Abstract: A purifying method of removing yttrium from a yttrium-containing europium oxide, including the steps of (A) dissolving a yttrium-containing europium oxide in a solvent to produce a saturated yttrium-containing europium compound solution; (B) performing a low-temperature recrystallization treatment on the saturated yttrium-containing europium compound solution to produce a europium-containing precipitate; (C) calcining the europium-containing precipitate, followed by dissolving the calcined europium-containing precipitate in an inorganic acid to produce a europium-containing metal functioning as an electrolyte; and (D) performing an electrochemical reduction process on the electrolyte which the europium-containing metal functions as, followed by introducing a precipitant thereto to produce a europium compound.

Abstract: A method of purifying yttrium involves purifying element yttrium by high-temperature saturated dissolution, low-temperature recrystallization, high-temperature reduction and vaporization-based removal of impurities, in a simple manner, and at a low cost, such that yttrium element is unlikely to be contaminated by any raw material used in a manufacturing process.

Abstract: A method of purifying yttrium involves purifying element yttrium by high-temperature saturated dissolution, low-temperature recrystallization, high-temperature reduction and vaporization-based removal of impurities, in a simple manner, and at a low cost, such that yttrium element is unlikely to be contaminated by any raw material used in a manufacturing process.

Abstract: A circuit structure of a test-key and a test method thereof are provided. The circuit structure comprises a plurality of transistors, a first conductive contact, a plurality of second conductive contacts and a plurality of third conductive contacts. The transistors are arranged in a matrix. The first conductive contact is electrically connected to one source/drain of each transistor in each column of the matrix. Each second conductive contact is electrically connected to the other source/drain of each transistor in a corresponding column of the matrix. Each third conductive contact is electrically connected to the gate of each transistor in a corresponding row of the matrix. In the method, a plurality of driving pulses are provided to the third conductive contacts in sequence, and a plurality of output signals are read from the second conductive contacts to perform an element-character analyzing operation when a row of the transistors is turned on.

Abstract: Disclosed is a method for making absorbent for metal. In the method, at first, solution of first monomer and solution of second monomer are provided. Then, the solution of the second monomer is introduced into the solution of the first monomer. Finally, a microwave reaction is executed to provide micro-alls of absorbent for metal.

Abstract: A fret saw includes a cutting wire and fixed abrasive grains provided on the cutting wire by electroplating. Each of the fixed abrasive grains includes a core and a hard film coated on the core. The core is 1 to 60 micrometers in diameter. The core is made of a material selected from the group consisting of a Ti metal and a Ti alloy. The hard film is 1 to 40 micrometers thick. The hard film covers about 30% to 90% of the surface of the core.

Abstract: A fret saw includes a cutting wire and fixed abrasive grains provided on the cutting wire by electroplating. Each of the fixed abrasive grains includes a core and a hard film coated on the core. The core is 1 to 60 micrometers in diameter. The core is made of a material selected from the group consisting of a Ti metal and a Ti alloy. The hard film is 1 to 40 micrometers thick. The hard film covers about 30% to 90% of the surface of the core.

Abstract: A circuit structure of a test-key and a test method thereof are provided. The circuit structure comprises a plurality of transistors, a first conductive contact, a plurality of second conductive contacts and a plurality of third conductive contacts. The transistors are arranged in a matrix. The first conductive contact is electrically connected to one source/drain of each transistor in each column of the matrix. Each second conductive contact is electrically connected to the other source/drain of each transistor in a corresponding column of the matrix. Each third conductive contact is electrically connected to the gate of each transistor in a corresponding row of the matrix. In the method, a plurality of driving pulses are provided to the third conductive contacts in sequence, and a plurality of output signals are read from the second conductive contacts to perform an element-character analyzing operation when a row of the transistors is turned on.

Abstract: Disclosed is a method for making absorbent for metal. In the method, at first, solution of first monomer and solution of second monomer are provided. Then, the solution of the second monomer is introduced into the solution of the first monomer. Finally, a microwave reaction is executed to provide micro-alls of absorbent for metal.

Abstract: A method and apparatus for making a fixed abrasive grain wire includes, at first, inserting a wire through a sleeve that includes at least one aperture defined therein. Then, both of the wire and the sleeve are located in electroplating or electro-less plating liquid that includes abrasive grains blended therein. Finally, electroplating or electro-less plating is executed to fix some of the abrasive grains to the wire.

Abstract: The invention discloses a metal pattern formation system produced in the following steps: an organic liquid is first printed on a substrate to form a base pattern. A metal is then evaporated to generate several metal particles for covering the printed substrate. At last, the substrate is heated to vaporize the base pattern, and the metal particles adhered to the substrate forms a metal pattern complementary to the base pattern.

Abstract: The invention discloses a metal pattern formation method including the following steps. At first, an organic liquid is printed on a substrate to form a base pattern. Afterward, a metal is evaporated to generate several metal particles for covering the printed substrate. At last, the substrate is heated to vaporize the base pattern, and the metal particles adhered to the substrate forms a metal pattern complementary to the base pattern.

Abstract: A structure of an electromagnetic shield layer for a plasma display panel and a method for manufacturing the same. The manufacturing method of the electromagnetic shield layer uses integrated technologies of hot embossing, coating, and electroplating. The structure according to the present invention is a metal layer with an electromagnetic-wave shielding effect and is built in a plastic material. The aspect ratios of the geometric patterns on the metal layer are above 75%.