Patents by Inventor Ching-Yu Tsai

Ching-Yu Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240176093
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Application
    Filed: February 5, 2024
    Publication date: May 30, 2024
    Inventors: Chao-Chang HU, Chih-Wei WENG, Chia-Che WU, Chien-Yu KAO, Hsiao-Hsin HU, He-Ling CHANG, Chao-Hsi WANG, Chen-Hsien FAN, Che-Wei CHANG, Mao-Gen JIAN, Sung-Mao TSAI, Wei-Jhe SHEN, Yung-Ping YANG, Sin-Hong LIN, Tzu-Yu CHANG, Sin-Jhong SONG, Shang-Yu HSU, Meng-Ting LIN, Shih-Wei HUNG, Yu-Huai LIAO, Mao-Kuo HSU, Hsueh-Ju LU, Ching-Chieh HUANG, Chih-Wen CHIANG, Yu-Chiao LO, Ying-Jen WANG, Shu-Shan CHEN, Che-Hsiang CHIU
  • Publication number: 20240179699
    Abstract: The present invention provides a control method of an electronic device, wherein the control method includes the steps of: using a first beacon setting to transmit beacons; if a wireless communication state of the electronic device satisfies a condition, using a second beacon setting to transmit beacons; wherein the first beacon setting and the second beacon setting have different beacon periods or different payload sizes.
    Type: Application
    Filed: November 28, 2023
    Publication date: May 30, 2024
    Applicant: MEDIATEK INC.
    Inventors: Ming-Yen Tsai, Tsung-Hsuan Wu, Ching-Yu Kuo
  • Patent number: 11996293
    Abstract: A semiconductor device includes a substrate, a first semiconductor fin and a second semiconductor fin protruding from the substrate, an isolation feature disposed on the substrate and on sidewalls of the first and second semiconductor fins, a gate structure disposed on the isolation feature. The semiconductor device also includes a dielectric fin disposed on the isolation feature and sandwiched between the first and second semiconductor fins. A middle portion of the dielectric fin separates the gate structure into a first gate structure segment engaging the first semiconductor fin and a second gate structure segment engaging the second semiconductor fin.
    Type: Grant
    Filed: August 2, 2021
    Date of Patent: May 28, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Pei-Yu Wang, Zhi-Chang Lin, Ching-Wei Tsai, Kuan-Lun Cheng
  • Publication number: 20240160078
    Abstract: A light source device includes a light emitting element and a fluorescent portion. The light emitting element is configured to emit light. The fluorescent portion is disposed on the light emitting element. The fluorescent portion is configured to transform the light into illumination light. In the spectrum of the illuminating light, the energy in red band is in a range from 25% to 45% of the energy in full band.
    Type: Application
    Filed: July 20, 2023
    Publication date: May 16, 2024
    Inventors: Yi-Yu TSAI, Ching-Huan LIAO
  • Patent number: 11972537
    Abstract: A method for flattening a three-dimensional shoe upper template is provided. The method includes providing a three-dimensional last model, obtaining a three-dimensional grid model, obtaining a three-dimensional thickened grid model, obtaining a two-dimensional initial-value grid model, and obtaining a two-dimensional grid model with the smallest energy value. A system and a non-transitory computer-readable medium for performing the method are also provided. The method makes it possible to precisely flatten a three-dimensional last model with a non-developable surface and thereby convert the three-dimensional last model into a two-dimensional grid model.
    Type: Grant
    Filed: August 19, 2022
    Date of Patent: April 30, 2024
    Assignee: YU JUNG CHANG TECHNOLOGY CO., LTD.
    Inventors: Chih-Chuan Chen, Wei-Hsiang Tsai, Chin-Yu Chen, Ching-Cherng Sun, Jann-Long Chern, Yu-Kai Lin
  • Patent number: 11964358
    Abstract: A method includes placing a polisher head on platen, the polisher head including a set of first magnets, and controlling a set of second magnets to rotate the polisher head on the platen, wherein controlling the set of second magnets includes reversing the polarity of at least one second magnet of the set of second magnets to produce a magnetic force on at least one first magnet of the set of first magnets, wherein the set of second magnets are external to the polisher head.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shang-Yu Wang, Chun-Hao Kung, Ching-Hsiang Tsai, Kei-Wei Chen, Hui-Chi Huang
  • Patent number: 11965069
    Abstract: A heat-shrinkable polyester film made of a polyester-forming resin composition includes a recycled material, and has an exothermic crystallization peak and an endothermic melting peak which are determined via differential scanning calorimetry, and which satisfy relationships of T2?T1?68° C. and T3?T2?78° C., where T1 represents an onset point of the exothermic crystallization peak, T2 represents an end point of the exothermic crystallization peak and an onset point of the endothermic melting peak, and T3 represents an end point of the endothermic melting peak. A method for manufacturing the heat-shrinkable polyester film is also disclosed.
    Type: Grant
    Filed: February 5, 2021
    Date of Patent: April 23, 2024
    Assignee: FAR EASTERN NEW CENTURY CORPORATION
    Inventors: Li-Ling Chang, Yow-An Leu, Ting-Yu Lin, Ching-Chun Tsai, Wen-Yi Chang
  • Publication number: 20240105850
    Abstract: Semiconductor device and the manufacturing method thereof are disclosed herein. An exemplary semiconductor device comprises a semiconductor fin disposed over a substrate, wherein the semiconductor fin includes a channel region and a source/drain region; a gate structure disposed over the channel region of the semiconductor fin, wherein the gate structure includes a gate spacer and a gate stack; a source/drain structure disposed over the source/drain region of the semiconductor fin; and a fin top hard mask vertically interposed between the gate spacer and the semiconductor fin, wherein the fin top hard mask includes a dielectric layer, and wherein a sidewall of the fin top hard mask directly contacts the gate stack, and another sidewall of the fin top hard mask directly contacts the source/drain structure.
    Type: Application
    Filed: November 28, 2023
    Publication date: March 28, 2024
    Inventors: Che-Yu Yang, Kai-Chieh Yang, Ching-Wei Tsai, Kuan-Lun Cheng
  • Publication number: 20240096756
    Abstract: A method of making a semiconductor device includes manufacturing a first transistor over a first side of a substrate. The method further includes depositing a spacer material against a sidewall of the first transistor. The method further includes recessing the spacer material to expose a first portion of the sidewall of the first transistor. The method further includes manufacturing a first electrical connection to the transistor, a first portion of the electrical connection contacts a surface of the first transistor farthest from the substrate, and a second portion of the electrical connect contacts the first portion of the sidewall of the first transistor. The method further includes manufacturing a self-aligned interconnect structure (SIS) extending along the spacer material, wherein the spacer material separates a portion of the SIS from the first transistor, and the first electrical connection directly contacts the SIS.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 21, 2024
    Inventors: Chih-Yu LAI, Chih-Liang CHEN, Chi-Yu LU, Shang-Syuan CIOU, Hui-Zhong ZHUANG, Ching-Wei TSAI, Shang-Wen CHANG
  • Publication number: 20240099154
    Abstract: A magnetoresistive random access memory (MRAM) device includes a first array region and a second array region on a substrate, a first magnetic tunneling junction (MTJ) on the first array region, a first top electrode on the first MTJ, a second MTJ on the second array region, and a second top electrode on the second MTJ. Preferably, the first top electrode and the second top electrode include different nitrogen to titanium (N/Ti) ratios.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 21, 2024
    Applicant: UNITED MICROELECTRONICS CORP
    Inventors: Hui-Lin Wang, Si-Han Tsai, Dong-Ming Wu, Chen-Yi Weng, Ching-Hua Hsu, Ju-Chun Fan, Yi-Yu Lin, Che-Wei Chang, Po-Kai Hsu, Jing-Yin Jhang
  • Patent number: 11934027
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: March 19, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
  • Publication number: 20240088030
    Abstract: Provided are semiconductor devices that include a first gate structure having a first end cap portion, a second gate structure having a second end cap portion coaxial with the first gate structure, a first dielectric region separating the first end cap portion and the second end cap portion, a first conductive element extending over the first gate structure, a second conductive element extending over the second gate structure, and a gate via electrically connecting the second gate structure and the second conductive element, with the first dielectric region having a first width and being positioned at least partially under the first conductive element and defines a spacing between the gate via and an end of the second end cap portion that exceeds a predetermined distance.
    Type: Application
    Filed: January 23, 2023
    Publication date: March 14, 2024
    Inventors: Chin-Liang CHEN, Chi-Yu LU, Ching-Wei TSAI, Chun-Yuan CHEN, Li-Chun TIEN
  • Patent number: 11923457
    Abstract: Semiconductor device and the manufacturing method thereof are disclosed herein. An exemplary semiconductor device comprises a semiconductor fin disposed over a substrate, wherein the semiconductor fin includes a channel region and a source/drain region; a gate structure disposed over the channel region of the semiconductor fin, wherein the gate structure includes a gate spacer and a gate stack; a source/drain structure disposed over the source/drain region of the semiconductor fin; and a fin top hard mask vertically interposed between the gate spacer and the semiconductor fin, wherein the fin top hard mask includes a dielectric layer, and wherein a sidewall of the fin top hard mask directly contacts the gate stack, and another sidewall of the fin top hard mask directly contacts the source/drain structure.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: March 5, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Che-Yu Yang, Kai-Chieh Yang, Ching-Wei Tsai, Kuan-Lun Cheng
  • Patent number: 11917923
    Abstract: A magnetoresistive random access memory (MRAM) structure, including a substrate and multiple MRAM cells on the substrate, wherein the MRAM cells are arranged in a memory region adjacent to a logic region. An ultra low-k (ULK) layer covers the MRAM cells, wherein the surface portion of ultra low-k layer is doped with fluorine, and dents are formed on the surface of ultra low-k layer at the boundaries between the memory region and the logic region.
    Type: Grant
    Filed: April 28, 2021
    Date of Patent: February 27, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Ching-Hua Hsu, Si-Han Tsai, Shun-Yu Huang, Chen-Yi Weng, Ju-Chun Fan, Che-Wei Chang, Yi-Yu Lin, Po-Kai Hsu, Jing-Yin Jhang, Ya-Jyuan Hung
  • Patent number: 11916128
    Abstract: The present disclosure provides a method of forming a semiconductor device including an nFET structure and a pFET structure where each of the nFET and pFET structures include a semiconductor substrate and a gate trench. The method includes depositing an interfacial layer in each gate trench, depositing a first ferroelectric layer over the interfacial layer, removing the first ferroelectric layer from the nFET structure, depositing a metal oxide layer in each gate trench, depositing a second ferroelectric layer over the metal oxide layer, removing the second ferroelectric layer from the pFET structure, and depositing a gate electrode in each gate trench.
    Type: Grant
    Filed: February 27, 2023
    Date of Patent: February 27, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Min Cao, Pei-Yu Wang, Sai-Hooi Yeong, Ching-Wei Tsai, Kuan-Lun Cheng, Chih-Hao Wang
  • Publication number: 20230417968
    Abstract: A display module has a touch display area, a non-touch display area and a frame area surrounding them. The display module includes a cover plate, an ink layer, a touch display panel, a non-touch display panel and an optical matching layer. The ink layer is disposed on the cover plate and corresponds to the frame area. The touch display panel and the non-touch display panel are disposed on a side of the ink layer opposite to the cover plate and respectively correspond to the touch display area and the non-touch display area. The optical matching layer is disposed between the cover plate and one of the touch display panel and the non-touch display panel. A difference of average reflectance to external light between any two of the above areas is less than 1.5%, and a chromaticity difference between any two of the above areas is less than 1.5.
    Type: Application
    Filed: May 19, 2023
    Publication date: December 28, 2023
    Applicant: HENGHAO TECHNOLOGY CO., LTD.
    Inventors: Wen-Jung Tsai, Hui-Jung Tsai, Ching-Yu Tsai
  • Patent number: 9104844
    Abstract: A platform and a method for dynamic software license are disclosed. The dynamic software license platform comprises a license pool, a register manager, a user configure unit and a license manager. The register manager receives a software application from a user end. The user configure unit grants a setting permission to the user end in response to the software application, and allows the user end to submit a license setting according to the setting permission. The license manager adds the software license provided by the software supplier to the license pool, and dynamically provides the software license from the license pool unit according to the license setting.
    Type: Grant
    Filed: August 3, 2012
    Date of Patent: August 11, 2015
    Assignee: QUANTA COMPUTER INC.
    Inventors: Tien-Chin Fang, Ching-Yu Tsai, Ming-Jen Chen, Hung-Yu Yang, Chia-Hung Lin, Chen-Chung Lee
  • Publication number: 20150081811
    Abstract: The present invention discloses a method for providing a message to a mobile communication device. The method includes the following steps: a dispatched message is received from a service-providing server through a message-dispatching server. The dispatched message includes identification information of at least one message receiver. Rule-operating and message-processing are performed to the dispatched message through the message-dispatching server after a fixed time period from a time at which the dispatched message is received. The rule-operated and message-processed dispatched message is displayed on a display unit of a mobile communication device through the message-dispatching server. The mobile communication device logs in with the identification information of the message receiver.
    Type: Application
    Filed: March 3, 2014
    Publication date: March 19, 2015
    Applicant: QUANTA COMPUTER INC.
    Inventors: Tien-Chin FANG, Chen-Chung LEE, Ping-Chi LAI, Chia-Hung LIN, Ming-Jen CHEN, Ching-Wen LIN, Ching-Yu TSAI
  • Patent number: 8942362
    Abstract: A communication administration system includes: a administration system, for managing basis information of at least one user; and a service system, for fetching basic information and current location information of a called party from the administration system in response to a communication request from a calling party, obtaining current location information and preference information of the called party from the called party, and generating a communication mechanism scenario according to a communication mechanism system for the calling party to make a selection and to make a call accordingly.
    Type: Grant
    Filed: October 8, 2013
    Date of Patent: January 27, 2015
    Assignee: Quanta Computer Inc.
    Inventors: Tien-Chin Fang, Chen-Chung Lee, Ping-Chi Lai, Chia-Hung Lin, Ming-Jen Chen, Ching-Wen Lin, Ching-Yu Tsai
  • Publication number: 20140369482
    Abstract: A communication administration system includes: a administration system, for managing basis information of at least one user; and a service system, for fetching basic information and current location information of a called party from the administration system in response to a communication request from a calling party, obtaining current location information and preference information of the called party from the called party, and generating a communication mechanism scenario according to a communication mechanism system for the calling party to make a selection and to make a call accordingly.
    Type: Application
    Filed: October 8, 2013
    Publication date: December 18, 2014
    Applicant: QUANTA COMPUTER INC.
    Inventors: Tien-Chin FANG, Chen-Chung LEE, Ping-Chi LAI, Chia-Hung LIN, Ming-Jen CHEN, Ching-Wen LIN, Ching-Yu TSAI