Abstract: A computing system including a water-resistant chassis, at least one electronic component with a heat sink, and a gap filler. The heat sink includes an arrangement of fins separated by inter-fin spaces. The gap filler is in contact with both the heat sink and the water-resistant chassis. The gap filler is positioned in the inter-fin spaces to provide a heat conduction path between the heat sink and the chassis.

Abstract: A dust-proof telecommunication system is disclosed. The dust-proof telecommunication system includes a chassis, critical components located within the chassis, and a filter module located within the chassis near at least some of the critical components that need to be cooled. For example, the critical components include a central processing unit (CPU), a system on chip (SoC), a memory module, a PCIe card, and/or a chipset. The filter module has a filter cover that surrounds at least in part the critical components, a first air filter located at an inlet of an airflow, and a second air filter located at an outlet. The critical components located at a protective space within the chassis receive and are cooled by the airflow passing through the air filter.

Abstract: A heat sink comprises a first portion and a second portion. The first portion is configured to contact a heat-generating electronic component. The first portion is formed from a first group of materials and has a first plurality of fins. The second portion is coupled to the first portion. The second portion is formed from a second group of materials and has a second plurality of fins. The second group of materials is different than the first group of materials. The first group of materials can include extruded aluminum, stamped aluminum, or both. The second group of materials can include die-cast metal. The first plurality of fins can have a smaller fin pitch than the second plurality of fins. The heat sink can further comprise a third portion coupled to the first portion, such that the first portion is positioned between the second portion and the third portion.

Abstract: A cooling assembly includes a primary plate, a secondary plate, and a padding layer. The primary plate includes a body, a first arm, and a second arm. The first arm and the second arm of the primary plate extend outwardly in opposite directions from the body of the primary plate. The secondary plate also includes a body, a first arm, and a second arm. The first arm and the second arm of the secondary plate extend outwardly in opposite directions from the body of the secondary plate. The padding layer is inserted between the primary plate and the secondary plate. The padding layer directly contacts a heat-generating electrical component secured between the primary plate and the secondary plate.

Abstract: Systems and methods are provided for controlling two or more PSUs of a server system. An exemplary method comprises first determining whether the PSUs are switched on to an AC power source. If the PSUs are found not switched on to an AC power source, the method further comprises restarting the AC power source for the PSUs and completing a software-based recovery process. If the PSUs are found to be switched on to an AC power source, the method further comprises determining whether the PSUs meet a predefined criterion. If the PSUs do meet a predefined criterion, the method further comprises disabling a cold-redundancy mode for the PSUs. If the PSUs do not meet a predefined criterion, the method further comprises starting a wake-up process for a first PSU from a cold-redundancy mode.

Abstract: Systems and methods are provided for controlling two or more PSUs of a server system. An exemplary method comprises first determining whether the PSUs are switched on to an AC power source. If the PSUs are found not switched on to an AC power source, the method further comprises restarting the AC power source for the PSUs and completing a software-based recovery process. If the PSUs are found to be switched on to an AC power source, the method further comprises determining whether the PSUs meet a predefined criterion. If the PSUs do meet a predefined criterion, the method further comprises disabling a cold-redundancy mode for the PSUs. If the PSUs do not meet a predefined criterion, the method further comprises starting a wake-up process for a first PSU from a cold-redundancy mode.

Abstract: A heat dissipation device includes a heat sink, a centrifugal fan, and a fixing member. The centrifugal fan is enclosed and attached to a heat sink by a fixing member. Air sucked into the centrifugal fan takes away from the heat sink the accumulated heat from an electrical component of an electronic device.

Abstract: An electronic device assembly includes a fan module, a frame, and a bottom plate of an electronic device enclosure. The fan module includes a cover, a fan secured to the cover. The frame is secured to the bottom plate. The cover is secured to the frame. The frame, the cover, and the bottom plate define a receiving space receiving the fan.

Abstract: A enclosure assembly includes a plurality of trays. Each of the plurality of trays includes a first sidewall and a second sidewall opposite to the first sidewall. A plurality of engaging posts are located on the first sidewall, and a plurality of engaging holes is defined in the second sidewall. Each of the four engaging posts in one of the trays is engaged in each of the plurality of engaging holes in another one of the trays, so that two adjacent trays can be engaged to each other without screws or bolts, and it is very convenient for an end user to expand the capacity of the enclosure assembly.

Abstract: A screw assembly includes a screw, a spring, and a mounting panel. The screw comprises a head portion and a shaft portion extending from the head portion. The spring comprises a spring body and a securing end extending from the spring body. The spring body defines a surrounding opening. The mounting panel defines a through hole corresponding to the surrounding opening. The mounting panel comprises a positioning portion. The shaft portion is located in the surrounding opening and the through hole. The spring is located between the head portion and the mounting panel. The positioning portion is configured to resist the securing end to prevent the spring from rotating.

Abstract: A screw assembly includes a screw, a spring, and a mounting panel. The screw comprises a head portion and a shaft portion extending from the head portion. The spring comprises a spring body and a securing end extending from the spring body. The spring body defines a surrounding opening. The mounting panel defines a through hole corresponding to the surrounding opening. The mounting panel comprises a positioning portion. The shaft portion is located in the surrounding opening and the through hole. The spring is located between the head portion and the mounting panel. The positioning portion is configured to resist the securing end to prevent the spring from rotating.

Abstract: A heat dissipation device includes a centrifugal fan and a fin assembly aside the centrifugal fan. The centrifugal fan includes a casing and an impeller received in the casing, the casing defines an air outlet at one side thereof. The fin assembly is located at the air outlet of the centrifugal fan. The fin assembly includes a plurality of fins parallel to and spaced from each other. Each of the fins includes a main body and an extending portion extending form the main body toward the air outlet of the centrifugal fan. Each extending portion includes a side edge facing the air outlet of the centrifugal fan, the side edge is arc shaped and inwardly concaved toward the main body.