Patents by Inventor Ching-Hsien Chen

Ching-Hsien Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240094282
    Abstract: A circuit test structure includes a chip including a conductive line which traces a perimeter of the chip. The circuit test structure further includes an interposer electrically connected to the chip, wherein the conductive line is over both the chip and the interposer. The circuit test structure further includes a test structure connected to the conductive line. The circuit test structure further includes a testing site, wherein the test structure is configured to electrically connect the testing site to the conductive line.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 21, 2024
    Inventors: Ching-Fang CHEN, Hsiang-Tai LU, Chih-Hsien LIN
  • Publication number: 20220267390
    Abstract: This disclosure provides an isolated polypeptide therapeutics, polynucleotides encoding the polypeptides and antibodies that bind to the polypeptides are also provided. Therapeutic and diagnostic uses are further provided.
    Type: Application
    Filed: May 15, 2020
    Publication date: August 25, 2022
    Inventors: Reen Wu, Ching-Hsien Chen, David C. Yang
  • Patent number: 11007248
    Abstract: This disclosure relates to compositions of isolated polypeptides and methods of their use for the treatment and prevention of disease or disease symptoms associated with MARCKS phosphorylation and/or dissociation from the cell membrane, including but not limited to allergic inflammation, asthma, chronic bronchitis, COPD, infection, hyper-reactivity, cystic fibrosis, ulcerative colitis, Crohn's disease, irritable bowel syndrome, rosacea, eczema, psoriasis, acne, arthritis, rheumatoid arthritis, psoriatic arthritis, and systemic lupus erythematosus.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: May 18, 2021
    Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Reen Wu, Ching-Hsien Chen, Chen-Chen Lee
  • Publication number: 20210087247
    Abstract: This disclosure provides an isolated polypeptide comprising no more than 35 amino acids, wherein the amino acid sequence comprises, or alternatively consists essentially of, or alternatively consisting of XXXRYSYXXSYX (SEQ ID NO: 1) and equivalents thereof, wherein X is a basic amino acid and Y is a hydrophobic amino acid. Polynucleotides encoding the polypeptides and antibodies that bind to the polypeptides are also provided. Therapeutic and diagnostic uses are further provided.
    Type: Application
    Filed: January 28, 2019
    Publication date: March 25, 2021
    Inventors: Reen Wu, Ching-Hsien Chen
  • Publication number: 20200206308
    Abstract: This disclosure relates to compositions of isolated polypeptides and methods of their use for the treatment and prevention of disease or disease symptoms associated with MARCKS phosphorylation and/or dissociation from the cell membrane, including but not limited to allergic inflammation, asthma, chronic bronchitis, COPD, infection, hyper-reactivity, cystic fibrosis, ulcerative colitis, Crohn's disease, irritable bowel syndrome, rosacea, eczema, psoriasis, acne, arthritis, rheumatoid arthritis, psoriatic arthritis, and systemic lupus erythematosus.
    Type: Application
    Filed: April 25, 2019
    Publication date: July 2, 2020
    Inventors: Reen Wu, Ching-Hsien Chen, Chen-Chen Lee
  • Patent number: 10314889
    Abstract: This disclosure relates to compositions of isolated polypeptides and methods of their use for the treatment and prevention of disease or disease symptoms associated with MARCKS phosphorylation and/or dissociation from the cell membrane, including but not limited to allergic inflammation, asthma, chronic bronchitis, COPD, infection, hyper-reactivity, cystic fibrosis, ulcerative colitis, Crohn's disease, irritable bowel syndrome, rosacea, eczema, psoriasis, acne, arthritis, rheumatoid arthritis, psoriatic arthritis, and systemic lupus erythematosus.
    Type: Grant
    Filed: December 19, 2014
    Date of Patent: June 11, 2019
    Assignee: The Regents of the University of California
    Inventors: Reen Wu, Ching-Hsien Chen, Chen-Chen Lee
  • Patent number: 10189881
    Abstract: This disclosure provides an isolated polypeptide comprising no more than 35 amino acids, wherein the amino acid sequence comprises, or alternatively consists essentially of, or alternatively consisting of XXXRYSYXXSYX (SEQ ID NO: 1) and equivalents thereof, wherein X is a basic amino acid and Y is a hydrophobic amino acid. Polynucleotides encoding the polypeptides and antibodies that bind to the polypeptides are also provided. Therapeutic and diagnostic uses are further provided.
    Type: Grant
    Filed: July 25, 2014
    Date of Patent: January 29, 2019
    Assignee: The Regents of the University of California
    Inventors: Reen Wu, Ching-Hsien Chen
  • Publication number: 20170028019
    Abstract: This disclosure compositions and methods for the treatment and prevention of allergic inflammation and diseases associated with such, e.g., asthma.
    Type: Application
    Filed: December 19, 2014
    Publication date: February 2, 2017
    Applicant: The Regents of the University of California
    Inventors: Reen Wu, Ching-Hsien Chen, Chen-Chen Lee
  • Publication number: 20160176936
    Abstract: This disclosure provides an isolated polypeptide comprising no more than 35 amino acids, wherein the amino acid sequence comprises, or alternatively consists essentially of, or alternatively consisting of XXXRYSYXXSYX (SEQ ID NO: 1) and equivalents thereof, wherein X is a basic amino acid and Y is a hydrophobic amino acid. Polynucleotides encoding the polypeptides and antibodies that bind to the polypeptides are also provided. Therapeutic and diagnostic uses are further provided.
    Type: Application
    Filed: July 25, 2014
    Publication date: June 23, 2016
    Inventors: Reen Wu, Ching-Hsien Chen
  • Patent number: 9110386
    Abstract: A method comprises providing a semiconductor substrate having at least one layer of a material over the substrate. A sound is applied to the substrate, such that a sound wave is reflected by a top surface of the layer of material The sound wave is detected using a sensor. A topography of the top surface is determined based on the detected sound wave. The determined topography is used to control an immersion lithography process.
    Type: Grant
    Filed: June 10, 2014
    Date of Patent: August 18, 2015
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jen-Pan Wang, Chien-Hsuan Liu, Ching-Hsien Chen, Chao-Chi Chen
  • Publication number: 20140293250
    Abstract: A method comprises providing a semiconductor substrate having at least one layer of a material over the substrate. A sound is applied to the substrate, such that a sound wave is reflected by a top surface of the layer of material The sound wave is detected using a sensor. A topography of the top surface is determined based on the detected sound wave. The determined topography is used to control an immersion lithography process.
    Type: Application
    Filed: June 10, 2014
    Publication date: October 2, 2014
    Inventors: Jen-Pan WANG, Chien-Hsuan LIU, Ching-Hsien CHEN, Chao-Chi CHEN
  • Patent number: 8772054
    Abstract: A method comprises providing a semiconductor substrate having at least one layer of a material over the substrate. A sound is applied to the substrate, such that a sound wave is reflected by a top surface of the layer of material The sound wave is detected using a sensor. A topography of the top surface is determined based on the detected sound wave. The determined topography is used to control an immersion lithography process.
    Type: Grant
    Filed: September 8, 2011
    Date of Patent: July 8, 2014
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jen-Pan Wang, Chien-Hsuan Liu, Ching-Hsien Chen, Chao-Chi Chen
  • Publication number: 20130065328
    Abstract: A method comprises providing a semiconductor substrate having at least one layer of a material over the substrate. A sound is applied to the substrate, such that a sound wave is reflected by a top surface of the layer of material The sound wave is detected using a sensor. A topography of the top surface is determined based on the detected sound wave. The determined topography is used to control an immersion lithography process.
    Type: Application
    Filed: September 8, 2011
    Publication date: March 14, 2013
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jen-Pan WANG, Chien-Hsuan Liu, Ching-Hsien Chen, Chao-Chi Chen
  • Patent number: 7062342
    Abstract: A system for automatically receiving, verifying, and processing a request of a fabricating organization for manufacture of a product executes a method for verifying a request of a fabricating organization for manufacture of a product begins by receiving the request for manufacture of the product from a design organization. An acknowledgement of the request is generated and transferred to the design organization. The request is then verified that a format and syntax of the request complies with requirements for format and syntax of the request as established by the fabricating organization. If the format and syntax does not comply with the requirements for the format and syntax, the request is rejected for manufacture. However, if the format and syntax has minor non-compliances to the requirements for format and syntax, the minor non-compliances are corrected such that the request is in compliance to the requirements for format and syntax.
    Type: Grant
    Filed: May 24, 2002
    Date of Patent: June 13, 2006
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shu-Ling Feng, Ching-Hsien Chen