Patents by Inventor Ching-I LIN
Ching-I LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240186258Abstract: Various embodiments of the present disclosure are directed towards a method for forming an integrated chip. An alignment process is performed on a first semiconductor workpiece and a second semiconductor workpiece by virtue of a plurality of workpiece pins. The first semiconductor workpiece is bonded to the second semiconductor workpiece. A shift value is determined between the first and second semiconductor workpieces by virtue of a first plurality of alignment marks on the first semiconductor workpiece and a second plurality of alignment marks on the second semiconductor workpiece. A layer of an integrated circuit (IC) structure is formed over the second semiconductor workpiece based at least in part on the shift value.Type: ApplicationFiled: January 24, 2024Publication date: June 6, 2024Inventors: Yeong-Jyh Lin, Ching I Li, De-Yang Chiou, Sz-Fan Chen, Han-Jui Hu, Ching-Hung Wang, Ru-Liang Lee, Chung-Yi Yu
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Publication number: 20240170613Abstract: An optoelectronic semiconductor element is provided. The optoelectronic semiconductor element includes a semiconductor stack and a first metal layer. The semiconductor stack includes a first portion and a second portion stacked in sequence, with the second portion including an active region. The first metal layer is located on the first portion and is electrically connected to the first portion. A top-view outline of the first portion shows a first pattern, a top-view outline of the second portion shows a second pattern, and a top-view outline of the first metal layer shows a third pattern. The area ratio of the third pattern to the first pattern is from 0.5% to 10%.Type: ApplicationFiled: November 16, 2023Publication date: May 23, 2024Inventors: Ching-En Huang, Chuang-Sheng Lin, Hao-Ming Ku, Shih-I Chen
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Patent number: 11984316Abstract: A device includes a substrate; a first layer over the substrate, the first layer containing a plurality of fin features and a trench between two adjacent fin features. The device also includes a porous material layer having a first portion and a second portion. The first portion is disposed in the trench. The second portion is disposed on a top surface of the first layer. The first and the second portions contain substantially same percentage of Si, substantially same percentage of O, and substantially same percentage of C.Type: GrantFiled: May 22, 2023Date of Patent: May 14, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Bo-Jiun Lin, Ching-Yu Chang, Hai-Ching Chen, Tien-I Bao
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Patent number: 11963969Abstract: Provided is a pharmaceutical composition including gastrodin and a use thereof for the prevention or the treatment of amyotrophic lateral sclerosis. The pharmaceutical composition is effective in reducing neuronal axon degeneration and neurofibromin accumulation, improving symptoms of amyotrophic lateral sclerosis and extending life of patients of amyotrophic lateral sclerosis.Type: GrantFiled: September 16, 2022Date of Patent: April 23, 2024Assignee: BUDDHIST TZU CHI MEDICAL FOUNDATIONInventors: Chia-Yu Chang, Shinn-Zong Lin, Hsiao-Chien Ting, Hui-I Yang, Horng-Jyh Harn, Hong-Lin Su, Ching-Ann Liu, Yu-Shuan Chen, Tzyy-Wen Chiou, Tsung-Jung Ho
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Patent number: 11944412Abstract: A blood pressure detection device manufactured by a semiconductor process includes a substrate, a microelectromechanical element, a gas-pressure-sensing element, a driving-chip element, an encapsulation layer and a valve layer. The substrate includes inlet apertures. The microelectromechanical element and the gas-pressure-sensing element are stacked and integrally formed on the substrate. The encapsulation layer is encapsulated and positioned on the substrate. A flowing-channel space is formed above the microelectromechanical element and the gas-pressure-sensing element. The encapsulation layer includes an outlet aperture in communication with an airbag. The driving-chip element controls the microelectromechanical element, the gas-pressure-sensing element and valve units to transport gas.Type: GrantFiled: June 2, 2021Date of Patent: April 2, 2024Assignee: MICROJET TECHNOLOGY CO., LTD.Inventors: Hao-Jan Mou, Ying-Lun Chang, Ching-Sung Lin, Chi-Feng Huang, Yung-Lung Han, Chang-Yen Tsai, Wei-Ming Lee, Chun-Yi Kuo, Tsung-I Lin
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Patent number: 11916022Abstract: Various embodiments of the present disclosure are directed towards a semiconductor processing system including an overlay (OVL) shift measurement device. The OVL shift measurement device is configured to determine an OVL shift between a first wafer and a second wafer, where the second wafer overlies the first wafer. A photolithography device is configured to perform one or more photolithography processes on the second wafer. A controller is configured to perform an alignment process on the photolithography device according to the determined OVL shift. The photolithography device performs the one or more photolithography processes based on the OVL shift.Type: GrantFiled: June 7, 2022Date of Patent: February 27, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yeong-Jyh Lin, Ching I Li, De-Yang Chiou, Sz-Fan Chen, Han-Jui Hu, Ching-Hung Wang, Ru-Liang Lee, Chung-Yi Yu
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Patent number: 10396234Abstract: A package structure of a long-distance sensor includes a substrate, a light-emitting chip, a sensing chip, two packaging gel bodies, and a cap. The substrate has a bearing surface. The light-emitting chip and the sensing chip are disposed on the bearing surface and separated from each other. The two packaging gel bodies cover the light-emitting chip and the sensing chip respectively and are separated from each other. The cap is disposed on the bearing surface and the packaging gel bodies, fastened to the bearing surface and the packaging gel bodies by adhesive, and provided with a light-emitting hole located above the light-emitting chip and a light-receiving hole located above the sensing chip.Type: GrantFiled: December 4, 2017Date of Patent: August 27, 2019Assignee: Lingsen Precision Industries, Ltd.Inventors: Ching-I Lin, Ming-Te Tu
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Patent number: 10103286Abstract: A package structure of a long-distance sensor includes a substrate, a light-emitting chip, a sensing chip, two packaging gel bodies, and a cap. The substrate has a bearing surface. The light-emitting chip and the sensing chip are disposed on the bearing surface and separated from each other. The two packaging gel bodies cover the light-emitting chip and the sensing chip respectively and are separated from each other. The cap is disposed on the bearing surface and the packaging gel bodies, fastened to the bearing surface and the packaging gel bodies by adhesive, and provided with a light-emitting hole located above the light-emitting chip and a light-receiving hole located above the sensing chip.Type: GrantFiled: February 21, 2017Date of Patent: October 16, 2018Assignee: LINGSEN PRECISION INDUSTRIES, LTD.Inventors: Ching-I Lin, Ming-Te Tu
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Patent number: 10090427Abstract: A package structure of a long-distance sensor includes a substrate, a light-emitting chip, a sensing chip, two packaging gel bodies, a cap, and two sheltering devices. The substrate has a bearing surface. The light-emitting chip and the sensing chip are disposed on the bearing surface and separated from each other. The two packaging gel bodies cover the light-emitting chip and the sensing chip respectively. The top surface of each of the packaging gel bodies is formed with a lens portion and a shoulder portion. The cap is formed on the bearing surface and the packaging gel bodies and provided with a light-emitting hole and a light-receiving hole accommodating the lens portions and the shoulder portions of the top surfaces of the packaging gel bodies respectively. The two sheltering devices are disposed on the shoulder portions respectively for blocking light from passing through the shoulder portions.Type: GrantFiled: February 16, 2017Date of Patent: October 2, 2018Assignee: LINGSEN PRECISION INDUSTRIES, LTD.Inventors: Ching-I Lin, Ming-Te Tu
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Publication number: 20180190630Abstract: A package structure of an optical module includes a substrate, a light-emitting chip, a sensing chip, two packaging gel bodies, and a cover layer. The substrate has a bearing surface. The light-emitting chip is disposed on the bearing surface by a die attach film. The sensing chip is disposed on the bearing surface by another die attach film and separated from the light-emitting chip. The two packaging gel bodies cover the light-emitting chip and the sensing chip respectively. The cover layer is disposed on the bearing surface and the two packaging gel bodies and provided with a light-emitting hole located above the light-emitting chip and a light-receiving hole located above the sensing chip.Type: ApplicationFiled: February 16, 2017Publication date: July 5, 2018Inventors: Ming-Te TU, Ching-I LIN, Chih-Wei LEE
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Publication number: 20180190856Abstract: A package structure of a long-distance sensor includes a substrate, a light-emitting chip, a sensing chip, two packaging gel bodies, a cap, and two sheltering devices. The substrate has a bearing surface. The light-emitting chip and the sensing chip are disposed on the bearing surface and separated from each other. The two packaging gel bodies cover the light-emitting chip and the sensing chip respectively. The top surface of each of the packaging gel bodies is formed with a lens portion and a shoulder portion. The cap is formed on the bearing surface and the packaging gel bodies and provided with a light-emitting hole and a light-receiving hole accommodating the lens portions and the shoulder portions of the top surfaces of the packaging gel bodies respectively. The two sheltering devices are disposed on the shoulder portions respectively for blocking light from passing through the shoulder portions.Type: ApplicationFiled: February 16, 2017Publication date: July 5, 2018Inventors: Ching-I LIN, Ming-Te TU
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Publication number: 20180190857Abstract: A package structure of a long-distance sensor includes a substrate, a light-emitting chip, a sensing chip, two packaging gel bodies, and a cap. The substrate has a bearing surface. The light-emitting chip and the sensing chip are disposed on the bearing surface and separated from each other. The two packaging gel bodies cover the light-emitting chip and the sensing chip respectively and are separated from each other. The cap is disposed on the bearing surface and the packaging gel bodies, fastened to the bearing surface and the packaging gel bodies by adhesive, and provided with a light-emitting hole located above the light-emitting chip and a light-receiving hole located above the sensing chip.Type: ApplicationFiled: February 21, 2017Publication date: July 5, 2018Inventors: Ching-I LIN, Ming-Te TU
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Publication number: 20180190858Abstract: A package structure of a long-distance sensor includes a substrate, a light-emitting chip, a sensing chip, two packaging gel bodies, and a cap. The substrate has a bearing surface. The light-emitting chip and the sensing chip are disposed on the bearing surface and separated from each other. The two packaging gel bodies cover the light-emitting chip and the sensing chip respectively and are separated from each other. The cap is disposed on the bearing surface and the packaging gel bodies, fastened to the bearing surface and the packaging gel bodies by adhesive, and provided with a light-emitting hole located above the light-emitting chip and a light-receiving hole located above the sensing chip.Type: ApplicationFiled: December 4, 2017Publication date: July 5, 2018Inventors: Ching-I Lin, Ming-Te Tu
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Patent number: 9586087Abstract: A stepping exercise machine has a frame, a transmission assembly, a resistance fan and two stepping assemblies. The frame has a base, a supporting bar, a mounting bracket and an oblique auxiliary bar. The transmission assembly is mounted on the supporting bar of the frame. The resistance fan is mounted rotatably on the transmission assembly and is able to be driven by the transmission assembly to create airflow. The stepping assemblies are mounted on the frame, are connected to the transmission assembly and are able to drive the transmission assembly to rotate the resistance fan. The resistance fan improves exercise intensity of a user.Type: GrantFiled: November 13, 2015Date of Patent: March 7, 2017Inventor: Ching-I Lin
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Publication number: 20160093556Abstract: A quad-flat non-lead package structure includes a film layer, a conducting layer, a die, an encapsulant, and a plurality of metal bumps. The film layer has a plurality of through holes. A pad of the conducting layer and conducting wirings are disposed at the film layer but are not connected to each other. The conducting wirings are disposed at the through holes, respectively. The die is fixedly disposed at the pad and electrically connected to the conducting wirings. The encapsulant covers the conducting layer and the die. The metal bumps are disposed in the through holes, respectively, each have one end electrically connected to a corresponding one of the conducting wirings, and each have the other end protruding from a corresponding one of the through holes. Accordingly, the quad-flat non-lead package structure features reduced likelihood of pin disconnection and enhanced adhesiveness required for surface-mount technology.Type: ApplicationFiled: November 7, 2014Publication date: March 31, 2016Inventors: Ming-Te TU, Ching-I LIN, Chia-Jen HSU, Sheng-Jen LIN
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Publication number: 20150279796Abstract: A method of manufacturing a quad-flat no-leads package (QFN) structure includes: forming a conducting layer on a surface of a thin-film layer; forming a plurality of conduction wirings from the conducting layer by a means of circuit layout; electrically connecting contact pads of a die to front ends of the conduction wirings, respectively; forming a plurality of through-holes in the thin-film layer by a means of drilling, such that terminal ends of the conduction wirings are exposed from the through-holes, respectively; and forming a plurality of metal bumps at the through-holes, respectively, such that signals from the die are sent to a bottom surface of the thin-film layer through the conduction wirings. Hence, the QFN structure and the method of manufacturing the same based on application of wafer-level chip-scale package (WLCSP) and extension of tape QFN to simplify the package manufacturing process, cut production costs, and enhance production yield.Type: ApplicationFiled: June 17, 2014Publication date: October 1, 2015Inventors: Ming-Te TU, Ching-I LIN, Chia-Jen HSU, Sheng-Jen LIN