Patents by Inventor Chinmaya Rajiv Dandekar
Chinmaya Rajiv Dandekar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20230209782Abstract: An apparatus includes: a power converter including a plurality of electronic switches, the electronic switches being controllable to produce a driver signal having a variable amplitude, frequency, and/or phase; and a single-piece base made of a thermally conductive polymer material. The single-piece base includes: a first side configured to hold the power converter; a second side; and one or more heat dissipating elements that extend from the second side. The heat dissipating elements are configured to dissipate heat generated by the electronic switches, and each of the one or more heat dissipating elements is made of the thermally conductive polymer material.Type: ApplicationFiled: November 15, 2022Publication date: June 29, 2023Inventors: Jayakrishnan S. S, Vipin Bokade, Chinmaya Rajiv Dandekar, Michael K. Balck
-
Publication number: 20210262652Abstract: An enclosure assembly includes a housing defining an interior configured to at least partially house one or more electrical components. The housing includes a housing section including an outer plastic portion and an inner metal portion received in the outer plastic portion. An electrical component disposed within the housing section provides power to at least one other electrical component.Type: ApplicationFiled: February 19, 2021Publication date: August 26, 2021Inventors: Srinath K. Aanegola, Parameswari V. L. Gundavarapu, Andrew F. Scarlata, Chinmaya Rajiv Dandekar, Anand Kumar Ramachandran, Pushpak Paris Yabrer
-
Patent number: 9989435Abstract: A leak detection system for a high-temperature aerospace fluid duct may include a rigid metal fluid duct, an electrically conductive polymer disposed around the high-temperature fluid duct, the conductive polymer configured to melt in response to a leak of high-temperature fluid from the high-temperature fluid duct. The system may include a sensor configured to monitor at least one electrical characteristic of the electrically conductive polymer. The system may include a layer of insulation disposed between the electrically conductive polymer and the high-temperature fluid duct.Type: GrantFiled: November 14, 2014Date of Patent: June 5, 2018Assignee: Eaton Intelligent Power LimitedInventors: Chinmaya Rajiv Dandekar, Kartikeya Mahalatkar, Manoj Kumar Verma, Soumayajit Sarkar, Kenneth G. Phaneuf, Javed Abdurrazzaq Mapkar
-
Patent number: 9976991Abstract: A sensor head is described herein. The sensor head can include a first piece, where the first piece can include a body having an outer surface and an inner surface. The first piece can also include a light source cavity disposed in the body at the inner surface. The first piece can further include an optical device cavity disposed in the body at the inner surface. The first piece can also include an ellipsoidal cavity disposed in the body at the inner surface, where the ellipsoidal cavity is disposed adjacent to the optical device cavity. The first piece can further include a receiving device cavity disposed in the body adjacent to the inner surface that forms the ellipsoidal cavity. The first piece can also include at least one channel disposed in the body.Type: GrantFiled: September 3, 2015Date of Patent: May 22, 2018Assignee: Cooper Technologies CompanyInventors: Kalaga Venu Madhav, Swapnil Sushilendra Deshpande, Abhijeet Vikram Kshirsagar, Chinmaya Rajiv Dandekar, Yogesh Shinde, Sarin Kumar Anakkat Koyilothu
-
Patent number: 9719812Abstract: A housing for a gas sensor module is described herein. The housing can include a first portion and a second portion. The first portion can include at least one wall forming a cavity having a first cavity portion and a second cavity portion. The first portion can also include an inlet tube coupling feature and a distribution channel disposed adjacent to the first cavity portion. The first portion can further include an outlet tube coupling feature and a receiving channel disposed adjacent to the second cavity portion. The second portion can include a tuning fork coupling feature disposed adjacent to the second cavity.Type: GrantFiled: August 7, 2015Date of Patent: August 1, 2017Assignee: Cooper Technologies CompanyInventors: Abhijeet Vikram Kshirsagar, Chinmaya Rajiv Dandekar, Amit Barjatya
-
Patent number: 9719915Abstract: A cap for a gas sensor module is described herein. The cap can include at least one wall forming a cavity having a first portion and a second portion. The cap can also include an inlet tube coupling feature disposed in the at least one wall, where the first location is adjacent to the first portion of the cavity. The cap can further include an outlet tube coupling feature disposed in the at least one wall, where the second location is adjacent to the second portion of the cavity. The cap can also include a distribution channel coupling feature disposed in the at least one wall, where the third location is adjacent to the first portion of the cavity. The cap can further include a receiving channel coupling feature disposed in the at least one wall, where the fourth location is adjacent to the second portion of the cavity.Type: GrantFiled: August 7, 2015Date of Patent: August 1, 2017Assignee: Cooper Technologies CompanyInventors: Abhijeet Vikram Kshirsagar, Chinmaya Rajiv Dandekar, Sagar Shivajirao Chavan
-
Patent number: 9638552Abstract: A module for a gas sensor module is described herein. The module can include a first portion. The first portion of the module can include a first body and at least one first micro-resonator coupling feature disposed in and traversing the first body. The first body can be configured to be disposed within a cavity of a housing of the gas sensor. The at least one first micro-resonator coupling feature can be configured to align with at least one optical device of the gas sensor when the first body is disposed within the cavity of housing of the gas sensor. The at least one first micro-resonator coupling feature can be configured to have at least one first micro-resonator disposed therein.Type: GrantFiled: August 7, 2015Date of Patent: May 2, 2017Assignee: Cooper Technologies CompanyInventors: Abhijeet Vikram Kshirsagar, Chinmaya Rajiv Dandekar, Amit Barjatya, Shalini Tripathy
-
Publication number: 20170038230Abstract: A module for a gas sensor module is described herein. The module can include a first portion. The first portion of the module can include a first body and at least one first micro-resonator coupling feature disposed in and traversing the first body. The first body can be configured to be disposed within a cavity of a housing of the gas sensor. The at least one first micro-resonator coupling feature can be configured to align with at least one optical device of the gas sensor when the first body is disposed within the cavity of housing of the gas sensor. The at least one first micro-resonator coupling feature can be configured to have at least one first micro-resonator disposed therein.Type: ApplicationFiled: August 7, 2015Publication date: February 9, 2017Inventors: Abhijeet Vikram Kshirsagar, Chinmaya Rajiv Dandekar, Amit Barjatya, Shalini Tripathy
-
Publication number: 20170038343Abstract: A housing for a gas sensor module is described herein. The housing can include an outer portion and an inner portion disposed within the outer portion. The outer portion can include at least one wall forming a first cavity. The outer portion can also include an inlet tube coupling feature disposed at a first location in the at least one first wall, and an outlet tube coupling feature disposed in a second location in the at least one first wall. The inner portion can include at least one second wall forming a second cavity, and a distribution channel coupling feature disposed at a third location in the at least one second wall. The inner portion can also include a receiving channel coupling feature disposed in a fourth location and a tuning fork coupling feature disposed at a fifth location in the at least one second wall.Type: ApplicationFiled: August 7, 2015Publication date: February 9, 2017Inventors: Abhijeet Vikram Kshirsagar, Chinmaya Rajiv Dandekar, Amit Barjatya, Shalini Tripathy, Taruna Khandelwal
-
Publication number: 20170038229Abstract: A housing for a gas sensor module is described herein. The housing can include a first portion and a second portion. The first portion can include at least one wall forming a cavity having a first cavity portion and a second cavity portion. The first portion can also include an inlet tube coupling feature and a distribution channel disposed adjacent to the first cavity portion. The first portion can further include an outlet tube coupling feature and a receiving channel disposed adjacent to the second cavity portion. The second portion can include a tuning fork coupling feature disposed adjacent to the second cavity.Type: ApplicationFiled: August 7, 2015Publication date: February 9, 2017Inventors: Abhijeet Vikram Kshirsagar, Chinmaya Rajiv Dandekar, Amit Barjatya
-
Publication number: 20170038294Abstract: A cap for a gas sensor module is described herein. The cap can include at least one wall forming a cavity having a first portion and a second portion. The cap can also include an inlet tube coupling feature disposed in the at least one wall, where the first location is adjacent to the first portion of the cavity. The cap can further include an outlet tube coupling feature disposed in the at least one wall, where the second location is adjacent to the second portion of the cavity. The cap can also include a distribution channel coupling feature disposed in the at least one wall, where the third location is adjacent to the first portion of the cavity. The cap can further include a receiving channel coupling feature disposed in the at least one wall, where the fourth location is adjacent to the second portion of the cavity.Type: ApplicationFiled: August 7, 2015Publication date: February 9, 2017Inventors: Abhijeet Vikram Kshirsagar, Chinmaya Rajiv Dandekar, Sagar Shivajirao Chavan
-
Publication number: 20160273995Abstract: A leak detection system for a high-temperature aerospace fluid duct may include a rigid metal fluid duct, an electrically conductive polymer disposed around the high-temperature fluid duct, the conductive polymer configured to melt in response to a leak of high-temperature fluid from the high-temperature fluid duct. The system may include a sensor configured to monitor at least one electrical characteristic of the electrically conductive polymer. The system may include a layer of insulation disposed between the electrically conductive polymer and the high-temperature fluid duct.Type: ApplicationFiled: November 14, 2014Publication date: September 22, 2016Inventors: Chinmaya Rajiv Dandekar, Kartikeya Mahalatkar, Manoj Kumar Verma, Soumayajit Sarkar, Kenneth G. Phaneuf, Javed Abdurrazzaq Mapkar
-
Publication number: 20160061784Abstract: A sensor head is described herein. The sensor head can include a first piece, where the first piece can include a body having an outer surface and an inner surface. The first piece can also include a light source cavity disposed in the body at the inner surface. The first piece can further include an optical device cavity disposed in the body at the inner surface. The first piece can also include an ellipsoidal cavity disposed in the body at the inner surface, where the ellipsoidal cavity is disposed adjacent to the optical device cavity. The first piece can further include a receiving device cavity disposed in the body adjacent to the inner surface that forms the ellipsoidal cavity. The first piece can also include at least one channel disposed in the body.Type: ApplicationFiled: September 3, 2015Publication date: March 3, 2016Inventors: Kalaga Venu Madhav, Swapnil Sushilendra Deshpande, Abhijeet Vikram Kshirsagar, Chinmaya Rajiv Dandekar, Yogesh Shinde, Sarin Kumar Anakkat Koyilothu