Patents by Inventor Ching-Yuan Chen
Ching-Yuan Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11984465Abstract: The present disclosure relates to a CMOS image sensor having a multiple deep trench isolation (MDTI) structure, and an associated method of formation. In some embodiments, the image sensor comprises a boundary deep trench isolation (BDTI) structure disposed at boundary regions of a pixel region surrounding a photodiode. The BDTI structure has a ring shape from a top view and two columns surrounding the photodiode with the first depth from a cross-sectional view. A multiple deep trench isolation (MDTI) structure is disposed at inner regions of the pixel region overlying the photodiode, the MDTI structure extending from the back-side of the substrate to a second depth within the substrate smaller than the first depth. The MDTI structure has three columns with the second depth between the two columns of the BDTI structure from the cross-sectional view. The MDTI structure is a continuous integral unit having a ring shape.Type: GrantFiled: August 9, 2022Date of Patent: May 14, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei Chuang Wu, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu, Yen-Ting Chiang, Chun-Yuan Chen, Shen-Hui Hong
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Integration scheme for breakdown voltage enhancement of a piezoelectric metal-insulator-metal device
Patent number: 11984261Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a dielectric structure sandwiched between a first electrode and a bottom electrode. A passivation layer overlies the second electrode and the dielectric structure. The passivation layer comprises a horizontal surface vertically below a top surface of the passivation layer. The horizontal surface is disposed above a top surface of the dielectric structure.Type: GrantFiled: August 25, 2021Date of Patent: May 14, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Anderson Lin, Chun-Ren Cheng, Chi-Yuan Shih, Shih-Fen Huang, Yi-Chuan Teng, Yi Heng Tsai, You-Ru Lin, Yen-Wen Chen, Fu-Chun Huang, Fan Hu, Ching-Hui Lin, Yan-Jie Liao -
Publication number: 20240153987Abstract: The present disclosure relates to an integrated chip including a dielectric structure over a substrate. A first capacitor is disposed between sidewalls of the dielectric structure. The first capacitor includes a first electrode between the sidewalls of the dielectric structure and a second electrode between the sidewalls and over the first electrode. A second capacitor is disposed between the sidewalls. The second capacitor includes the second electrode and a third electrode between the sidewalls and over the second electrode. A third capacitor is disposed between the sidewalls. The third capacitor includes the third electrode and a fourth electrode between the sidewalls and over the third electrode. The first capacitor, the second capacitor, and the third capacitor are coupled in parallel by a first contact on a first side of the first capacitor and a second contact on a second side of the first capacitor.Type: ApplicationFiled: January 5, 2024Publication date: May 9, 2024Inventors: Hsuan-Han Tseng, Chun-Yuan Chen, Lu-Sheng Chou, Hsiao-Hui Tseng, Ching-Chun Wang
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Publication number: 20240143050Abstract: A portable electronic device includes a housing, a heat-dissipation component, a bracket, a door structure, a driving mechanism, and a driven linkage. The housing includes a heat-dissipation opening disposed in the housing. The bracket is disposed in the housing and surrounds the heat-dissipation component. The door structure is configured to move between a closed position covering the heat-dissipation opening and an open position exposing the heat-dissipation opening. The driving mechanism is coupled between the bracket and the door structure to drive the door structure to rotate and move. The driven linkage is coupled between the bracket and the door structure. When the door structure is driven to rotate and move, the door structure drives the driven linkage to rotate and move, so that the driven linkage and the driving mechanism jointly drive the door structure to move between the closed position and the open position.Type: ApplicationFiled: June 13, 2023Publication date: May 2, 2024Applicant: ASUSTeK COMPUTER INC.Inventors: Cheng-Han Chung, Hung-Yueh Chen, Ching-Yuan Yang
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Patent number: 11967591Abstract: A method of forming a semiconductor device includes forming a first interconnect structure over a carrier; forming a thermal dissipation block over the carrier; forming metal posts over the first interconnect structure; attaching a first integrated circuit die over the first interconnect structure and the thermal dissipation block; removing the carrier; attaching a semiconductor package to the first interconnect structure and the thermal dissipation block using first electrical connectors and thermal dissipation connectors; and forming external electrical connectors, the external electrical connectors being configured to transmit each external electrical connection into the semiconductor device, the thermal dissipation block being electrically isolated from each external electrical connection.Type: GrantFiled: August 6, 2021Date of Patent: April 23, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yu-Hao Chen, Fong-Yuan Chang, Po-Hsiang Huang, Ching-Yi Lin, Jyh Chwen Frank Lee
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Patent number: 11948949Abstract: In some embodiments, the present disclosure relates to a device having a semiconductor substrate including a frontside and a backside. On the frontside of the semiconductor substrate are a first source/drain region and a second source/drain region. A gate electrode is arranged on the frontside of the semiconductor substrate and includes a horizontal portion, a first vertical portion, and a second vertical portion. The horizontal portion is arranged over the frontside of the semiconductor substrate and between the first and second source/drain regions. The first vertical portion extends from the frontside towards the backside of the semiconductor substrate and contacts the horizontal portion of the gate electrode structure. The second vertical portion extends from the frontside towards the backside of the semiconductor substrate, contacts the horizontal portion of the gate electrode structure, and is separated from the first vertical portion by a channel region of the substrate.Type: GrantFiled: July 15, 2022Date of Patent: April 2, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chun-Yuan Chen, Ching-Chun Wang, Hsiao-Hui Tseng, Jen-Cheng Liu, Jhy-Jyi Sze, Shyh-Fann Ting, Wei Chuang Wu, Yen-Ting Chiang, Chia Ching Liao, Yen-Yu Chen
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Publication number: 20240100743Abstract: A separation apparatus suitable for separating plastic and silicone in a composite material includes a storage tank configured to store a hydrocarbon solvent, and a reaction tank fluidly connected to the storage tank and having a reaction space for placement of the composite material therein and for receiving the hydrocarbon solvent from the storage tank such that the composite material is immersed in the hydrocarbon solvent for separating the plastic and the silicone in the composite material. The plastic and the silicone in the composite material are insoluble in the hydrocarbon solvent.Type: ApplicationFiled: September 19, 2023Publication date: March 28, 2024Applicants: Taiwan Green Point Enterprises Co., Ltd., Jabil Circuit (Singapore) Pte. Ltd.Inventors: Bing-Yuan Lin, Ying-Yin Chen, Yung-Chih Chen, Ching-Hsin Chen
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Publication number: 20240096701Abstract: A device includes: a stack of semiconductor nanostructures; a gate structure wrapping around the semiconductor nanostructures, the gate structure extending in a first direction; a source/drain region abutting the gate structure and the stack in a second direction transverse the first direction; a contact structure on the source/drain region; a backside conductive trace under the stack, the backside conductive trace extending in the second direction; a first through via that extends vertically from the contact structure to a top surface of the backside dielectric layer; and a gate isolation structure that abuts the first through via in the second direction.Type: ApplicationFiled: May 17, 2023Publication date: March 21, 2024Inventors: Chun-Yuan CHEN, Huan-Chieh SU, Ching-Wei TSAI, Shang-Wen CHANG, Yi-Hsun CHIU, Chih-Hao WANG
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Publication number: 20240088030Abstract: Provided are semiconductor devices that include a first gate structure having a first end cap portion, a second gate structure having a second end cap portion coaxial with the first gate structure, a first dielectric region separating the first end cap portion and the second end cap portion, a first conductive element extending over the first gate structure, a second conductive element extending over the second gate structure, and a gate via electrically connecting the second gate structure and the second conductive element, with the first dielectric region having a first width and being positioned at least partially under the first conductive element and defines a spacing between the gate via and an end of the second end cap portion that exceeds a predetermined distance.Type: ApplicationFiled: January 23, 2023Publication date: March 14, 2024Inventors: Chin-Liang CHEN, Chi-Yu LU, Ching-Wei TSAI, Chun-Yuan CHEN, Li-Chun TIEN
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Patent number: 11916100Abstract: The present disclosure relates to an integrated chip including a dielectric structure over a substrate. A first capacitor is disposed between sidewalls of the dielectric structure. The first capacitor includes a first electrode between the sidewalls of the dielectric structure and a second electrode between the sidewalls and over the first electrode. A second capacitor is disposed between the sidewalls. The second capacitor includes the second electrode and a third electrode between the sidewalls and over the second electrode. A third capacitor is disposed between the sidewalls. The third capacitor includes the third electrode and a fourth electrode between the sidewalls and over the third electrode. The first capacitor, the second capacitor, and the third capacitor are coupled in parallel by a first contact on a first side of the first capacitor and a second contact on a second side of the first capacitor.Type: GrantFiled: March 21, 2022Date of Patent: February 27, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hsuan-Han Tseng, Chun-Yuan Chen, Lu-Sheng Chou, Hsiao-Hui Tseng, Ching-Chun Wang
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Publication number: 20230275201Abstract: An LED light source module includes a substrate; a protective layer disposed on the substrate and having at least one opening; a plurality of conductive terminals disposed in the at least one opening, a light-emitting member, a plurality of electrodes, and an auxiliary structure. The conductive terminals include a first conductive terminal and a second conductive terminal. The light-emitting member includes a bottom surface, a light-emitting surface connected to the bottom surface, a back surface opposite to the light-emitting surface, at least one lateral surface connecting the light-emitting surface and the bottom surface. The auxiliary structure includes a main support portion provided on the substrate to support the bottom surface of the light-emitting member, and the main support portion is located between the electrodes and extends at least from the back surface to the light-emitting surface of the light-emitting member.Type: ApplicationFiled: May 4, 2023Publication date: August 31, 2023Inventors: Chih-Hsien CHUNG, Hsiu-Hung YEH, Ching-Yuan CHEN
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Patent number: 11686896Abstract: An LED light source module includes a substrate; a protective layer disposed on the substrate and having at least one opening; a plurality of conductive terminals disposed in the at least one opening, a light-emitting member, a plurality of electrodes, and an auxiliary structure. The conductive terminals include a first conductive terminal and a second conductive terminal. The light-emitting member includes a bottom surface, a light-emitting surface connected to the bottom surface, a back surface opposite to the light-emitting surface, at least one lateral surface connecting the light-emitting surface and the bottom surface.Type: GrantFiled: November 20, 2020Date of Patent: June 27, 2023Assignees: RADIANT OPTO-ELECTRONICS(SUZHOU) CO., LTD., RADIANT OPTO-ELECTRONICS CORPORATIONInventors: Chih-Hsien Chung, Hsiu-Hung Yeh, Ching-Yuan Chen
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Patent number: 11541551Abstract: A robotic arm comprising an operation end, a base, a sensor unit and a control unit is provided. The operation end is connected to the base, and the operation end is configured to reach an operational area. The sensor unit provides a sensor signal according to the force applied by or the motion of an operator. When the operation end reaches the operational area, the control unit sets a fixed position on the robotic arm between the base and the operation end. When the sensor signal from the operator fulfills a default condition, the control unit moves the robotic arm away from the operator, without moving the fixed position on the robotic arm.Type: GrantFiled: July 31, 2019Date of Patent: January 3, 2023Assignee: NATIONAL TAIWAN UNIVERSITYInventors: Jia-Yush Yen, You-Ting Liao, Ching-Yuan Chen, Yen-Han Wang, Yung-Yaw Chen, Ming-Chih Ho
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Publication number: 20220067531Abstract: The disclosure provides misclassification-driven training (MDT) that efficiently identifies critical faults in neuromorphic hardware, such as a memristor crossbar. MDT advantageously identifies whether a hardware fault is a critical fault and can be used to limit fault recovery when a hardware fault is not a critical fault. By applying fault-tolerant techniques directed to critical faults, such as only for critical faults, processing overhead of a neural network can be reduced. In one aspect, the disclosure provides a method of identifying critical faults in neuromorphic hardware of a neural network. In one example the method of identifying includes: (1) determining a significant parameter of a trained neural network that impacts classification of a sample of a dataset, (2) obtaining a location of the significant parameter in the neuromorphic hardware, and (3) identifying the location as a critical fault of the neuromorphic hardware.Type: ApplicationFiled: August 25, 2021Publication date: March 3, 2022Inventors: Ching-Yuan Chen, Krishnendu Chakrabarty
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Publication number: 20210088714Abstract: An LED light source module includes a substrate; a protective layer disposed on the substrate and having at least one opening; a plurality of conductive terminals disposed in the at least one opening, a light-emitting member, a plurality of electrodes, and an auxiliary structure. The conductive terminals include a first conductive terminal and a second conductive terminal. The light-emitting member includes a bottom surface, a light-emitting surface connected to the bottom surface, a back surface opposite to the light-emitting surface, at least one lateral surface connecting the light-emitting surface and the bottom surface.Type: ApplicationFiled: November 20, 2020Publication date: March 25, 2021Inventors: Chih-Hsien CHUNG, Hsiu-Hung YEH, Ching-Yuan CHEN
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Publication number: 20210063339Abstract: A urine testing strip and a urine testing system are provided. The urine testing system includes the urine test strip and a detection device. The urine test strip includes a working electrode, a counter electrode, a reference electrode, a trigger circuit and a protection layer. The protection layer covers the working electrode, the counter electrode and the reference electrode, and portions of the working electrode, the counter electrode and the reference electrode are exposed through an opening of the protection layer. The detection device includes a test strip receiving module and a wireless transmission module. The test strip receiving module is used to receive the test strip and to provide electric power to the test strip for obtaining a detection result. The wireless transmission module is used to transmit the detection result to a mobile computer device.Type: ApplicationFiled: August 25, 2020Publication date: March 4, 2021Inventors: Yu-Chia KUO, Ching-Yuan CHEN, Po-Ming YANG, Shun-Wei SHIH, Cho-Wen HUANG, Jen-Chieh CHIEN, Wei-San CHANG, Mu-Yi HUA, Ching-Fu CHEN, Yu-Cheng CHEN, Wan-Tun HUNG, Chin-Lien HUANG
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Patent number: 10883667Abstract: An LED light source module is provided, including a substrate, a protective layer, a first conductive terminal, a second conductive terminal, at least one auxiliary structure, and a light-emitting member. The protective layer is disposed on the substrate and has an opening. The first conductive terminal, the second conductive terminal, and the auxiliary structure are disposed on the substrate and accommodated in the opening, wherein the auxiliary structure is disposed between the first conductive terminal and the second conductive terminal. The light-emitting member has a first electrode and a second electrode, respectively electrically connected to the first conductive terminal and the second conductive terminal. The auxiliary structure is disposed between the light-emitting member and the substrate. A method for manufacturing the aforementioned LED light source module is also provided.Type: GrantFiled: September 28, 2018Date of Patent: January 5, 2021Assignees: RADIANT OPTO-ELECTRONICS (SUZHOU) CO., LTD, RADIANT OPTO-ELECTRONICS CORPORATIONInventors: Chih-Hsien Chung, Hsiu-Hung Yeh, Ching-Yuan Chen, Yen-Chuan Chu
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Publication number: 20200039085Abstract: A robotic arm comprising an operation end, a base, a sensor unit and a control unit is provided. The operation end is connected to the base, and the operation end is configured to reach an operational area. The sensor unit provides a sensor signal according to the force applied by or the motion of an operator. When the operation end reaches the operational area, the control unit sets a fixed position on the robotic arm between the base and the operation end. When the sensor signal from the operator fulfills a default condition, the control unit moves the robotic arm away from the operator, without moving the fixed position on the robotic arm.Type: ApplicationFiled: July 31, 2019Publication date: February 6, 2020Inventors: Jia-Yush Yen, You-Ting Liao, Ching-Yuan Chen, Yen-Han Wang, Yung-Yaw Chen, Ming-Chih Ho
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Patent number: 10480921Abstract: A counting device for distance measuring wheel includes a housing, a transmission assembly, a counter wheel assembly, and a reset control assembly. An elastic support unit of the reset control assembly is arranged at the side of each of the transmission assembly and the counter wheel assembly so that the relative positions among the transmission assembly, the counter wheel assembly, and the reset control assembly arranged inside the housing are changed and the size of the counter wheel assembly may become larger while the size of the housing is not changed.Type: GrantFiled: August 7, 2018Date of Patent: November 19, 2019Inventor: Ching-Yuan Chen
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Publication number: 20190128480Abstract: An LED light source module is provided, including a substrate, a protective layer, a first conductive terminal, a second conductive terminal, at least one auxiliary structure, and a light-emitting member. The protective layer is disposed on the substrate and has an opening. The first conductive terminal, the second conductive terminal, and the auxiliary structure are disposed on the substrate and accommodated in the opening, wherein the auxiliary structure is disposed between the first conductive terminal and the second conductive terminal. The light-emitting member has a first electrode and a second electrode, respectively electrically connected to the first conductive terminal and the second conductive terminal. The auxiliary structure is disposed between the light-emitting member and the substrate. A method for manufacturing the aforementioned LED light source module is also provided.Type: ApplicationFiled: September 28, 2018Publication date: May 2, 2019Inventors: Chih-Hsien CHUNG, Hsiu-Hung YEH, Ching-Yuan CHEN, Yen-Chuan CHU