Patents by Inventor Chinmay Suresh Betrabet
Chinmay Suresh Betrabet has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7599109Abstract: Embodiments of a security device utilizing electrochromic material are disclosed.Type: GrantFiled: January 12, 2007Date of Patent: October 6, 2009Assignee: Hewlett-Packard Development Company, L.P.Inventors: David A. Champion, Chinmay Suresh Betrabet
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Publication number: 20080170287Abstract: Embodiments of a security device utilizing electrochromic material are disclosed.Type: ApplicationFiled: January 12, 2007Publication date: July 17, 2008Inventors: David A. Champion, Chinmay Suresh Betrabet
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Patent number: 7045028Abstract: The present invention is directed to reducing the build up or accretion of adhesive, alone or in combination with other materials, on the surfaces of equipment used to ultrasonically treat a workpiece (e.g., ultrasonically bonding various components or pieces to one another.) Thus the invention encompasses composites, absorbent products, and methods of making said composites and products where an adhesive composition having certain identified properties is used to reduce the build up or accretion of the adhesive on ultrasonic bonding equipment. In one embodiment of the invention, a composite includes an adhesive having a capillary-viscosity value of about 7 Pas·sec or greater and a Shore-OO-Hardness value of about 65 or greater, whereby the relative accretion value is less than about 1, and more particularly less than about 0.5.Type: GrantFiled: February 6, 2003Date of Patent: May 16, 2006Assignee: Kimberly-Clark Wordwide, Inc.Inventors: Chinmay Suresh Betrabet, Davis Dang Hoang Nhan
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Patent number: 6662992Abstract: A method for reducing adhesive build-up on ultrasonic bonding surfaces of ultrasonic bonding systems is disclosed. The method includes providing an ultrasonic bonding surface. A pad is provided proximate to, and in fluid contact with, the ultrasonic bonding system. A fluid is conducted to the pad such that the fluid is applied is intermittently or continuously applied to at least a portion of the ultrasonic bonding surface.Type: GrantFiled: December 19, 2001Date of Patent: December 16, 2003Assignee: Kimberly-Clark Worldwide, Inc.Inventors: Chinmay Suresh Betrabet, Davis Hoang Nhan, Barton Andrew Laughlin, Daniel Hoo, James Melvin Gaestel
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Publication number: 20030120250Abstract: The present invention is directed to reducing the build up or accretion of adhesive, alone or in combination with other materials, on the surfaces of equipment used to ultrasonically treat a workpiece (e.g., ultrasonically bonding various components or pieces to one another.) Thus the invention encompasses composites, absorbent products, and methods of making said composites and products where an adhesive composition having certain identified properties is used to reduce the build up or accretion of the adhesive on ultrasonic bonding equipment. In one embodiment of the invention, a composite includes an adhesive having a capillary-viscosity value of about 7 Pas·sec or greater and a Shore-OO-Hardness value of about 65 or greater, whereby the relative accretion value is less than about 1, and more particularly less than about 0.5.Type: ApplicationFiled: February 6, 2003Publication date: June 26, 2003Inventors: Chinmay Suresh Betrabet, Davis Dang Hoang Nhan
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Patent number: 6550633Abstract: The invention relates to a plurality of wipes, separable joined together. Each wipe of the plurality of wipes is moistened with a liquid in an amount of about 25 percent to about 600 percent of a dry weight of the wipe. An adhesive joins together at least two wipes of the plurality of wipes. The adhesive joins the at least two wipes together with an adhesion strength per unit adhesive length greater than 0 g/cm and less than about 200 g/cm. Alternately or additionally, the adhesive joins the at least two wipes together with an adhesion strength per unit adhesive area greater than 0 g/cm2 and less than about 1000 g/cm2.Type: GrantFiled: May 31, 2001Date of Patent: April 22, 2003Assignee: Kimberly-Clark Worldwide, Inc.Inventors: Yung Hsiang Huang, Jennifer Cappel Larson, Gerald Keith Sosalla, John C. Taylor, Stephen Michael Campbell, Stephen Robert Kehn, Chinmay Suresh Betrabet
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Patent number: 6541679Abstract: The present invention is directed to reducing the build up or accretion of adhesive, alone or in combination with other materials, on the surfaces of equipment used to ultrasonically treat a workpiece (e.g., ultrasonically bonding various components or pieces to one another.) Thus the invention encompasses composites, absorbent products, and methods of making said composites and products where an adhesive composition having certain identified properties is used to reduce the build up or accretion of the adhesive on ultrasonic bonding equipment. In one embodiment of the invention, a composite includes an adhesive having a capillary-viscosity value of about 7 Pas.sec or greater and a Shore-OO-Hardness value of about 65 or greater, whereby the relative accretion value is less than about 1, and more particularly less than about 0.5.Type: GrantFiled: March 8, 2001Date of Patent: April 1, 2003Assignee: Kimberly-Clark Worldwode, Inc.Inventors: Chinmay Suresh Betrabet, Davis Dang Hoang Nhan
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Publication number: 20020192433Abstract: The invention relates to a plurality of wipes, separable joined together. Each wipe of the plurality of wipes is moistened with a liquid in an amount of about 25 percent to about 600 percent of a dry weight of the wipe. An adhesive joins together at least two wipes of the plurality of wipes. The adhesive joins the at least two wipes together with an adhesion strength per unit adhesive length greater than 0 g/cm and less than about 200 g/cm. Alternately or additionally, the adhesive joins the at least two wipes together with an adhesion strength per unit adhesive area greater than 0 g/cm2 and less than about 1000 g/cm2.Type: ApplicationFiled: May 31, 2001Publication date: December 19, 2002Inventors: Yung Hsiang Huang, Jennifer Cappel Larson, Gerald Keith Sosalla, John C. Taylor, Stephen Michael Campbell, Stephen Robert Kehn, Chinmay Suresh Betrabet
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Publication number: 20020121292Abstract: A method for reducing adhesive build-up on ultrasonic bonding surfaces of ultrasonic bonding systems is disclosed. The method includes providing an ultrasonic bonding surface. A pad is provided proximate to, and in fluid contact with, the ultrasonic bonding system. A fluid is conducted to the pad such that the fluid is applied is intermittently or continuously applied to at least a portion of the ultrasonic bonding surface.Type: ApplicationFiled: December 19, 2001Publication date: September 5, 2002Applicant: Kimberly-Clark Worldwide, Inc.Inventors: Chinmay Suresh Betrabet, Davis Hoang Nhan, Barton Andrew Laughlin, Daniel Hoo, James Melvin Gaestel
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Publication number: 20010034508Abstract: The present invention is directed to reducing the build up or accretion of adhesive, alone or in combination with other materials, on the surfaces of equipment used to ultrasonically treat a workpiece (e.g., ultrasonically bonding various components or pieces to one another.) Thus the invention encompasses composites, absorbent products, and methods of making said composites and products where an adhesive composition having certain identified properties is used to reduce the build up or accretion of the adhesive on ultrasonic bonding equipment. In one embodiment of the invention, a composite includes an adhesive having a capillary-viscosity value of about 7 Pas.sec or greater and a Shore-OO-Hardness value of about 65 or greater, whereby the relative accretion value is less than about 1, and more particularly less than about 0.5.Type: ApplicationFiled: March 8, 2001Publication date: October 25, 2001Inventors: Chinmay Suresh Betrabet, Davis Dang Hoang Nhan
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Patent number: 6287403Abstract: An apparatus and method for effecting an operation on at least one moving substrate web is disclosed. The apparatus comprises a rotatable bonding roll that is located adjacent the substrate web and configured to rotate about a bonding axis. A rotatable anvil roll has an anvil surface and is configured to rotate about an anvil axis to press the substrate web against an outer peripheral bonding surface of the bonding roll thereby bonding the substrate web. At least three support wheels are configured to contact the bonding surface of the bonding roll and to hold the bonding roll in a substantially fixed position.Type: GrantFiled: February 15, 2000Date of Patent: September 11, 2001Assignee: Kimberly-Clark Worldwide, Inc.Inventors: Jack Lee Couillard, Chinmay Suresh Betrabet, James Melvin Gaestel, Chris Lee Heikkinen, Daniel Hoo, Jeffery Joseph Samida, Daniel James Sorensen
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Patent number: 6277106Abstract: The present invention provides a diaper which includes an outer cover, a bodyside liner which is superposed on the outer cover and which includes a bodyfacing surface, an absorbent core which is located between the outer cover and the bodyside liner, and an adhesive. The adhesive is located on the bodyfacing surface of the bodyside liner. The adhesive is configured to at least temporarily secure the front portion of the diaper to a wearer's body to assist in positioning and fastening the diaper about the wearer's body. In a particular aspect, the adhesive is configured to provide a peel strength of no more than about 300 grams per centimeter of width and an initial shear strength of no more than about 600 grams per square centimeter.Type: GrantFiled: July 23, 1997Date of Patent: August 21, 2001Assignee: Kimberly-Clark Worldwide, Inc.Inventors: Kristina Michelle Boudry, Chinmay Suresh Betrabet, Ruth Ann Lachapell, Lisha Yu
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Patent number: 6135988Abstract: An absorbent article with an adhesive flap. The absorbent article has a crotch region, a rear waist region, and a body facing surface positionable adjacent a wearer when the article is in use. The absorbent article includes a backsheet, a liquid permeable topsheet attached to the backsheet, an absorbent structure disposed between said topsheet and said backsheet, and a flap positioned in the rear waist region of the article. The flap has first and second oppositely facing major surfaces wherein the first major surface faces the topsheet and the second major surface forms a portion of the body facing surface of the absorbent article. A substantial portion of the front edge of the flap is a free edge and an adhesive is disposed on the body facing major surface of the flap whereby the adhesive may engage the skin of the wearer when the absorbent article is in use.Type: GrantFiled: December 18, 1998Date of Patent: October 24, 2000Assignee: Kimberly-Clark Worldwide, Inc.Inventors: Laura Jean Turner, Chinmay Suresh Betrabet, Ruth Ann Lachapell, Thomas Glenn Merrill, Barbara Oakley Sauer
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Patent number: 6123792Abstract: This invention relates to apparatus and methods for intermittently bonding a substrate web in fabricating a blank subassembly for an absorbent article. The invention comprises ultrasonic bonding apparatus including an anvil roll, a substrate web thereon, and at least one rotary ultrasonic horn. The substrate web can comprise at least first and second layers of material. The rotary ultrasonic horn, in combination with the anvil roll, ultrasonically bonds intermittent segments of the first and second layers of the substrate web to each other. Such intermittent bonds can comprise end seals for the absorbent articles. The ultrasonic horn and anvil roll are periodically separated from each other to provide the intermittent bonding of the substrate web. An actuator apparatus periodically moves the anvil roll and ultrasonic horn from engaging contact with each other preventing bond formation.Type: GrantFiled: August 14, 1998Date of Patent: September 26, 2000Assignee: Kimberly-Clark Worldwide, Inc.Inventors: Jeffrey Joseph Samida, Robin Kurt Nason, Daniel Hoo, Chris Lee Heikkinen, Jack Lee Couillard, Chinmay Suresh Betrabet, James Melvin Gaestel, Paul Gordon Klemp