Abstract: A lock assembly includes a lock, a pre-loadable mount and an adjusting element. The lock includes a shell formed with two bores and a hole. The pre-loadable mat t includes a yoke, two bent rods extending from the yoke, and two pivots respectively extending from the bent rods, wherein the pivots are respectively inserted in the bores. The adjusting element includes a first section inserted in the hole and a second section placed against the yoke so that the bent rods are located against a rear face of the door while a portion of the shell is placed against a front face of the door.

Abstract: A lock assembly includes a lock, a pre-loadable mount and an adjusting element. The lock includes a shell formed with two bores and a hole. The pre-loadable mount includes a yoke, two bent rods extending from the yoke, and two pivots respectively extending from the bent rods, wherein the pivots are respectively inserted in the bores. The adjusting element includes a first section inserted in the hole and a second section placed against the yoke so that the bent rods are located against a rear face of the door while a portion of the shell is placed against a front face of the door.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: The present invention provides a pharmaceutical composition, comprising a hydrophobic active ingredient; a surfactant having hydrophobic end and hydrophilic end; an acidic component; and an effervescent ingredient. The acidic component reacts with the effervescent ingredient in water to generate carbon dioxide. The hydrophobic ends of the surfactant surround carbon dioxide. The hydrophobic active ingredient attaches to the hydrophobic ends of the surfactant.

Abstract: A floor engaging device includes a shank having an outer thread for threadedly securing with a workbench and having an engaging member which includes a downwardly curved surface, a base includes an upper wall having an orifice for receiving the shank, and a curved surface for engaging with the curved surface of the engaging member and for allowing the shank to be tilted and inclined or adjusted relative to the base to any suitable or selected angular position. A spring biasing member or coupling device, such as a spring member may further be used for biasing the base and the shank together and thus for coupling the base and the shank together.

Abstract: A draw latch includes a base member and a keeper secured to two panel members, a lever having two side flaps rotatably attached to the base member and having an actuator extended from one end, a cam member and a bracket rotatably attached to the side flaps of the lever. The bracket includes an end panel for threading to a catch which has a hook for engaging with the keeper. The cam member includes two side plates extended from a bottom plate and each having a horizontal surface for engaging with the bracket, to allow the actuator to actuate onto the cam member and then to actuate onto the bracket in a direction perpendicular to the bracket via the horizontal surfaces of the cam member.

Abstract: A latch device for a wall box includes a stem slidably attached to a housing, a catch secured to the stem for engaging with the housing, and a spring may bias the catch away from the housing. A hand grip is pivotally attached to the stem, a pole is secured to the hand grip and includes a lock groove, a bar is slidably attached to the housing and includes an actuator flange for selectively engaging into the lock groove of the pole, to selectively lock the pole and the hand grip to the housing. A magneto or a lock may be used for disengaging the actuator flange from the lock groove of the pole, to selectively release the hand grip from the housing.

Abstract: A semiconductor device having a bump electrode comprising a substrate having a dielectric layer formed thereon, an aluminum contact pad on the substrate wherein at least a portion of the aluminum contact pad is exposed through the dielectric layer on the substrate. The aluminum contact pad is provided with an under bump metallurgy including a aluminum layer formed on the exposed portion of the aluminum contact pad, a nickel-vanadium layer formed on the aluminum layer and a titanium layer formed on the nickel-vanadium layer. A gold bump formed on the titanium layer acts as the bump electrode.

Abstract: A latch assembly includes a casing defining a lever chamber and a spring chamber and having a wall interposed between the lever chamber and the spring chamber and formed with a shaft-extension hole to permit extension of a coupler shaft therethrough such that a pivot portion of the shaft extends into the lever chamber and a threaded portion of the shaft is disposed outwardly of the spring chamber. The threaded portion is formed with a pair of axially aligned grooves. A coupler portion of a latch member is formed with a shaft hole confined by a hole-confining wall for extension of the threaded portion therethrough, and a pair of engaging tongues that extend inwardly and radially from the hole-confining wall and that slidably and respectively engage the slots in the shaft so as to permit sliding movement of the latch member along the length of the shaft and so as to facilitate mounting and removal of the latch member on and from the shaft.

Abstract: A semiconductor device having a bump electrode comprising a substrate having a dielectric layer formed thereon, an aluminum contact pad on the substrate wherein at least a portion of the aluminum contact pad is exposed through the dielectric layer on the substrate. The aluminum contact pad is provided with an under bump metallurgy including a aluminum layer formed on the exposed portion of the aluminum contact pad, a nickel-vanadium layer formed on the aluminum layer and a titanium layer formed on the nickel-vanadium layer. A gold bump formed on the titanium layer acts as the bump electrode.

Abstract: A latch assembly includes a casing defining a lever chamber and a spring chamber and having a wall interposed between the lever chamber and the spring chamber and formed with a shaft-extension hole to permit extension of a coupler shaft therethrough such that a pivot portion of the shaft extends into the lever chamber and a threaded portion of the shaft is disposed outwardly of the spring chamber. The threaded portion is formed with a pair of axially aligned grooves. A coupler portion of a latch member is formed with a shaft hole confined by a hole-confining wall for extension of the threaded portion therethrough, and a pair of engaging tongues that extend inwardly and radially from the hole-confining wall and that slidably and respectively engage the slots in the shaft so as to permit sliding movement of the latch member along the length of the shaft and so as to facilitate mounting and removal of the latch member on and from the shaft.

Abstract: A semiconductor device having a bump electrode comprising a copper contact pad on a substrate wherein at least a portion of the copper contact pad is exposed through the dielectric layer on the substrate. The copper contact pad is provided with an under bump metallurgy including a titanium layer formed on the portion of the copper contact pad, a nickel-vanadium layer formed on the titanium layer and a copper layer formed on the nickel-vanadium layer. A metal bump provided on the UBM over each copper contact pad so as to form bump electrode. The UBM of the present invention is characterized by using the nickel-vanadium layer as barrier layer thereby significantly reducing the required thickness of the titanium layer, and thereby reducing cost and enhancing reliability.