Patents by Inventor Ching-Li LIN

Ching-Li LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240170462
    Abstract: A micro light-emitting diode display device and a micro light-emitting diode structure. The micro light-emitting diode display device includes a circuit substrate and a plurality of display pixels, the display pixels are arranged on the circuit substrate and are electrically connected with the circuit substrate individually. Each display pixel includes a plurality of series-connection structures, and the light wavelengths of the series-connection structures are different. Each series-connection structure includes at least two micro light-emitting elements, and the light wavelengths of the at least two micro light-emitting elements are within a wavelength range of one color light. The circuit substrate provides a driving voltage to drive the series-connection structures of each display pixel.
    Type: Application
    Filed: January 30, 2024
    Publication date: May 23, 2024
    Inventors: Yun-Li LI, Yi-Ru HUANG, Chi-Hao CHENG, Ching-Liang LIN
  • Patent number: 11908753
    Abstract: Herein disclosed is a test head connection method, the method comprises the following steps. First, a load board and a card holder are provided between a test head and a probing machine, the card holder is disposed in the probing machine, and the card holder is used to accommodate the load board. A vacuum function of the test head is activated, and the test head is moved to align the card holder. The test head is moved to touch the load board in the card holder. At least one clamping piece is used to fix the test head and the card holder. Wherein the load board and a wafer are connected by direct probing.
    Type: Grant
    Filed: November 6, 2021
    Date of Patent: February 20, 2024
    Assignee: Chroma ATE Inc.
    Inventors: Kao-Shan Yang, Ching-Li Lin
  • Publication number: 20220068726
    Abstract: Herein disclosed is a test head connection method, the method comprises the following steps. First, a load board and a card holder are provided between a test head and a probing machine, the card holder is disposed in the probing machine, and the card holder is used to accommodate the load board. A vacuum function of the test head is activated, and the test head is moved to align the card holder. The test head is moved to touch the load board in the card holder. At least one clamping piece is used to fix the test head and the card holder. Wherein the load board and a wafer are connected by direct probing.
    Type: Application
    Filed: November 6, 2021
    Publication date: March 3, 2022
    Inventors: Kao-Shan YANG, Ching-Li LIN