Abstract: Described herein are a polyamide composition and a molded article comprising such polyamide composition, such as a mobile electronic device component. The polyamide composition comprises a polyamide polymer, an electrically conductive material comprising carbon fibers, carbon nano-tubes, or any combination thereof, and a glass filler having tri-dimensional structures characterized by an average length of at most 500 microns, said glass filler comprising at least 20 wt % glass flakes. The polyamide composition and the molded article exhibit near-isotropic mold shrinkage, low warpage and near-isotropic CLTE (Coefficient of Linear Thermal Expansion) and are electrostatic dissipative (ESD).

Abstract: Described herein are polymer compositions including a polyphthalamide having a carbon/amide molar ratio greater than 8, a functionalized polyolefin, and a glass fiber, where the weight ratio of the functionalized polyolefin to the total weight of the polyphthalamide and the functionalized polyolefin in the polymer composition is more than 0 and at most 27%. It was surprisingly discovered that the polymer compositions had excellent dielectric performance, acid resistance, and improved mechanical performance, particularly tensile elongation and un-notched Izod impact, relative to corresponding polymer compositions omitting such functionalized polyolefin. Due to the excellent performance, the polymer composition can be desirably incorporated into mobile electronic device components.

Abstract: The invention pertains to a polymer composition comprising 10-82 wt. % of a thermoplastic polymer, 5-45 wt. % of carbon fibers, and 13-45 wt. % of hollow glass beads. The resulting composition has an improved combination of tensile modulus and tensile strain with respect to known composition.

Abstract: Described herein are polyester compositions including a semi-aromatic, semi-crystalline polyester, a polyolefin and a glass fiber having a low Dk and low Df (“low Dk/Df glass fiber”). The concentrations of the semi-crystalline polyester and polyolefin are selected such that the polyester weight ratio is from 70% to 95%. It was surprisingly found that when the polyester weight ratio was in the aforementioned range, the polyester compositions had an excellent balance of dielectric properties (Dk and Df) and mechanical properties (e.g., notched impact strength). It was also surprisingly found that when polyester composition further included high Dk/Df glass fibers, the balance of dielectric and mechanical properties was still further improved when the polyester weight ratio was from 75% to 93%. Due at least in part to the excellent balance of dielectric and mechanical properties, the polyester compositions can be desirably incorporated into mobile electronic device components.

Abstract: The invention pertains to a polymer composition comprising a thermoplastic polymer, a glass fiber, and a hollow glass bead, wherein the ratio of the concentration of the hollow glass bead to the total concentration of the glass fiber and the hollow glass bead ranges from 0.2 to 0.49.

Abstract: Described herein are polymer compositions including an a functionalized polyolefin, an aliphatic polyamide, and a glass fiber, where the weight ratio of the functionalized polyolefin to the total weight of the aliphatic polyamide and the functionalized polyolefin in the polymer composition (“polyolefin weight ratio”) is from 55% to 95%. It was surprisingly discovered that the polymer compositions had excellent dielectric performance and improved mechanical performance, relative to corresponding polymer compositions. Due to the excellent dielectric performance and increased mechanical performance, the polymer composition can be desirably incorporated into mobile electronic device applications.