Patents by Inventor Ching-Yi Chang

Ching-Yi Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12009200
    Abstract: A nitrogen plasma treatment is used on an adhesion layer of a contact plug. As a result of the nitrogen plasma treatment, nitrogen is incorporated into the adhesion layer. When a contact plug is deposited in the opening, an interlayer of a metal nitride is formed between the contact plug and the adhesion layer. A nitrogen plasma treatment is used on an opening in an insulating layer. As a result of the nitrogen plasma treatment, nitrogen is incorporated into the insulating layer at the opening. When a contact plug is deposited in the opening, an interlayer of a metal nitride is formed between the contact plug and the insulating layer.
    Type: Grant
    Filed: February 2, 2023
    Date of Patent: June 11, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ching-Yi Chen, Wei-Yip Loh, Hung-Hsu Chen, Chih-Wei Chang
  • Publication number: 20240180415
    Abstract: A retinal layer quantification system includes an image capturing unit and a processor electrically connected to the image capturing unit. The image capturing unit is configured to capture a target optical coherence tomographic image of a subject. The processor stores a program including a target image pre-processing module, a retinal layer auto-segmentation model, a target image enhancement module, a layer thickness detection module and a layer area detection module. The program detects a retinal layer thickness and a retinal layer area of the subject when the program is executed by the processor.
    Type: Application
    Filed: June 20, 2023
    Publication date: June 6, 2024
    Inventors: Ching-Ping CHANG, Jia-Yi HONG, Shu-Chun KUO, Jui-Ti MA, Chung-Hsin TSENG
  • Patent number: 11991479
    Abstract: The disclosure provides a time-lapse photographic device. The time-lapse photographic device includes a camera module, a drive module, an environment detection module, and a control unit. The drive module is connected to the camera module to drive the camera module to rotate. The environment detection module is configured to detect an external environment of the time-lapse photographic device to generate an environment detection signal. The control unit is electrically connected to the camera module, the drive module, and the environment detection module. The control unit generates, according to a shooting stop parameter, a plurality of intermittent drive signals to control the drive module, and controls the camera module to shoot at intervals of the drive signals. The control unit adjusts operation of at least one of the camera module and the drive module according to the environment detection signal.
    Type: Grant
    Filed: February 15, 2022
    Date of Patent: May 21, 2024
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Hsin-Yi Pu, Kai-Yu Hsu, Lai-Peng Wong, Chieh Li, Ting-Han Chang, Ching-Xsuan Chen
  • Patent number: 11980597
    Abstract: The disclosure provides methods for treating estrogen receptor positive (ER+) cancer in women with an effective amount of lasofoxifene, a pharmaceutically acceptable salt thereof, or a prodrug thereof. The disclosure also includes the detection of the Estrogen Receptor 1 (ESR1) gene mutations that lead to endocrine resistance and treatment of endocrine resistant ER+ cancers.
    Type: Grant
    Filed: March 30, 2023
    Date of Patent: May 14, 2024
    Assignee: Duke University
    Inventors: Kaitlyn Andreano, Ching-yi Chang, Donald P. McDonnell, Stephanie L. Gaillard
  • Patent number: 11974983
    Abstract: The disclosure provides methods for treating estrogen receptor positive (ER+) cancer in women with an effective amount of lasofoxifene, a pharmaceutically acceptable salt thereof, or a prodrug thereof. The disclosure also includes the detection of the Estrogen Receptor 1 (ESR1) gene mutations that lead to endocrine resistance and treatment of endocrine resistant ER+ cancers.
    Type: Grant
    Filed: September 22, 2022
    Date of Patent: May 7, 2024
    Assignee: Duke University
    Inventors: Kaitlyn Andreano, Ching-yi Chang, Donald P. McDonnell, Stephanie L. Gaillard
  • Publication number: 20240136227
    Abstract: A method includes etching a dielectric layer of a substrate to form an opening in the dielectric layer, forming a metal layer extending into the opening, performing an anneal process, so that a bottom portion of the metal layer reacts with a semiconductor region underlying the metal layer to form a source/drain region, performing a plasma treatment process on the substrate using a process gas including hydrogen gas and a nitrogen-containing gas to form a silicon-and-nitrogen-containing layer, and depositing a metallic material on the silicon-and-nitrogen-containing layer.
    Type: Application
    Filed: January 3, 2024
    Publication date: April 25, 2024
    Inventors: Ching-Yi Chen, Sheng-Hsuan Lin, Wei-Yip Loh, Hung-Hsu Chen, Chih-Wei Chang
  • Patent number: 11965069
    Abstract: A heat-shrinkable polyester film made of a polyester-forming resin composition includes a recycled material, and has an exothermic crystallization peak and an endothermic melting peak which are determined via differential scanning calorimetry, and which satisfy relationships of T2?T1?68° C. and T3?T2?78° C., where T1 represents an onset point of the exothermic crystallization peak, T2 represents an end point of the exothermic crystallization peak and an onset point of the endothermic melting peak, and T3 represents an end point of the endothermic melting peak. A method for manufacturing the heat-shrinkable polyester film is also disclosed.
    Type: Grant
    Filed: February 5, 2021
    Date of Patent: April 23, 2024
    Assignee: FAR EASTERN NEW CENTURY CORPORATION
    Inventors: Li-Ling Chang, Yow-An Leu, Ting-Yu Lin, Ching-Chun Tsai, Wen-Yi Chang
  • Patent number: 11967591
    Abstract: A method of forming a semiconductor device includes forming a first interconnect structure over a carrier; forming a thermal dissipation block over the carrier; forming metal posts over the first interconnect structure; attaching a first integrated circuit die over the first interconnect structure and the thermal dissipation block; removing the carrier; attaching a semiconductor package to the first interconnect structure and the thermal dissipation block using first electrical connectors and thermal dissipation connectors; and forming external electrical connectors, the external electrical connectors being configured to transmit each external electrical connection into the semiconductor device, the thermal dissipation block being electrically isolated from each external electrical connection.
    Type: Grant
    Filed: August 6, 2021
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Hao Chen, Fong-Yuan Chang, Po-Hsiang Huang, Ching-Yi Lin, Jyh Chwen Frank Lee
  • Publication number: 20240128381
    Abstract: A power diode device includes a substrate. The substrate includes a core layer of a first conductive type, a first diffusion layer of the first conductive type, a second diffusion layer of a second conductive type, and a heavily doped region of the second conductive type. The core layer is located between the first diffusion layer and the second diffusion layer. A thickness of the core layer is greater than that of the second diffusion layer. The heavily doped region is located in the second diffusion layer and extends toward the core layer to form a PN junction between the heavily doped region and the core layer. A method for manufacturing the power diode device is also provided.
    Type: Application
    Filed: June 2, 2023
    Publication date: April 18, 2024
    Inventors: Ching Chiu TSENG, Tzu Yuan LO, Chao Yi CHANG
  • Publication number: 20240113071
    Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.
    Type: Application
    Filed: January 5, 2023
    Publication date: April 4, 2024
    Inventors: Chung-Shi Liu, Mao-Yen Chang, Yu-Chia Lai, Kuo-Lung Pan, Hao-Yi Tsai, Ching-Hua Hsieh, Hsiu-Jen Lin, Po-Yuan Teng, Cheng-Chieh Wu, Jen-Chun Liao
  • Patent number: 11944412
    Abstract: A blood pressure detection device manufactured by a semiconductor process includes a substrate, a microelectromechanical element, a gas-pressure-sensing element, a driving-chip element, an encapsulation layer and a valve layer. The substrate includes inlet apertures. The microelectromechanical element and the gas-pressure-sensing element are stacked and integrally formed on the substrate. The encapsulation layer is encapsulated and positioned on the substrate. A flowing-channel space is formed above the microelectromechanical element and the gas-pressure-sensing element. The encapsulation layer includes an outlet aperture in communication with an airbag. The driving-chip element controls the microelectromechanical element, the gas-pressure-sensing element and valve units to transport gas.
    Type: Grant
    Filed: June 2, 2021
    Date of Patent: April 2, 2024
    Assignee: MICROJET TECHNOLOGY CO., LTD.
    Inventors: Hao-Jan Mou, Ying-Lun Chang, Ching-Sung Lin, Chi-Feng Huang, Yung-Lung Han, Chang-Yen Tsai, Wei-Ming Lee, Chun-Yi Kuo, Tsung-I Lin
  • Patent number: 11938272
    Abstract: The present invention discloses a respiratory mask to connect a user and a breathing tube for receiving a first gas and releasing a second gas, so as to provide an user's respiratory system to exchange gas. It comprises a main part, an air chamber exchange part, an insert and a clamping part. The main part provides a first, second, and third openings that are communicated each other. The first opening connects to the breathing tube to receive the first gas from the breathing tube. The air chamber exchange part provides an exhaust assembly to relieve pressure according to an internal air pressure of the air chamber exchange part. The insert connects to the user's nose so as to direct the first gas to the user or direct the second gas from the user to the air chamber exchange part. The clamping part connects to the user's mouth.
    Type: Grant
    Filed: January 29, 2020
    Date of Patent: March 26, 2024
    Assignee: MACKAY MEMORIAL HOSPITAL
    Inventors: Wen-Han Chang, Shih-Yi Lee, Ren-Jei Chung, Ching-Yu Kuo
  • Patent number: 11942451
    Abstract: A semiconductor structure includes a functional die, a dummy die, a redistribution structure, a seal ring and an alignment mark. The dummy die is electrically isolated from the functional die. The redistribution structure is disposed over and electrically connected to the functional die. The seal ring is disposed over the dummy die. The alignment mark is between the seal ring and the redistribution structure, wherein the alignment mark is electrically isolated from the dummy die, the redistribution structure and the seal ring. The insulating layer encapsulates the functional die and the dummy die.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Mao-Yen Chang, Yu-Chia Lai, Cheng-Shiuan Wong, Ting Hao Kuo, Ching-Hua Hsieh, Hao-Yi Tsai, Kuo-Lung Pan, Hsiu-Jen Lin
  • Publication number: 20240099154
    Abstract: A magnetoresistive random access memory (MRAM) device includes a first array region and a second array region on a substrate, a first magnetic tunneling junction (MTJ) on the first array region, a first top electrode on the first MTJ, a second MTJ on the second array region, and a second top electrode on the second MTJ. Preferably, the first top electrode and the second top electrode include different nitrogen to titanium (N/Ti) ratios.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 21, 2024
    Applicant: UNITED MICROELECTRONICS CORP
    Inventors: Hui-Lin Wang, Si-Han Tsai, Dong-Ming Wu, Chen-Yi Weng, Ching-Hua Hsu, Ju-Chun Fan, Yi-Yu Lin, Che-Wei Chang, Po-Kai Hsu, Jing-Yin Jhang
  • Patent number: 11916018
    Abstract: A connection structure of a semiconductor device is provided in the present invention. The connection structure includes an interlayer dielectric, a top metal structure, and a passivation layer. The interlayer dielectric is disposed on a substrate. The top metal structure is disposed on the interlayer dielectric. The top metal structure includes a bottom portion and a top portion disposed on the bottom portion. The bottom portion includes a first sidewall, and the top portion includes a second sidewall. A slope of the first sidewall is larger than a slope of the second sidewall. The passivation layer is conformally disposed on the second sidewall, the first sidewall, and a top surface of the interlayer dielectric.
    Type: Grant
    Filed: March 4, 2021
    Date of Patent: February 27, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chen-Yi Weng, Shih-Che Huang, Ching-Li Yang, Chih-Sheng Chang
  • Patent number: 11917923
    Abstract: A magnetoresistive random access memory (MRAM) structure, including a substrate and multiple MRAM cells on the substrate, wherein the MRAM cells are arranged in a memory region adjacent to a logic region. An ultra low-k (ULK) layer covers the MRAM cells, wherein the surface portion of ultra low-k layer is doped with fluorine, and dents are formed on the surface of ultra low-k layer at the boundaries between the memory region and the logic region.
    Type: Grant
    Filed: April 28, 2021
    Date of Patent: February 27, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Ching-Hua Hsu, Si-Han Tsai, Shun-Yu Huang, Chen-Yi Weng, Ju-Chun Fan, Che-Wei Chang, Yi-Yu Lin, Po-Kai Hsu, Jing-Yin Jhang, Ya-Jyuan Hung
  • Publication number: 20230233490
    Abstract: The disclosure provides methods for treating estrogen receptor positive (ER+) cancer in women with an effective amount of lasofoxifene, a pharmaceutically acceptable salt thereof, or a prodrug thereof. The disclosure also includes the detection of the Estrogen Receptor 1 (ESR1) gene mutations that lead to endocrine resistance and treatment of endocrine resistant ER+ cancers.
    Type: Application
    Filed: March 30, 2023
    Publication date: July 27, 2023
    Inventors: Kaitlyn ANDREANO, Ching-yi CHANG, Donald P. MCDONNELL, Stephanie L. GAILLARD
  • Publication number: 20230157995
    Abstract: The disclosure provides methods for treating estrogen receptor positive (ER+) cancer in women with an effective amount of lasofoxifene, a pharmaceutically acceptable salt thereof, or a prodrug thereof. The disclosure also includes the detection of the Estrogen Receptor 1 (ESR1) gene mutations that lead to endocrine resistance and treatment of endocrine resistant ER+ cancers.
    Type: Application
    Filed: September 22, 2022
    Publication date: May 25, 2023
    Inventors: Kaitlyn ANDREANO, Ching-yi CHANG, Donald P. McDONNELL, Stephanie L. GAILLARD
  • Patent number: 11497730
    Abstract: The disclosure provides methods for treating estrogen receptor positive (ER+) cancer in women with an effective amount of lasofoxifene, a pharmaceutically acceptable salt thereof, or a prodrug thereof. The disclosure also includes the detection of the Estrogen Receptor 1 (ESR1) gene mutations that lead to endocrine resistance and treatment of endocrine resistant ER+ cancers.
    Type: Grant
    Filed: April 9, 2019
    Date of Patent: November 15, 2022
    Assignee: Duke University
    Inventors: Kaitlyn Andreano, Ching-yi Chang, Donald P. McDonnell, Stephanie L. Gaillard
  • Patent number: 11467403
    Abstract: An operating method of an electronic system is provided. The operating method of the electronic system includes generating a first user input by a first input device and performing a first input control according to the first user input during a first input operation mode, determining whether a light intersection point of a ray emitted by a second input device with a virtual reality (VR) environment exists in the VR environment, switching to a second input operation mode in response to determining that the light intersection point of the ray with the VR environment exists in the VR environment and generating a second user input by the second input device and performing a second input control according to the second user input during the second input operation mode.
    Type: Grant
    Filed: August 20, 2020
    Date of Patent: October 11, 2022
    Assignee: HTC Corporation
    Inventor: Ching-Yi Chang