Patents by Inventor Ching-Yu WANG
Ching-Yu WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240151346Abstract: A container for containing food or liquid is provided. The container includes a body portion, a lid and an attachment. The lid is detachably disposed on the body portion. The attachment is configured to be disposed on the lid or the body portion and includes a magnetic attraction member and a connecting structure. The magnetic attraction member is adapted to be magnetically connected to a mobile electronic device. The connecting structure is disposed between the magnetic attraction member and the container for selectively fixing the magnetic attraction member at a first position or a second position. The connecting structure includes a fastening member, and the fastening member is adapted to be detachably fastened to the body portion or the lid.Type: ApplicationFiled: June 9, 2023Publication date: May 9, 2024Inventors: JUI-CHEN LU, CHING-YU WANG, YU-TING HUNG, YU-CHANG CHIANG, CHENG-CHE HO
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Publication number: 20240148129Abstract: A mobile device attachment adapted for a mobile device and a container for food or liquid is provided. The mobile device attachment includes a magnetic connecting member and a connecting member. The magnetic connecting member is selectively magnetically connected to the mobile device and adapted to extend in an escaping direction. The connecting member is disposed between the container and the magnetic connecting member. The mobile device has an image capturing range. When the magnetic connecting member extends in the escaping direction, the container, the magnetic connecting member and the connecting member are located outside the image capturing range. Besides, a container including the mobile device attachment is also provided.Type: ApplicationFiled: November 1, 2023Publication date: May 9, 2024Inventors: CHING-FU WANG, CHING-YU WANG, CHE-WEI HSU, JUI-CHEN LU, CHENG-CHE HO
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Publication number: 20240154469Abstract: A container for containing food or liquid is provided. The container includes a body portion, a lid and an attachment. The lid is detachably disposed on the body portion. The attachment includes a magnetic attraction member and a connecting structure. The magnetic attraction member is independent from the lid and adapted to be magnetically connected to a mobile electronic device. The connecting structure is disposed between the magnetic attraction member and the container for selectively fixing the magnetic attraction member at a first position or a second position. At least a portion of the connecting structure is fixed to the container.Type: ApplicationFiled: May 17, 2023Publication date: May 9, 2024Inventors: JUI-CHEN LU, CHING-YU WANG, YU-TING HUNG, YU-CHANG CHIANG, CHENG-CHE HO
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Patent number: 11964358Abstract: A method includes placing a polisher head on platen, the polisher head including a set of first magnets, and controlling a set of second magnets to rotate the polisher head on the platen, wherein controlling the set of second magnets includes reversing the polarity of at least one second magnet of the set of second magnets to produce a magnetic force on at least one first magnet of the set of first magnets, wherein the set of second magnets are external to the polisher head.Type: GrantFiled: March 19, 2021Date of Patent: April 23, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Shang-Yu Wang, Chun-Hao Kung, Ching-Hsiang Tsai, Kei-Wei Chen, Hui-Chi Huang
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Publication number: 20240130038Abstract: A transmission device for suppressing the glass-fiber effect includes a circuit board and a transmission line. The circuit board includes a plurality of glass fibers, so as to define a fiber pitch. The transmission line is disposed on the circuit board. The transmission line includes a plurality of non-parallel segments. Each of the non-parallel segments of the transmission line has an offset distance with respect to a reference line. The offset distance is longer than or equal to a half of the fiber pitch.Type: ApplicationFiled: November 23, 2022Publication date: April 18, 2024Applicants: UNIMICRON TECHNOLOGY CORP., National Taiwan UniversityInventors: Chin-Hsun WANG, Ruey-Beei Wu, Ching-Sheng Chen, Chun-Jui Hung, Wei-Yu Liao, Chi-Min Chang
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Publication number: 20240130246Abstract: A method for fabricating a semiconductor device includes the steps of first forming a first inter-metal dielectric (IMD) layer on a substrate and a metal interconnection in the first IMD layer, forming a magnetic tunneling junction (MTJ) and a top electrode on the metal interconnection, forming a spacer adjacent to the MTJ and the top electrode, forming a second IMD layer around the spacer, forming a cap layer on the top electrode, the spacer, and the second IMD layer, and then patterning the cap layer to form a protective cap on the top electrode and the spacer.Type: ApplicationFiled: December 25, 2023Publication date: April 18, 2024Applicant: UNITED MICROELECTRONICS CORP.Inventors: Hui-Lin Wang, Po-Kai Hsu, Ju-Chun Fan, Ching-Hua Hsu, Yi-Yu Lin, Hung-Yueh Chen
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Patent number: 11957061Abstract: A semiconductor device includes a substrate, a first dielectric layer, a second dielectric layer, and a third dielectric layer. The first dielectric layer is disposed on the substrate, around a first metal interconnection. The second dielectric layer is disposed on the first dielectric layer, around a via and a second metal interconnection. The second metal interconnection directly contacts the first metal interconnection. The third dielectric layer is disposed on the second dielectric layer, around a first magnetic tunneling junction (MTJ) structure and a third metal interconnection. The third metal interconnection directly contacts top surfaces of the first MTJ structure and the second metal interconnection, and the first MTJ structure directly contacts the via.Type: GrantFiled: May 23, 2023Date of Patent: April 9, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Hui-Lin Wang, Po-Kai Hsu, Ju-Chun Fan, Yi-Yu Lin, Ching-Hua Hsu, Hung-Yueh Chen
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Patent number: 11948949Abstract: In some embodiments, the present disclosure relates to a device having a semiconductor substrate including a frontside and a backside. On the frontside of the semiconductor substrate are a first source/drain region and a second source/drain region. A gate electrode is arranged on the frontside of the semiconductor substrate and includes a horizontal portion, a first vertical portion, and a second vertical portion. The horizontal portion is arranged over the frontside of the semiconductor substrate and between the first and second source/drain regions. The first vertical portion extends from the frontside towards the backside of the semiconductor substrate and contacts the horizontal portion of the gate electrode structure. The second vertical portion extends from the frontside towards the backside of the semiconductor substrate, contacts the horizontal portion of the gate electrode structure, and is separated from the first vertical portion by a channel region of the substrate.Type: GrantFiled: July 15, 2022Date of Patent: April 2, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chun-Yuan Chen, Ching-Chun Wang, Hsiao-Hui Tseng, Jen-Cheng Liu, Jhy-Jyi Sze, Shyh-Fann Ting, Wei Chuang Wu, Yen-Ting Chiang, Chia Ching Liao, Yen-Yu Chen
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Patent number: 11948798Abstract: A method for manufacturing an integrated circuit includes patterning a plurality of photomask layers over a substrate, partially backfilling the patterned plurality of photomask layers with a first material using atomic layer deposition, completely backfilling the patterned plurality of photomask layers with a second material using atomic layer deposition, removing the plurality of photomask layers to form a masking structure comprising at least one of the first and second materials, and transferring a pattern formed by the masking structure to the substrate and removing the masking structure. The first material includes a silicon dioxide, silicon carbide, or carbon material, and the second material includes a metal oxide or metal nitride material.Type: GrantFiled: July 16, 2021Date of Patent: April 2, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ching-Yu Chang, Jung-Hau Shiu, Jen Hung Wang, Tze-Liang Lee
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Publication number: 20240096498Abstract: A method for evaluating a risk of a subject getting a specific disease includes steps of: storing a reference database that contains original parameter sets; selecting target alleles from an SNP profile derived from genome sequencing data of a subject; selecting target parameter sets from among the original parameter sets; calculating, for each of the target parameter sets, a race factor based on a global risk allele frequency and a group-specific risk allele frequency included in the target parameter set; calculating a genetic factor based on statistics, global reference allele frequencies, the race factors for the target parameter sets, and numbers of chromosomes in homologous chromosome pairs included in the target parameter sets; calculating a citation factor based on numbers of citation times included in the target parameter sets; and calculating a risk score based on the genetic factor and the citation factor.Type: ApplicationFiled: August 28, 2023Publication date: March 21, 2024Inventors: Yi-Ting CHEN, Sing-Han HUANG, Ching-Yung LIN, Xiang-Yu LIN, Cheng-Tang WANG, Raksha NANDANAHOSUR RAMESH, Pei-Hsin CHEN
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Publication number: 20240099154Abstract: A magnetoresistive random access memory (MRAM) device includes a first array region and a second array region on a substrate, a first magnetic tunneling junction (MTJ) on the first array region, a first top electrode on the first MTJ, a second MTJ on the second array region, and a second top electrode on the second MTJ. Preferably, the first top electrode and the second top electrode include different nitrogen to titanium (N/Ti) ratios.Type: ApplicationFiled: November 21, 2023Publication date: March 21, 2024Applicant: UNITED MICROELECTRONICS CORPInventors: Hui-Lin Wang, Si-Han Tsai, Dong-Ming Wu, Chen-Yi Weng, Ching-Hua Hsu, Ju-Chun Fan, Yi-Yu Lin, Che-Wei Chang, Po-Kai Hsu, Jing-Yin Jhang
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Patent number: 11934027Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.Type: GrantFiled: June 21, 2022Date of Patent: March 19, 2024Assignee: TDK TAIWAN CORP.Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
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Publication number: 20240077349Abstract: A server includes a chassis, an air duct, a sensing module and a board management controller. The air duct is disposed in the chassis. The sensing module is disposed in the chassis. The sensing module senses whether the air duct is correctly installed. The board management controller is disposed in the chassis and coupled to the sensing module. When the air duct is not correctly installed, the sensing module notifies the board management controller to generate a warning message.Type: ApplicationFiled: October 3, 2022Publication date: March 7, 2024Applicant: Wiwynn CorporationInventors: Po-Sheng Su, Ching-Wen Hsiao, Hsien-Yu Wang, Tzu-Shun Wang
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Patent number: 11925035Abstract: A hybrid random access memory for a system-on-chip (SOC), including a semiconductor substrate with a MRAM region and a ReRAM region, a first dielectric layer on the semiconductor substrate, multiple ReRAM cells in the first dielectric layer on the ReRAM region, a second dielectric layer above the first dielectric layer, and multiple MRAM cells in the second dielectric layer on the MRAM region.Type: GrantFiled: October 26, 2022Date of Patent: March 5, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Po-Kai Hsu, Hui-Lin Wang, Ching-Hua Hsu, Yi-Yu Lin, Ju-Chun Fan, Hung-Yueh Chen
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Patent number: 11917923Abstract: A magnetoresistive random access memory (MRAM) structure, including a substrate and multiple MRAM cells on the substrate, wherein the MRAM cells are arranged in a memory region adjacent to a logic region. An ultra low-k (ULK) layer covers the MRAM cells, wherein the surface portion of ultra low-k layer is doped with fluorine, and dents are formed on the surface of ultra low-k layer at the boundaries between the memory region and the logic region.Type: GrantFiled: April 28, 2021Date of Patent: February 27, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Hui-Lin Wang, Ching-Hua Hsu, Si-Han Tsai, Shun-Yu Huang, Chen-Yi Weng, Ju-Chun Fan, Che-Wei Chang, Yi-Yu Lin, Po-Kai Hsu, Jing-Yin Jhang, Ya-Jyuan Hung
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Patent number: 11916128Abstract: The present disclosure provides a method of forming a semiconductor device including an nFET structure and a pFET structure where each of the nFET and pFET structures include a semiconductor substrate and a gate trench. The method includes depositing an interfacial layer in each gate trench, depositing a first ferroelectric layer over the interfacial layer, removing the first ferroelectric layer from the nFET structure, depositing a metal oxide layer in each gate trench, depositing a second ferroelectric layer over the metal oxide layer, removing the second ferroelectric layer from the pFET structure, and depositing a gate electrode in each gate trench.Type: GrantFiled: February 27, 2023Date of Patent: February 27, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTDInventors: Min Cao, Pei-Yu Wang, Sai-Hooi Yeong, Ching-Wei Tsai, Kuan-Lun Cheng, Chih-Hao Wang
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Patent number: 11496677Abstract: A signal control module integrated to a low coherence interferometry including a one-dimensional (1D) array image sensor is provided. The signal control module includes an image acquisition controller and a signal controller. The image acquisition controller sends a 1D image acquisition control signal. The signal controller sends a two-dimensional (2D) image acquisition control signal, wherein the 1D and 2D image acquisition control signals are synchronized with each other. The 1D array image sensor captures 1D image information of an object-to-be-tested at different positions along a direction according to the 1D and 2D image acquisition control signals. The 1D image information constitutes 2D image information. Furthermore, a low coherence interferometry is provided.Type: GrantFiled: September 15, 2020Date of Patent: November 8, 2022Assignee: National Taiwan UniversityInventors: Hsiang-Chieh Lee, Ting-Hao Chen, Ting-Yen Tsai, Chuan-Bor Chueh, Yu-Wei Chang, Ching-Yu Wang
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Publication number: 20220078341Abstract: A signal control module integrated to a low coherence interferometry including a one-dimensional (1D) array image sensor is provided. The signal control module includes an image acquisition controller and a signal controller. The image acquisition controller sends a 1D image acquisition control signal. The signal controller sends a two-dimensional (2D) image acquisition control signal, wherein the 1D and 2D image acquisition control signals are synchronized with each other. The 1D array image sensor captures 1D image information of an object-to-be-tested at different positions along a direction according to the 1D and 2D image acquisition control signals. The 1D image information constitutes 2D image information. Furthermore, a low coherence interferometry is provided.Type: ApplicationFiled: September 15, 2020Publication date: March 10, 2022Applicant: National Taiwan UniversityInventors: Hsiang-Chieh Lee, Ting-Hao Chen, Ting-Yen Tsai, Chuan-Bor Chueh, Yu-Wei Chang, Ching-Yu Wang
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Patent number: 11108393Abstract: An optical keyswitch includes a keycap, a supporting mechanism having a protrusion disposed under the keycap to support the keycap to move downward or upward, and a switch module including a circuit board, an emitter, and a receiver. The emitter and the receiver are electrically connected to the circuit board. The emitter emits an optical signal to the receiver. When the keycap is not pressed, the receiver receives the optical signal of a first intensity. When the keycap is pressed, the protrusion moves along with the keycap, and the protrusion changes the optical signal received by the receiver to have a second intensity different from the first intensity, so the switch module is triggered to generate a triggering signal.Type: GrantFiled: January 4, 2019Date of Patent: August 31, 2021Assignee: DARFON ELECTRONICS CORP.Inventors: Chen Yang, Yu-Chun Hsieh, Yung-Chih Wang, Chia-Hung Liu, Ching-Yu Wang, Li-Te Chang
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Publication number: 20190238131Abstract: An optical keyswitch includes a keycap, a supporting mechanism having a protrusion disposed under the keycap to support the keycap to move downward or upward, and a switch module including a circuit board, an emitter, and a receiver. The emitter and the receiver are electrically connected to the circuit board. The emitter emits an optical signal to the receiver. When the keycap is not pressed, the receiver receives the optical signal of a first intensity. When the keycap is pressed, the protrusion moves along with the keycap, and the protrusion changes the optical signal received by the receiver to have a second intensity different from the first intensity, so the switch module is triggered to generate a triggering signal.Type: ApplicationFiled: January 4, 2019Publication date: August 1, 2019Inventors: Chen Yang, Yu-Chun Hsieh, Yung-Chih Wang, JIA-HUNG LIU, Ching-Yu Wang, LI-TE CHANG