Patents by Inventor Ching-Sung Kuo
Ching-Sung Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11944412Abstract: A blood pressure detection device manufactured by a semiconductor process includes a substrate, a microelectromechanical element, a gas-pressure-sensing element, a driving-chip element, an encapsulation layer and a valve layer. The substrate includes inlet apertures. The microelectromechanical element and the gas-pressure-sensing element are stacked and integrally formed on the substrate. The encapsulation layer is encapsulated and positioned on the substrate. A flowing-channel space is formed above the microelectromechanical element and the gas-pressure-sensing element. The encapsulation layer includes an outlet aperture in communication with an airbag. The driving-chip element controls the microelectromechanical element, the gas-pressure-sensing element and valve units to transport gas.Type: GrantFiled: June 2, 2021Date of Patent: April 2, 2024Assignee: MICROJET TECHNOLOGY CO., LTD.Inventors: Hao-Jan Mou, Ying-Lun Chang, Ching-Sung Lin, Chi-Feng Huang, Yung-Lung Han, Chang-Yen Tsai, Wei-Ming Lee, Chun-Yi Kuo, Tsung-I Lin
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Publication number: 20150059624Abstract: A pallet comprises a first carrier board and a plurality of support elements. The first carrier board includes a first surface and a second surface opposite to the first surface. The plurality of support elements is arranged on the first surface of the first carrier board. Each support element has at least one through-hole penetrating the support element along a first direction, and the first direction is parallel to the first surface of the first carrier board. The pallet of the present invention is fabricated in an extrusion-shaping method and has advantages of simple fabrication processes, mass production and inexpensiveness.Type: ApplicationFiled: December 20, 2013Publication date: March 5, 2015Inventor: Ching-Sung KUO
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Publication number: 20140023811Abstract: The present invention discloses a plate building material, which comprises a plurality of strip fiber units, a filler and a coupling agent. The plurality of strip fiber units includes a plurality of crude chaffs. The fiber axes of the chaffs are randomly oriented. A plurality of gaps exists among the chaffs. The filler fills the gaps dispersed among the chaffs and bonds the strip fiber units to form a plate structure. The coupling agent is distributed on the interfaces between the strip fiber units and the filler to enhance the bonding between the strip fiber units and the filler. The plate building material of the present invention has the advantages: preserving chaff fiber to enhance strength; easiness to acquire chaffs; reducing consumption of wood and plastic; being environment-friendly, durable and economic.Type: ApplicationFiled: July 5, 2013Publication date: January 23, 2014Inventor: Ching-Sung KUO
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Patent number: 8002018Abstract: A thermal-dissipating device is made by connecting a plurality of thermal-dissipating sheets with each other. The thermal-dissipating sheets include a plurality of connecting portions and a plurality of thermal-dissipating fins. The connecting portions are connected with each other. The thermal-dissipating fins are connected with the connecting portions, respectively. At least one set of the thermal-dissipating fins are connected with each other.Type: GrantFiled: October 10, 2007Date of Patent: August 23, 2011Inventor: Ching-Sung Kuo
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Patent number: 7905274Abstract: A wing-spanning thermal-dissipating device has a plurality of thermal-dissipating sheets. Each of the thermal-dissipating sheets includes a connecting portion, at least one thermal-dissipating fin and a plurality of sub-thermal-dissipating fins. The connecting portions of the thermal-dissipating sheets connect with each other. The thermal-dissipating fin is extended outwardly and spread out from the connecting portion. The sub-thermal-dissipating fins are extended from at least one side of the thermal-dissipating fin.Type: GrantFiled: August 21, 2007Date of Patent: March 15, 2011Inventor: Ching-Sung Kuo
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Publication number: 20090095452Abstract: A thermal-dissipating device is made by connecting a plurality of thermal-dissipating sheets with each other. The thermal-dissipating sheets include a plurality of connecting portions and a plurality of thermal-dissipating fins. The connecting portions are connected with each other. The thermal-dissipating fins are connected with the connecting portions, respectively. At least one set of the thermal-dissipating fins are connected with each other.Type: ApplicationFiled: October 10, 2007Publication date: April 16, 2009Inventor: Ching-Sung Kuo
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Publication number: 20090050293Abstract: A sheet-combined thermal-dissipating device has a plurality of thermal-dissipating sheets, which are connected with each other. Each of the thermal-dissipating sheets includes a connecting portion, at least one thermal-dissipating fin and a plurality of sub-thermal-dissipating fins. The connecting portions of the thermal-dissipating sheets are connected with each other. The thermal-dissipating fin is extended outwardly from the connecting portion, and the thickness of the connecting portion is greater than that of the thermal-dissipating fin. The sub-thermal-dissipating fins are extended outwardly from at least one side of the thermal-dissipating fin.Type: ApplicationFiled: August 21, 2007Publication date: February 26, 2009Inventor: Ching-Sung Kuo
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Publication number: 20090052138Abstract: A wing-spanning thermal-dissipating device has a plurality of thermal-dissipating sheets. Each of the thermal-dissipating sheets includes a connecting portion, at least one thermal-dissipating fin and a plurality of sub-thermal-dissipating fins. The connecting portions of the thermal-dissipating sheets connect with each other. The thermal-dissipating fin is extended outwardly and spread out from the connecting portion. The sub-thermal-dissipating fins are extended from at least one side of the thermal-dissipating fin.Type: ApplicationFiled: August 21, 2007Publication date: February 26, 2009Inventor: Ching-Sung Kuo
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Patent number: 6675885Abstract: A heat dissipating device includes a plurality of plates each having a three-sided base plate portion and a pair of fin plate portions. The base plate portion has a contact side adapted to contact a heat generating object, and two opposite sides forming an angle therebetween and extending to two opposite ends of the contact side. The base plate portions of the plates are disposed in parallel and next to each other to form a stack. The fin plate portions respectively extend outward from the opposite sides of the base plate portions and are bent from the base plate portions to diverge outward and to form air passages therebetween. The heat dissipating device provides a high ratio of the area of the base plate portions to the area of the fin plate portions so that the stack is compact while the fin plate portions maintain a sufficient heat transfer surface area.Type: GrantFiled: April 12, 2001Date of Patent: January 13, 2004Inventor: Ching-Sung Kuo
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Publication number: 20020148603Abstract: A heat dissipating device includes a plurality of plates each having a three-sided base plate portion and a pair of fin plate portions. The base plate portion has a contact side adapted to contact a heat generating object, and two opposite sides forming an angle therebetween and extending to two opposite ends of the contact side. The base plate portions of the plates are disposed in parallel and next to each other to form a stack. The fin plate portions respectively extend outward from the opposite sides of the base plate portions and are bent from the base plate portions to diverge outward and to form air passages therebetween. The heat dissipating device provides a high ratio of the area of the base plate portions to the area of the fin plate portions so that the stack is compact while the fin plate portions maintain a sufficient heat transfer surface area.Type: ApplicationFiled: April 12, 2001Publication date: October 17, 2002Inventor: Ching-Sung Kuo
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Patent number: 6289975Abstract: A heat dissipating device includes a plurality of heat dissipating plates. Each of the heat dissipating plates has a stack plate portion and at least one fin plate portion that extends integrally from the stack plate portion. The stack plate portions of the heat dissipating plates are in close contact with one another and cooperatively form a stack part with a flat contact face adapted to be placed on a heat generating articles. The fin plate portions of the heat dissipating plates are bent from the stack plate portions to extend divergingly away from the stack part. The fin plate portions have confronting surfaces which diverge away from one another.Type: GrantFiled: March 12, 2001Date of Patent: September 18, 2001Inventor: Ching-Sung Kuo
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Publication number: 20010010264Abstract: A heat dissipating device includes a plurality of heat dissipating plates. Each of the heat dissipating plates has a stack plate portion and at least one fin plate portion that extends integrally from the stack plate portion. The stack plate portions of the heat dissipating plates are in close contact with one another and cooperatively form a stack part with a flat contact face adapted to be placed on a heat generating article. The fin plate portions of the heat dissipating plates are bent from the stack plate portions to extend divergingly away from the stack part. The fin plate portions have confronting surfaces which diverge away from one another.Type: ApplicationFiled: March 12, 2001Publication date: August 2, 2001Inventor: Ching-Sung Kuo
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Patent number: 6257323Abstract: A heat dissipating device is used for dissipating heat generated by a heat source, and includes a fluid container made of a heat conductive material, at least one circulating pipe made of a heat conductive material, and a heat dissipating fin unit. The fluid container has a device contacting side adapted to be placed in contact with the heat source, and a pipe connecting side opposite to the device contacting side. The fluid container contains an amount of working fluid therein. The working fluid is capable of changing into fluid vapor when absorbing the heat from the heat source. The fluid vapor is capable of changing into fluid condensate when cooled. The circulating pipe has a vapor input portion, a condensate output portion, and a plurality of interconnected turns between the vapor input and condensate output portions.Type: GrantFiled: June 12, 2000Date of Patent: July 10, 2001Inventor: Ching-Sung Kuo
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Patent number: 6076594Abstract: A heat dissipating device includes a plurality of heat dissipating plates which are disposed side by side. Each of the heat dissipating plates has a stack plate portion and a fin plate portion that extends integrally from the stack plate portion and that has a thickness smaller than that of the stack plate portion. The stack plate portions of the heat dissipating plates are in close contact with one another, and cooperatively form a stack part with a flat contact face adapted to be placed in contact with a heat generating article. The fin plate portions of the heat dissipating plates cooperatively form a fin part.Type: GrantFiled: October 29, 1998Date of Patent: June 20, 2000Inventor: Ching-Sung Kuo
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Patent number: D426195Type: GrantFiled: August 23, 1999Date of Patent: June 6, 2000Inventor: Ching-Sung Kuo