Abstract: A chip package structure including a heat dissipation base, a first redistribution layer, a second redistribution layer, at least one chip, at least one metal stack, a plurality of conductive structures, and an encapsulant is provided. The second redistribution layer is disposed on the heat dissipation base and thermally coupled to the heat dissipation base. The chip, the metal stack, and the conductive structures are disposed between the second redistribution layer and the first redistribution layer. An active surface of the chip is electrically connected to the first redistribution layer and an inactive surface of the chip is thermally coupled to the second redistribution layer via the metal stack. The first redistribution layer is electrically connected to the second redistribution layer via the conductive structures. The encapsulant is filled between the second redistribution layer and the first redistribution layer. A manufacturing method of a chip package structure is also provided.

Abstract: A novel anti-inflammatory compound has the general formula (I): wherein the R1, R2 and R3 are same or different, and independently selected from a group consisting of H, halo, alkyl, alkenyl, alkynyl, cyclyl, heterocyclyl, alkoxyl, aryl, heteroaryl, alkylaryl and CF3. An anti-inflammatory composition includes the compound of general formula (I) or the salt, ester and/or hydrate thereof. The anti-inflammatory compound may be separated from a fruit extract, such as pineapple extract, and exhibits inhibitory effects on stimulated inflammatory response.

Abstract: Biocompatible cross-linked materials, suitable for use in implants, wound dressings, and blood substitutes, are described. The materials are prepared by cross-linking biological substances, such as collagen, chitosan, or hemoglobin, with genipin, a naturally occurring cross-linking agent. The cross-linking agent has much lower toxicity than conventionally used reagents, and the cross-linked products have good thermal and mechanical stability as well as biocompatibility.

Abstract: A use of 3-hydroxypropinoaldehyde in the manufacture of a biocompatible implant, substitute or wound dressing is disclosed, which involves crosslinking an amine-containing biomolecule including chitosan, hemoglobin and a connective-tissue protein such as collagen or gelatin derived from a collagenous source with 3-hydroxypropinoaldehyde.