Abstract: A metal product includes a metal substrate, at least one first hole, at least one second hole, and at least one third hole. The first hole is formed in a surface of the metal substrate. The second hole is formed in at least one of a portion of the surface of the metal substrate without the first hole and an inner surface defining the first hole. The third hole is formed in at least one of a portion of the surface of the metal substrate without the first hole and without the second hole, a portion of the inner surface defining the first hole without the second hole, and an inner surface defining the second hole. The first, second, and third holes enhance a bonding strength between the metal product and a material product. The disclosure also provides a metal composite and a method for manufacturing the metal product.

Abstract: A method of manufacturing a hybrid random access memory in a system-on-chip, including steps of providing a semiconductor substrate with a magnetoresistive random access memory (MRAM) region and a resistive random-access memory (ReRAM) region, forming multiple ReRAM cells in the ReRAM region on the semiconductor substrate, forming a first dielectric layer on the semiconductor substrate, wherein the ReRAM cells are in the first dielectric layer, forming multiple MRAM cells in the MRAM region on the first dielectric layer, and forming a second dielectric layer on the first dielectric layer, wherein the MRAM cells are in the second dielectric layer.

Abstract: A method for fabricating a semiconductor device includes the steps of first forming a first inter-metal dielectric (IMD) layer on a substrate and a metal interconnection in the first IMD layer, forming a magnetic tunneling junction (MTJ) and a top electrode on the metal interconnection, forming a spacer adjacent to the MTJ and the top electrode, forming a second IMD layer around the spacer, forming a cap layer on the top electrode, the spacer, and the second IMD layer, and then patterning the cap layer to form a protective cap on the top electrode and the spacer.

Abstract: A semiconductor device includes a substrate, a first dielectric layer, a second dielectric layer, and a third dielectric layer. The first dielectric layer is disposed on the substrate, around a first metal interconnection. The second dielectric layer is disposed on the first dielectric layer, around a via and a second metal interconnection. The second metal interconnection directly contacts the first metal interconnection. The third dielectric layer is disposed on the second dielectric layer, around a first magnetic tunneling junction (MTJ) structure and a third metal interconnection. The third metal interconnection directly contacts top surfaces of the first MTJ structure and the second metal interconnection, and the first MTJ structure directly contacts the via.

Abstract: A semiconductor memory device includes a substrate having a memory area and a logic circuit area thereon, a first interlayer dielectric layer on the substrate, and a second interlayer dielectric layer on the substrate. An embedded memory cell structure is disposed within the memory area between the first interlayer dielectric layer and the second interlayer dielectric layer. The second interlayer dielectric layer includes a first portion covering the embedded memory cell structure within the memory area and a second portion covering the logic circuit area. A top surface of the first portion is coplanar with a top surface of the second portion.

Abstract: An image sensor includes a photoelectric conversion layer, a plurality of deep trench isolations, a first color filter, a first deflector, and a covering layer. The photoelectric conversion layer includes a first photodiode and a second photodiode. The deep trench isolations separate the first photodiode and the second photodiode, in which a pixel dimension is determined by a distance between two adjacent deep trench isolations. The first color filter is disposed on the first photodiode and the second photodiode. The first deflector is disposed on the first color filter. The covering layer covers and surrounds the first deflector. A refractive index of the covering layer is greater than a refractive index of the first deflector, and a difference value between the refractive index of the covering layer and the refractive index of the first deflector is in a range from 0.15 to 0.6.

Abstract: A method for fabricating semiconductor device includes the steps of forming an inter-metal dielectric (IMD) layer on a substrate, forming a metal interconnection in the IMD layer, forming a magnetic tunneling junction (MTJ) on the metal interconnection, and performing a trimming process to shape the MTJ. Preferably, the MTJ includes a first slope and a second slope and the first slope is less than the second slope.

Abstract: A magnetoresistive random access memory (MRAM) device includes a first array region and a second array region on a substrate, a first magnetic tunneling junction (MTJ) on the first array region, a first top electrode on the first MTJ, a second MTJ on the second array region, and a second top electrode on the second MTJ. Preferably, the first top electrode and the second top electrode include different nitrogen to titanium (N/Ti) ratios.

Abstract: A hybrid random access memory for a system-on-chip (SOC), including a semiconductor substrate with a MRAM region and a ReRAM region, a first dielectric layer on the semiconductor substrate, multiple ReRAM cells in the first dielectric layer on the ReRAM region, a second dielectric layer above the first dielectric layer, and multiple MRAM cells in the second dielectric layer on the MRAM region.

Abstract: A magnetoresistive random access memory (MRAM) structure, including a substrate and multiple MRAM cells on the substrate, wherein the MRAM cells are arranged in a memory region adjacent to a logic region. An ultra low-k (ULK) layer covers the MRAM cells, wherein the surface portion of ultra low-k layer is doped with fluorine, and dents are formed on the surface of ultra low-k layer at the boundaries between the memory region and the logic region.

Abstract: The disclosure provides a fixing assembly adapted to fix an expansion card on an expansion slot of a motherboard. The fixing assembly includes a casing, a first positioning component and a second positioning component. The first positioning component is slidably disposed on the casing so that a distance between the first positioning component and the expansion slot of the motherboard is adjustable. The second positioning component is slidably disposed on the first positioning component. The second positioning component and the first positioning component are configured to press against the expansion card, and sliding directions of the first positioning component and the second positioning component are different from each other.

Abstract: A casing is configured for a data storage device to be disposed thereon. The casing includes a chassis and an operation member. The chassis includes a front plate, and the front plate has a plurality of assembling slots. Each of the assembling slots has a retaining part and a releasing par. A width of the releasing part is larger than a width of the retaining part. The assembling slots are configured for a plurality of fasteners of the data storage device to be disposed therethrough, and the plurality of fasteners are configured to be slid between the retaining parts and the releasing parts of the assembling slots. The operation member is slidably disposed on the front plate and slidable between a retaining position and a releasing position. When the operation member is in the retaining position, the operation member retains the fasteners at the retaining parts.

Abstract: The disclosure provides a fixing assembly adapted to fix an expansion card on an expansion slot of a motherboard. The fixing assembly includes a casing, a first positioning component and a second positioning component. The first positioning component is slidably disposed on the casing so that a distance between the first positioning component and the expansion slot of the motherboard is adjustable. The second positioning component is slidably disposed on the first positioning component. The second positioning component and the first positioning component are configured to press against the expansion card, and sliding directions of the first positioning component and the second positioning component are different from each other.

Abstract: A casing is configured for a data storage device to be disposed thereon. The casing includes a chassis and an operation member. The chassis includes a front plate, and the front plate has a plurality of assembling slots. Each of the assembling slots has a retaining part and a releasing par. A width of the releasing part is larger than a width of the retaining part. The assembling slots are configured for a plurality of fasteners of the data storage device to be disposed therethrough, and the plurality of fasteners are configured to be slid between the retaining parts and the releasing parts of the assembling slots. The operation member is slidably disposed on the front plate and slidable between a retaining position and a releasing position. When the operation member is in the retaining position, the operation member retains the fasteners at the retaining parts.

Abstract: During the use of a liquid mixing apparatus, a liquid container can be installed onto an adapter. The liquid container drives a lifting assembly to allow a piercing assembly to pierce through the adapter. Once a fluid flows into a flowing passage portion via a fluid inlet, a portion of the fluid is pressurized via a branch passage portion with easy control and further flows into the liquid container to mix with a fragrance material inside the liquid container. The mixed fragrant liquid then flows out of a fluid outlet from the piercing assembly via the return passage portion and the flowing passage portion. With the pressurization design of the branch passage portion, the apparatus allows the increase of dimension to increase the flow rate while maintaining the pressurized liquid, which is convenient to use and facilitated for the control of the mixture amount with greater variation range.

Abstract: During the use of a liquid mixing apparatus, a liquid container can be installed onto an adapter. The liquid container drives a lifting assembly to allow a piercing assembly to pierce through the adapter. Once a fluid flows into a flowing passage portion via a fluid inlet, a portion of the fluid is pressurized via a branch passage portion with easy control and further flows into the liquid container to mix with a fragrance material inside the liquid container. The mixed fragrant liquid then flows out of a fluid outlet from the piercing assembly via the return passage portion and the flowing passage portion. With the pressurization design of the branch passage portion, the apparatus allows the increase of dimension to increase the flow rate while maintaining the pressurized liquid, which is convenient to use and facilitated for the control of the mixture amount with greater variation range.

Abstract: The atomization device is provided which contains a base having two indentations oppositely and axially aligned with gradually decreasing diameters towards each other. A connection channel connects the two indentations. A first chamber and a second chamber are formed laterally between the two indentations. The first chamber has a larger height than that of the second chamber. A transmission pipe is configured inside the base connecting the first chamber and one of the opposite sides. After the fluid to be atomized is introduced into the base, it first enters the first chamber through the transmission pipe. After the first chamber is filled, fluid then enters the second chamber uniformly. In the meantime, air is forced to flow through the connection channel and fluid is as such atomized and ejected out from the second chamber with high uniformity.

Abstract: The present invention is a bag sealing apparatus, which allows a user to fold, seal and carry bags including food bags. The present invention also allows the content of the engaged bag to stay fresh and wholesome for later uses. The present invention can be carried to a workplace of the user conveniently with one hand. The bag sealing apparatus is comprised of a bag securing rod and an elongated tube, whereto the bag securing rod is securely engaged. The bag securing rod is engaged to the elongated tube via the engagement of a raised dot on the bag securing rod to a fastener hole on the elongated tube. The engagement of the bag securing rod to the elongated tube allows the bag to be attached to both the bag securing rod and the elongated tube. Thus, the engagement allows the bag to be sealed by the bag sealing apparatus.