Abstract: A fan-out semiconductor device includes stacked semiconductor dies having die bond pads arranged in columns exposed at a sidewall of the stacked semiconductor dies. The stacked dies are encapsulated in a photo imageable dielectric (PID) material, which is developed to form through-hole cavities that expose the columns of bond pads of each die at the sidewall. The through-hole cavities are plated or filled with an electrical conductor to form conductive through-holes coupling die bond pads within the columns to each other.

Abstract: Examples of power management apparatuses, computing devices, and methods for disabling a phase of a power supply unit based on a power mode of a computing device are described herein. In an example, upon receiving an indication of the power mode of the computing device from a switching circuit, the power supply unit may disable the phase.

Abstract: A power supply allows an electronic product to access the Internet, characterized in that a casing of the power supply is provided with a network connection port, the casing of the power supply is provided therein with a power line communication module, the power line communication module is coupled to the network connection port, the power line communication module receives an original package data and transmits the original package data to the electronic product via the network connection port.

Abstract: A process of directly plating onto a nonconductive substrate is disclosed. The process comprises the steps of:1) conditioning: modifying a surface of the nonconductive substrate with selected organic hydrocarbons or polymers to enhance its property of adsorbing catalysts;2) catalyzing: immersing the conditioned substrate into a catalyst colloid-containing solution or a catalyst complex-containing solution to let the catalyst be adsorbed onto the substrate;3) accelerating: reducing the catalyst with a suitable acid or basic solution (adapted to the catalyst colloid), or with a reducing agent (adapted to the catalyst complex) to reduce the catalyst being adsorbed onto the substrate;4) enhancing: immersing the substrate after accelerating step into an enhancing agent containing a compound with two ligands;5) electroplating: proceeding with a plating process.