Abstract: A communication device includes a dielectric substrate, a first coil antenna, a second coil antenna, and a switch circuit. The first coil antenna has a hollow region. The second coil antenna is disposed inside the hollow region of the first coil antenna. The dielectric substrate is configured to carry the first coil antenna and the second coil antenna. The switch circuit selectively enables at least one of the first coil antenna and the second coil antenna according to a power signal.

Abstract: A mobile device includes a metal back cover, a dielectric substrate, a grounding metal element, a first radiation element, and a second radiation element. The metal back cover has a slot. The dielectric substrate has a first surface and a second surface, and the second surface faces the slot. The grounding metal element extends onto the first surface of the dielectric substrate. The first radiation element has a feeding point, and is disposed on the first surface of the dielectric substrate. The first vertical projection of the first radiation element at least partially overlaps the slot. The second radiation element is disposed on the second surface of the dielectric substrate. The second vertical projection of the second radiation element at least partially overlaps the slot. An antenna structure is formed by the first radiation element, the second radiation element, and the slot of the metal back cover.

Abstract: A semiconductor package and a method of forming the same are disclosed. A method of forming a semiconductor package includes the following operations. A polymer layer is formed over a die. A metal feature is formed in the polymer layer. An argon-containing plasma treatment is performed to the polymer layer and the metal feature.

Abstract: An electrostatic discharge protection circuit is provided. The electrostatic discharge protection circuit includes an electrostatic discharge detection circuit, a discharge circuit, and a switch. The electrostatic discharge detection circuit detects whether an electrostatic discharge event occurs at the bounding pad to generate a first detection circuit. The discharge circuit receives the first detection signal. When the electrostatic discharge event occurs at the bounding pad, the discharge circuit provides a discharge path between the bounding pad and a ground terminal according to the first detection signal. The switch is coupled between the core circuit and the ground terminal and controlled by the first detection signal. When the electrostatic discharge event occurs at the bounding pad, the switch is turned off according to the first detection signal.

Abstract: A mobile device includes a metal back cover, a dielectric substrate, a grounding metal element, a first radiation element, and a second radiation element. The metal back cover has a slot. The dielectric substrate has a first surface and a second surface, and the second surface faces the slot. The grounding metal element extends onto the first surface of the dielectric substrate. The first radiation element has a feeding point, and is disposed on the first surface of the dielectric substrate. The first vertical projection of the first radiation element at least partially overlaps the slot. The second radiation element is disposed on the second surface of the dielectric substrate. The second vertical projection of the second radiation element at least partially overlaps the slot. An antenna structure is formed by the first radiation element, the second radiation element, and the slot of the metal back cover.

Abstract: A mobile device includes a metal back cover, a ground metal element, a feeding radiation element, and a dielectric substrate. The metal back cover has a slot. The feeding radiation element has a feeding point, and includes a first feeding branch, a second feeding branch, and a third feeding branch. The second feeding branch and the first feeding branch extend in opposite directions. The third feeding branch and the first feeding branch extend in the same direction. The feeding radiation element has a vertical projection on the metal back cover, and the vertical projection at least partially overlaps the slot. The dielectric substrate is disposed adjacent to the metal back cover. The ground metal element and the feeding radiation element are disposed on the dielectric substrate. An antenna structure is formed by the feeding radiation element and the slot of the metal back cover.