Patents by Inventor CHING-TANG FU

CHING-TANG FU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light-emitting module for vehicle lamp
    Patent number: 11506352
    Abstract: Disclosed is a light-emitting module, comprising: a circuit board, a conductive layer, a light-emitting device, and an adhesive material. The circuit board comprises a device-attachment area, the conductive layer being disposed on the device-attachment area, the light-emitting device being disposed on the conductive layer and electrically connected to the circuit board through the conductive layer, and the adhesive layer being used for connecting the light-emitting device to the circuit board, wherein a curing temperature of the adhesive layer is lower than a melting point of the conductive layer. Adopting the aforementioned technical means, the degree of offset in the position of the light-emitting device after reflow soldering can be greatly reduced. In addition, a vehicle lamp device using the light-emitting module is also provided.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: November 22, 2022
    Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, Lite-On Technology Corporation
    Inventors: Ching-Tang Fu, Chia-Jung Tsai, Han-Ming Lee
  • LIGHT-EMITTING MODULE FOR VEHICLE LAMP
    Publication number: 20210010652
    Abstract: Disclosed is a light-emitting module, comprising: a circuit board, a conductive layer, a light-emitting device, and an adhesive material. The circuit board comprises a device-attachment area, the conductive layer being disposed on the device-attachment area, the light-emitting device being disposed on the conductive layer and electrically connected to the circuit board through the conductive layer, and the adhesive layer being used for connecting the light-emitting device to the circuit board, wherein a curing temperature of the adhesive layer is lower than a melting point of the conductive layer. Adopting the aforementioned technical means, the degree of offset in the position of the light-emitting device after reflow soldering can be greatly reduced. In addition, a vehicle lamp device using the light-emitting module is also provided.
    Type: Application
    Filed: September 25, 2020
    Publication date: January 14, 2021
    Applicants: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, Lite-On Technology Corporation
    Inventors: Ching-Tang Fu, Chia-Jung Tsai, Han-Ming Lee
  • Light-emitting module for vehicle lamp
    Patent number: 10823355
    Abstract: Disclosed is a light-emitting module, comprising: a circuit board, a conductive layer, a light-emitting device, and an adhesive material. The circuit board comprises a device-attachment area, the conductive layer being disposed on the device-attachment area, the light-emitting device being disposed on the conductive layer and electrically connected to the circuit board through the conductive layer, and the adhesive layer being used for connecting the light-emitting device to the circuit board, wherein a curing temperature of the adhesive layer is lower than a melting point of the conductive layer. Adopting the aforementioned technical means, the degree of offset in the position of the light-emitting device after reflow soldering can be greatly reduced. In addition, a vehicle lamp device using the light-emitting module is also provided.
    Type: Grant
    Filed: September 15, 2019
    Date of Patent: November 3, 2020
    Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, Lite-On Technology Corporation
    Inventors: Ching-Tang Fu, Chia-Jung Tsai, Han-Ming Lee
  • LIGHT-EMITTING MODULE FOR VEHICLE LAMP
    Publication number: 20200011498
    Abstract: Disclosed is a light-emitting module, comprising: a circuit board, a conductive layer, a light-emitting device, and an adhesive material. The circuit board comprises a device-attachment area, the conductive layer being disposed on the device-attachment area, the light-emitting device being disposed on the conductive layer and electrically connected to the circuit board through the conductive layer, and the adhesive layer being used for connecting the light-emitting device to the circuit board, wherein a curing temperature of the adhesive layer is lower than a melting point of the conductive layer. Adopting the aforementioned technical means, the degree of offset in the position of the light-emitting device after reflow soldering can be greatly reduced. In addition, a vehicle lamp device using the light-emitting module is also provided.
    Type: Application
    Filed: September 15, 2019
    Publication date: January 9, 2020
    Applicants: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, Lite-On Technology Corporation
    Inventors: Ching-Tang Fu, Chia-Jung Tsai, Han-Ming Lee
  • VEHICLE LAMP DEVICE AND LIGHT-EMITTING MODULE THEREOF
    Publication number: 20170211769
    Abstract: Disclosed is a light-emitting module, comprising: a circuit board, a conductive layer, an LED chip, and an adhesive layer. The circuit board comprises a chip-attachment area, the conductive layer being disposed on the chip-attachment area, the LED chip being disposed on the conductive layer and electrically connected to the circuit board through the conductive layer, and the adhesive layer being used for connecting the LED chip to the circuit board, wherein a curing temperature of the adhesive layer is lower than a melting point of the conductive layer. Adopting the aforementioned technical means, the degree of offset in the position of the LED chip after reflow soldering can be greatly reduced. In addition, a vehicle lamp device using the light-emitting module is also provided.
    Type: Application
    Filed: June 7, 2016
    Publication date: July 27, 2017
    Inventors: CHING-TANG FU, CHIA-JUNG TSAI