Patents by Inventor Chingping Tong

Chingping Tong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8361255
    Abstract: A copper alloy material having: 1.0 to 5.0 mass % of Ni; 0.2 to 1.0 mass % of Si; 1.0 to 5.0 mass % of Zn; 0.1 to 0.5 mass % of Sn; 0.003 to 0.3 mass % of P; and the balance consisting of Cu and an unavoidable impurity. The mass ratio between Ni and each of Si, Zn and Sn is to be Ni/Si=4 to 6, Zn/Ni=0.5 or more, and Sn/Ni=0.05 to 0.2.
    Type: Grant
    Filed: October 22, 2009
    Date of Patent: January 29, 2013
    Assignee: Hitachi Cable, Ltd.
    Inventors: Hiroaki Takano, Yoshiki Yamamoto, Koichi Kotoku, Chingping Tong
  • Publication number: 20100096117
    Abstract: A radiator plate includes a core having core surfaces and holes whose hole axes are directed in a direction along a normal direction of the core surface, and heat transfer plates joined to the core surfaces and filled in the holes. A multilayer radiator plate includes a first radiator plate including a first core having first core surfaces and first holes whose hole axes are directed in a direction along a normal direction of the first core surface and first heat transfer plates joined to the first core surfaces and filled in the first holes, a second radiator plate including a second core having second core surfaces and second holes whose hole axes are directed in a direction along a normal direction of the second core surface and second heat transfer plates joined to the second core surfaces and filled in the second holes, and the first radiator plate and the second radiator plate are joined to each other.
    Type: Application
    Filed: October 16, 2009
    Publication date: April 22, 2010
    Inventors: Masahiro SEIDO, Kazuhiko Nakagawa, Chingping Tong
  • Publication number: 20100037996
    Abstract: A copper alloy material having: 1.0 to 5.0 mass % of Ni; 0.2 to 1.0 mass % of Si; 1.0 to 5.0 mass % of Zn; 0.1 to 0.5 mass % of Sn; 0.003 to 0.3 mass % of P; and the balance consisting of Cu and an unavoidable impurity. The mass ratio between Ni and each of Si, Zn and Sn is to be Ni/Si=4 to 6, Zn/Ni=0.5 or more, and Sn/Ni=0.05 to 0.2.
    Type: Application
    Filed: October 22, 2009
    Publication date: February 18, 2010
    Inventors: Hiroaki TAKANO, Yoshiki Yamamoto, Koichi Kotoku, Chingping Tong
  • Publication number: 20070051441
    Abstract: A copper alloy material having: 1.0 to 5.0 mass % of Ni; 0.2 to 1.0 mass % of Si; 1.0 to 5.0 mass % of Zn; 0.1 to 0.5 mass % of Sn; 0.003 to 0.3 mass % of P; and the balance consisting of Cu and an unavoidable impurity. The mass ratio between Ni and each of Si, Zn and Sn is to be Ni/Si=4 to 6, Zn/Ni=0.5 or more, and Sn/Ni=0.05 to 0.2.
    Type: Application
    Filed: August 28, 2006
    Publication date: March 8, 2007
    Inventors: Hiroaki Takano, Yoshiki Yamamoto, Koichi Kotoku, Chingping Tong
  • Publication number: 20070051442
    Abstract: A copper alloy material for electric parts having: 1.0 to 5.0 mass % of Ni; 0.2 to 1.0 mass % of Si; 0.05 to 2.0 mass % of Sn; 0.1 to 5.0 mass % of Zn; 0.01 to 0.3 mass % of P; 0.05 to 1.0 mass % of at least one of Fe and Co; and the balance consisting of Cu and an unavoidable impurity. The ratio, (Ni+Fe+Co)/(Si+P), between the total mass of Ni, Fe and Co and the total mass of Si and P is 4 or more and 10 or less.
    Type: Application
    Filed: August 28, 2006
    Publication date: March 8, 2007
    Inventors: Yoshiki Yamamoto, Hiroaki Takano, Koichi Kotoku, Chingping Tong, Katsumi Nomura