Patents by Inventor Ching Ou Yang

Ching Ou Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power signal transmission structure and design method thereof
    Patent number: 10470299
    Abstract: A power signal transmission structure and a design method are provided. The power supply signal transmission structure is adapted for a circuit board having a first surface and a second surface opposite to the first surface, and the power signal transmission structure includes a first power electrode, a second power electrode, and a plurality of vias. The first power electrode is disposed on the first surface and has a plurality of power pad regions for receiving a power signal. The second power electrode is disposed on the second surface. The vias penetrate the circuit board to electrically connect the first power electrode and the second power electrode. The vias are arranged in accordance with the current direction of the power signal to balance the current received by the vias.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: November 5, 2019
    Assignee: PEGATRON CORPORATION
    Inventors: Ching Ou Yang, Cheng-Hui Chu
  • POWER SIGNAL TRANSMISSION STRUCTURE AND DESIGN METHOD THEREOF
    Publication number: 20180302978
    Abstract: A power signal transmission structure and a design method are provided. The power supply signal transmission structure is adapted for a circuit board having a first surface and a second surface opposite to the first surface, and the power signal transmission structure includes a first power electrode, a second power electrode, and a plurality of vias. The first power electrode is disposed on the first surface and has a plurality of power pad regions for receiving a power signal. The second power electrode is disposed on the second surface. The vias penetrate the circuit board to electrically connect the first power electrode and the second power electrode. The vias are arranged in accordance with the current direction of the power signal to balance the current received by the vias.
    Type: Application
    Filed: March 23, 2018
    Publication date: October 18, 2018
    Applicant: PEGATRON CORPORATION
    Inventors: Ching Ou Yang, Cheng-Hui Chu