
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Da Tsai, Meng-Tse Chen, Sheng-Feng Weng, Sheng-Hsiang Chiu, Wei-Hung Lin, Ming-Da Cheng, Ching-Hua Hsieh, Chung-Shi Liu
  • Patent number: 11935757
    Abstract: A method of manufacturing a semiconductor device includes forming a first layer of a first planarizing material over a patterned surface of a substrate, forming a second layer of a second planarizing material over the first planarizing layer, crosslinking a portion of the first planarizing material and a portion of the second planarizing material, and removing a portion of the second planarizing material that is not crosslinked. In an embodiment, the method further includes forming a third layer of a third planarizing material over the second planarizing material after removing the portion of the second planarizing material that is not crosslinked. The third planarizing material can include a bottom anti-reflective coating or a spin-on carbon, and an acid or an acid generator. The first planarizing material can include a spin-on carbon, and an acid, a thermal acid generator or a photoacid generator.
    Type: Grant
    Filed: April 10, 2023
    Date of Patent: March 19, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yen-Hao Chen, Wei-Han Lai, Ching-Yu Chang, Chin-Hsiang Lin
  • Publication number: 20240071953
    Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
  • Publication number: 20240071954
    Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.
    Type: Application
    Filed: November 9, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
  • Publication number: 20240069608
    Abstract: The present application provides a graphics card expansion device. The graphics card expansion device includes a main chassis and an expansion chassis. The expansion chassis comprises: at least one graphics card storage box, the at least one graphics card storage box is equipped with at least one graphics card; at least one second power source, the at least second power source provides power to at least one graphics card in the at least one graphics card storage box; at least one adapter card, the at least one graphics card storage box communicates with the motherboard in the main box through the at least one adapter card.
    Type: Application
    Filed: August 22, 2023
    Publication date: February 29, 2024
    Inventors: CHING-JOU CHEN, WEN-HSIANG HUNG, CHUN-BAO GU
  • Publication number: 20220401716
    Abstract: A tattoo machine includes a tubular housing and an electromagnetic assembly disposed in the tubular housing. The electromagnetic assembly includes a first through-hole extending axially therethrough. A magnet unit is disposed in the first through-hole and includes a second through-hole extending axially therethrough. A core bar extends through the second through-hole and includes a tattoo needle on an end thereof. The tattoo needle can be actuated by the magnet unit to an exposed position outside of a bottom end of the tubular housing. An electric power transmission unit is electrically connected to the electromagnetic assembly. The electric power transmission unit can be in electrical connection with a power grid or a power supply and can output alternating current to the electromagnetic assembly.
    Type: Application
    Filed: March 21, 2022
    Publication date: December 22, 2022
    Inventor: CHING-HSIANG CHEN
  • Publication number: 20210396677
    Abstract: A detection substrate includes a substrate, a wetting layer, a barrier layer, a reaction layer, a counter electrode layer, a reference electrode layer, an insulating frame, and a plurality of wirings. The substrate includes a counter electrode, a working electrode, and a reference electrode. The reaction layer is located on the barrier layer. A surface of the reaction layer has a naturally micro-etched nano pattern. The counter electrode layer has an accommodating area which accommodates the reaction layer, and the naturally micro-etched nano pattern is exposed from the accommodating area. The insulating frame is located on a measurement area. The detection substrate has electrodes. During use, a predetermined reaction potential is applied to the detection substrate by an electrochemical device, and a Raman spectroscopy analysis is performed to obtain a strengthened Raman spectroscopy signal. A Raman spectrum detection system and a Raman spectrum detection method are also provided.
    Type: Application
    Filed: March 9, 2021
    Publication date: December 23, 2021
    Applicant: Tamkang University
    Inventors: Shih-Chieh Hsu, Ching-Hsiang Chen, Cheng-Ju Sung, Szu-Han Chao
  • Publication number: 20200376248
    Abstract: A power supply unit for a tattoo machine includes a power operating unit electrically connected to a power supply device. The power operating unit is electrically connected to an operating unit. The power operating unit can output a DC power and can control a current value or a voltage value of the DC current according to operation of the operating unit. A modulating unit is electrically connected to the power operating unit and the operating unit. The modulating unit modulates the DC current according to the operation of the operating unit and outputs a square wave power or the DC power. The modulating unit can control frequency or a work cycle of the square wave power according to the operation of the operating unit. An output end of the DC power supply unit is electrically connected to the tattoo machine to output the square wave power or the DC power.
    Type: Application
    Filed: May 20, 2020
    Publication date: December 3, 2020
    Inventor: CHING-HSIANG CHEN
  • Patent number: 9269964
    Abstract: A composite catalyst for an electrode is described, including platinum for dehydrogenation, an element E for water dissociation, and a material MOx for stabilization of the element E, wherein x ranges from 0 to 3.
    Type: Grant
    Filed: December 5, 2008
    Date of Patent: February 23, 2016
    Assignee: National Taiwan University of Science and Technology
    Inventors: Bing-Joe Hwang, Jing-Shan Do, Chi-Wen Lin, Jyh-Fu Lee, Shao-Kang Hu, Ching-Hsiang Chen, Shih-Chieh Yen
  • Patent number: 8075644
    Abstract: A catalytic liquid fuel is described, including a liquid fuel added with at least one kind of catalytic ion or its salt to improve the oxidation activity thereof. The liquid fuel includes at least an organic liquid fuel or a reducing agent or their mixture. The oxidation activity of the fuel can be enhanced by adding an extremely low concentration of the catalytic ion or it salt. The catalytic liquid fuel also can overcome problems like low oxidation activity, surface poisoning and fading of catalysts.
    Type: Grant
    Filed: June 8, 2007
    Date of Patent: December 13, 2011
    Assignee: National Taiwan University of Science and Technology
    Inventors: Bing-Joe Hwang, Jing-Shan Do, Shao-Kang Hu, Ching-Hsiang Chen, Kuo-Jung Wang, Sakkarapalayam Murugesan Senthil Kumar, Loka Subramanyam Sarma
  • Publication number: 20110079114
    Abstract: A ratchet device has a ratchet body, a rotating rod and a switching device. The ratchet body has a top and a central hole axially defined through the ratchet body. The rotating rod is mounted in the central hole and has a top and at least one lump notch defined on the top of the rotating rod. The switching device has a cover, a pivoting block and a switch. The cover is mounted securely on the top of the ratchet body and has a top. The pivoting block is mounted through the cover and abuts the top of the rotating rod and has a bottom and an eccentric lump. The eccentric lump protrudes from the bottom of the pivoting block and is inserted into one of the at least one lump notch. The switch is pivotally mounted in the cover and has a through hole mounted around the pivoting block.
    Type: Application
    Filed: October 6, 2009
    Publication date: April 7, 2011
    Inventor: CHING-HSIANG CHEN
  • Patent number: 7893376
    Abstract: A key structure includes a scissors-type connecting member. The scissors-type connecting member includes a first frame and a second frame. The first frame includes a first protrusion and a second protrusion. The second frame includes a first receiving recess for accommodating the first protrusion, a second receiving recess for accommodating the second protrusion, and a partition wall between the first receiving recess and the second receiving recess. When the first frame is swung with respect to the second frame, the first protrusion is sustained against a first side of the partition wall and moved on the first side of the partition wall, and the second protrusion is sustained against a second side of the partition wall and moved on the second side of the partition wall. Consequently, the first protrusion and the second protrusion are permitted to be partially detached from first receiving recess and the second receiving recess, respectively.
    Type: Grant
    Filed: July 21, 2009
    Date of Patent: February 22, 2011
    Assignee: Primax Electronics Ltd.
    Inventor: Ching-Hsiang Chen
  • Publication number: 20100307902
    Abstract: A key structure includes a scissors-type connecting member. The scissors-type connecting member includes a first frame and a second frame. The first frame includes a first protrusion and a second protrusion. The second frame includes a first receiving recess for accommodating the first protrusion, a second receiving recess for accommodating the second protrusion, and a partition wall between the first receiving recess and the second receiving recess. When the first frame is swung with respect to the second frame, the first protrusion is sustained against a first side of the partition wall and moved on the first side of the partition wall, and the second protrusion is sustained against a second side of the partition wall and moved on the second side of the partition wall. Consequently, the first protrusion and the second protrusion are permitted to be partially detached from first receiving recess and the second receiving recess, respectively.
    Type: Application
    Filed: July 21, 2009
    Publication date: December 9, 2010
    Applicant: Primax Electronics Ltd.
    Inventor: Ching-Hsiang Chen
  • Publication number: 20100143768
    Abstract: A composite catalyst for an electrode is described, including platinum for dehydrogenation, an element E for water dissociation, and a material MOx for stabilization of the element E, wherein x ranges from 0 to 3.
    Type: Application
    Filed: December 5, 2008
    Publication date: June 10, 2010
    Applicant: National Taiwan University of Science and Technology
    Inventors: Bing-Joe Hwang, Jing-Shan Do, Chi-Wen Lin, Jyh-Fu Lee, Shao-Kang Hu, Ching-Hsiang Chen, Shih-Chieh Yen
  • Publication number: 20080066376
    Abstract: A catalytic liquid fuel is described, including a liquid fuel added with at least one kind of catalytic ion or its salt to improve the oxidation activity thereof. The liquid fuel includes at least an organic liquid fuel or a reducing agent or their mixture. The oxidation activity of the fuel can be enhanced by adding an extremely low concentration of the catalytic ion or it salt. The catalytic liquid fuel also can overcome problems like low oxidation activity, surface poisoning and fading of catalysts.
    Type: Application
    Filed: June 8, 2007
    Publication date: March 20, 2008
    Applicant: National Taiwan University of Science and Technology
    Inventors: Bing-Joe Hwang, Jing-Shan Do, Shao-Kang Hu, Ching-Hsiang Chen, Kuo-Jung Wang, Sakkarapalayam Murugesan Senthil Kumar, Loka Subramanyam Sarma
  • Patent number: 7334935
    Abstract: A light positioning frame for a back light module includes an assembly frame composed of an outer frame, a top frame extending from a side of the outer frame, a receiving space, at least one slot defined through a top face of the top face communicating with the receiving space and a first shoulder formed on a bottom face defining the at least one slot and a mask having a base, a light source cap portion extending from a free side of the base and an extension extending into the receiving space so as to be supported by the first shoulder such that engagement between the fixed frame and the mask is finished, whereby a light source received in the mask is securely sandwiched between the fixed frame and the mask and light from the light source is dimmed by the top frame.
    Type: Grant
    Filed: November 13, 2006
    Date of Patent: February 26, 2008
    Assignee: Radiant Opto-Electronics Corporation
    Inventors: Ching-Hsiang Chen, Wei-Hsuan Chen