Patents by Inventor Ching-Hui Yeh

Ching-Hui Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240171663
    Abstract: A foldable electronic device is provided and includes a central base, a torque module, two wing members, two transmission members, two panel bodies, a synchronous module and a flexible screen. The torque module is disposed on the central base, the wing members pivot relative to the central base, the transmission members are pivotally connected to the torque module and the central base, the panel bodies pivot relative to the wing members and linearly slide relative to the transmission members, the synchronous module drives the transmission members to reverse synchronously, and the flexible screen is arranged on the panel bodies and the wing members and includes a bendable area. The flexible screen is flattened when the panel bodies are in an unfolded state, and the bendable area bends when the panel bodies are in a folded state.
    Type: Application
    Filed: May 9, 2023
    Publication date: May 23, 2024
    Applicant: SYNCMOLD ENTERPRISE CORP.
    Inventors: Ching-Hui YEN, Chien-Cheng YEH, Chun-Hao HUANG
  • Publication number: 20240140782
    Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a first device and a second device disposed adjacent to the first device; a conductive pillar disposed adjacent to the first device or the second device; a molding surrounding the first device, the second device and the conductive pillar; and a redistribution layer (RDL) over the first device, the second device, the molding and the conductive pillar, wherein the RDL electrically connects the first device to the second device and includes an opening penetrating the RDL and exposing a sensing area over the first device.
    Type: Application
    Filed: January 5, 2024
    Publication date: May 2, 2024
    Inventors: PO CHEN YEH, YI-HSIEN CHANG, FU-CHUN HUANG, CHING-HUI LIN, CHIAHUNG LIU, SHIH-FEN HUANG, CHUN-REN CHENG
  • Publication number: 20240123662
    Abstract: An injection molding system includes a supplying unit configured to supply a flowable mixture; an injection unit communicable with the supplying unit, wherein the injection unit includes an outlet configured to discharge the flowable mixture; a molding device configured to receive the flowable mixture from the outlet and includes a mold cavity and a feeding port communicable with the mold cavity and engageable with the outlet; and a supporting device disposed between the injection unit and the molding device and configured to facilitate an engagement of the injection unit and the molding device. The supporting device includes a first element connected to the injection unit and a second element disposed on the molding device. The second element includes a slot configured to receive a protruding portion of the first element, the protruding portion of the first element is slidable within and along the slot of the second element.
    Type: Application
    Filed: August 16, 2023
    Publication date: April 18, 2024
    Inventors: CHING-HAO CHEN, LIANG-HUI YEH
  • Publication number: 20240094774
    Abstract: A foldable electronic apparatus is provided and includes a base unit and a display unit. The display unit includes a main panel body having a first side and a bottom side substantially perpendicular to each other, and the bottom side is connected to the base unit; a first folding module disposed on the first side; a first side panel body disposed on the first folding module, and the first side panel body is able to transform between a first unfolded state and a first folded state relative to the main panel body with the first folding module as an axis; and a flexible screen disposed on the main panel body, the first folding module and the first side panel body, and the flexible screen includes a first bendable area corresponding to the first folding module.
    Type: Application
    Filed: August 22, 2023
    Publication date: March 21, 2024
    Applicant: SYNCMOLD ENTERPRISE CORP.
    Inventors: Ching-Hui YEN, Chun-Hao HUANG, Chien-Cheng YEH
  • Publication number: 20240081005
    Abstract: A flexible screen comprises a multi-layer display structure and a covering structure. The multi-layer display structure includes an outer surface and an inner surface opposite to the outer surface, and the inner surface faces towards the foldable electronic device. The covering structure is disposed on the outer surface of the multi-layer display structure and includes a substrate layer and a plurality of nano-protrusions. The nano-protrusions are formed in array on at least one side of the substrate layer. The flexible screen can transform between an unfolded state and a folded state, and a bending section is partially formed when the flexible screen is in the folded state. The nano-protrusions located in the bending section can release the stress generated in the bending section when the flexible screen transform between the unfolded state and the folded state.
    Type: Application
    Filed: May 30, 2023
    Publication date: March 7, 2024
    Inventors: Chun-Hao HUANG, Ching-Hui YEN, Chien-Cheng YEH
  • Patent number: 8962919
    Abstract: A method for providing thermotolerance of a plant and the genetic engineering applications thereof are disclosed. DNA fragment containing a gene encoding EXPORTIN1A is transferred into a plant cell to provide or enhance thermotolerance of the plant. The method can be applied in genetic engineering to select transgenic plant.
    Type: Grant
    Filed: March 18, 2011
    Date of Patent: February 24, 2015
    Assignee: National Central University
    Inventors: Shaw-Jye Wu, Lian-Chin Wang, Shin-Jye Wu, Ching-Hui Yeh, Chun-An Lu
  • Publication number: 20120060237
    Abstract: A method for providing thermotolerance of a plant and the genetic engineering applications thereof are disclosed. DNA fragment containing a gene encoded EXPORTIN1A is transferred into a plant cell to provide or enhance thermotolerance of the plant. The method can be applied in genetic engineering to select transgenic plant.
    Type: Application
    Filed: March 18, 2011
    Publication date: March 8, 2012
    Applicant: NATIONAL CENTRAL UNIVERSITY
    Inventors: Shaw-Jye WU, Lian-Chin WANG, Shin-Jye WU, Ching-Hui YEH, Chun-An LU
  • Patent number: D638011
    Type: Grant
    Filed: November 3, 2010
    Date of Patent: May 17, 2011
    Assignee: ASUSTeK Computer Inc.
    Inventors: Hui-Chi Kuo, Lian-Tien Ke, Chung-Jen Chung, You-Ren Chen, Ching-Hui Yeh, Po-Wen Huang