Abstract: Semiconductor devices including the use of solder materials and methods of manufacturing are provided. In embodiments the solder materials utilize a first tensile raising material, a second tensile raising material, and a eutectic modifier material. By utilizing the materials a solder material can be formed and used with a reduced presence of needles that may otherwise form during the placement and use of the solder material.

Abstract: An embodiment composite material for semiconductor package mount applications may include a first component including a tin-silver-copper alloy and a second component including a tin-bismuth alloy or a tin-indium alloy. The composite material may form a reflowed bonding material having a room temperature tensile strength in a range from 80 MPa to 100 MPa when subjected to a reflow process. The reflowed bonding material may include a weight fraction of bismuth that is in a range from approximately 4% to approximately 15%. The reflowed bonding material may an alloy that is solid solution strengthened by a presence of bismuth or indium that is dissolved within the reflowed bonding material or a solid solution phase that includes a minor component of bismuth dissolved within a major component of tin. In some embodiments, the reflowed bonding material may include intermetallic compounds formed as precipitates such as Ag3Sn and/or Cu6Sn5.

Abstract: A display device is configured to determine a target location. The display device includes a waveguide element, a display panel and a processor. The waveguide element is configured to receive an image and reflect the image to an eyeball location. The display panel is located at one side of the waveguide element. The display panel has a plurality of pixel units. The display panel is located between the waveguide element and the target location. The processor is electrically connected to the display panel. The processor is configured to determine the pixel units in a blocking area of the display panel to be opaque. The blocking area of the display panel overlaps the target location. The display panel displays the pixel units in the blocking area as grayscale according to the processor.

Abstract: A method for detecting dust mite antigens includes the steps of collecting a dust sample, applying an extraction and cleanup procedure for dust mite antigens from the dust sample in order to obtain a sample solution ready for measurement, and placing the sample solution on a SERS chip without immunological modification and under a Raman spectrometer for SERS detection in order to identify whether any dust mite antigens exist in the sample solution.

Abstract: A surface-enhanced Raman scattering (SERS) detection method is provided for detecting a target analyte in a sample. The SERS detection method generally includes the steps of: (a). preparing an extract of the sample; (b). introducing the sample extract onto a SERS substrate, causing the target analyte to be absorbed in the SERS substrate; (c). introducing a volatile organic solvent onto the SERS substrate to have the target analyte of the sample extract dissolved and comes out of the SERS substrate; (d). irradiating the SERS substrate with light to evaporate the volatile organic solvent, leaving a more condensed target analyte on the SERS substrate; (e). irradiating the condensed target analyte with laser light to have the target analyte penetrate deeply into the SERS substrate; and (f). performing Raman measurement with a laser beam focusing on the SERS substrate to analyze the target analyte.

Abstract: A surface-enhanced Raman scattering (SERS) detection method is provided for detecting a target analyte in a sample. The SERS detection method generally includes the steps of: (a). preparing an extract of the sample; (b). introducing the sample extract onto a SERS substrate, causing the target analyte to be absorbed in the SERS substrate; (c). introducing a volatile organic solvent onto the SERS substrate to have the target analyte of the sample extract dissolved and comes out of the SERS substrate; (d). irradiating the SERS substrate with light to evaporate the volatile organic solvent, leaving a more condensed target analyte on the SERS substrate; (e). irradiating the condensed target analyte with laser light to have the target analyte penetrate deeply into the SERS substrate; and (f). performing Raman measurement with a laser beam focusing on the SERS substrate to analyze the target analyte.

Abstract: A method for detecting dust mite antigens includes the steps of collecting a dust sample, applying an extraction and cleanup procedure for dust mite antigens from the dust sample in order to obtain a sample solution ready for measurement, and placing the sample solution on a SERS chip without immunological modification and under a Raman spectrometer for SERS detection in order to identify whether any dust mite antigens exist in the sample solution.

Abstract: A light source module includes an optical unit, which includes a light-emitting device, a light-guiding device and a light-converging structure. The light-guiding device has a light incident end, a light emitting end, a first curved surface connecting the light incident end and the light emitting end, and a side surface. The light-emitting device is disposed beside the light incident end. The section of the first curved surface by the side surface is a first curve. The section of the first curved surface by the reference plane perpendicular to the side surface is a second curve. The light-converging structure is disposed between the light-emitting device and the light incident end and has a first arc-convex surface and two second convex surfaces, in which the first arc-convex surface and the second convex surfaces are arranged along a direction parallel to the side-surface.

Abstract: Disclosed herein describes an SERS sensing substrate comprising upright metal nanostructures made by using oblique angle deposition (OAD) collocating with self-rotation substrate, wherein said upright nanostructures include individual upright nanopillars and metal/dielectric multilayered upright nanopillar stacks. The SERS sensing substrate exhibits higher and enhanced adsorption spectra for unpolarized incident rays in the visible and infrared wavelength regimes.

Abstract: A light source module includes an optical unit, which includes a light-emitting device, a light-guiding device and a light-converging structure. The light-guiding device has a light incident end, a light emitting end, a first curved surface connecting the light incident end and the light emitting end, and a side surface. The light-emitting device is disposed beside the light incident end. The section of the first curved surface by the side surface is a first curve. The section of the first curved surface by the reference plane perpendicular to the side surface is a second curve. The light-converging structure is disposed between the light-emitting device and the light incident end and has a first arc-convex surface and two second convex surfaces, in which the first arc-convex surface and the second convex surfaces are arranged along a direction parallel to the side-surface.

Abstract: Disclosed herein describes an SERS sensing substrate comprising upright metal nanostructures made by using oblique angle deposition (OAD) collocating with self-rotation substrate, wherein said upright nanostructures include individual upright nanopillars and metal/dielectric multilayered upright nanopillar stacks. The SERS sensing substrate exhibits higher and enhanced adsorption spectra for unpolarized incident rays in the visible and infrared wavelength regimes.