Patents by Inventor Chirayarikathuveedu Sankarapillai Premachandran

Chirayarikathuveedu Sankarapillai Premachandran has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8127794
    Abstract: A dispenser arrangement for fluidic dispensing control into a microfluidic component comprising an enclosed fluid holding area having a base portion and a top portion and a valve adapted to be movable between an open position and a closed position and positioned at least partially in the fluid holding area. The valve comprises an elongated hollow portion having a body and two ends adapted for fluid flow from the fluid holding area to the microfluidic component in the open position, a first opening on the body of the hollow portion positioned within the fluid holding area allowing fluid communication from the fluid holding area to the microfluidic component in the open position, a sealing portion connected to a first end of the hollow portion positioned within the fluid holding area adapted for sealing connection with the top portion of the fluid holding area in the closed position and a slant second opening at a second end of the hollow portion positioned outside of the fluid holding area.
    Type: Grant
    Filed: September 19, 2006
    Date of Patent: March 6, 2012
    Assignee: Agency for Science, Technology and Research
    Inventors: Ling Xie, Chirayarikathuveedu Sankarapillai Premachandran, Ser Choong Chong
  • Publication number: 20100084032
    Abstract: A dispenser arrangement for fluidic dispensing control into a microfluidic component comprising an enclosed fluid holding area having a base portion and a top portion and a valve adapted to be movable between an open position and a closed position and positioned at least partially in the fluid holding area. The valve comprises an elongated hollow portion having a body and two ends adapted for fluid flow from the fluid holding area to the microfluidic component in the open position, a first opening on the body of the hollow portion positioned within the fluid holding area allowing fluid communication from the fluid holding area to the microfluidic component in the open position, a sealing portion connected to a first end of the hollow portion positioned within the fluid holding area adapted for sealing connection with the top portion of the fluid holding area in the closed position and a slant second opening at a second end of the hollow portion positioned outside of the fluid holding area.
    Type: Application
    Filed: September 19, 2006
    Publication date: April 8, 2010
    Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
    Inventors: Ling Xie, Chirayarikathuveedu Sankarapillai Premachandran, Ser Choong Chong
  • Patent number: 7616987
    Abstract: A microprobe that is capable of using an incident and reflected radiation ray for three-dimensional (3-D) bio-imaging. The microprobe comprises a hollow body closed at one end and having an aperture at an opposite end, at least one 3-D free space micromirror, at least one focusing lens, and a beam director or a beam coupler or other kind of device for beam coupling or splitting. The beam director is arranged at the aperture end of the hollow body and is adapted to direct the incident ray into the hollow body via the aperture. Within said hollow body is the at least one focusing lens and the at least one micromirror arranged respectively from the aperture, such that the distance between the focusing lens and the micromirror allows for the incident light ray to be directed onto the micromirror.
    Type: Grant
    Filed: October 5, 2005
    Date of Patent: November 10, 2009
    Assignees: Agency For Science, Technology and Research, National University of Singapore
    Inventors: Chirayarikathuveedu Sankarapillai Premachandran, Janak Singh, Joseph Suresh Paul, Pamidighantam Venkata Ramana, Colin James Richard Sheppard
  • Patent number: 6846725
    Abstract: A method for forming wafers having through-wafer vias for wafer-level packaging of devices, the method comprising the steps of depositing metal on one of two wafers; bonding the two wafers using the metal deposited on the one of the two wafers; forming a through-wafer via in one of the two wafers; filling the through-wafer via with a conductive material; and forming a cavity in the one of the two wafers having the through-wafer via wherein the cavity is superposable over a device.
    Type: Grant
    Filed: January 27, 2003
    Date of Patent: January 25, 2005
    Assignee: Institute of Microelectronics
    Inventors: Ranganathan Nagarajan, Chirayarikathuveedu Sankarapillai Premachandran, Yu Chen, Vaidyanathan Kripesh