Patents by Inventor Chiu-Lang Lin

Chiu-Lang Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11758691
    Abstract: A heat dissipation structure adapted to dissipate heat from a heat-generating structure includes a heat dissipation unit and a liquid metal layer. The heat dissipation unit includes a heat dissipation body and an anti-corrosion metal layer formed on the heat dissipation body. The liquid metal layer is disposed between the heat-generating structure and the anti-corrosion metal layer, and is opposite to the heat dissipation body. An electronic device that adopts the heat dissipation structure is also disclosed.
    Type: Grant
    Filed: April 26, 2021
    Date of Patent: September 12, 2023
    Assignee: MORNINGRICH TECHNOLOGY CO., LTD.
    Inventor: Chiu-Lang Lin
  • Publication number: 20230180441
    Abstract: A heat dissipation structure adapted to dissipate heat from a heat-generating structure includes a heat dissipation unit and a liquid metal layer. The heat dissipation unit includes a heat dissipation body and an anti-corrosion metal layer formed on the heat dissipation body. The liquid metal layer is disposed between the heat-generating structure and the anti-corrosion metal layer, and is opposite to the heat dissipation body. An electronic device that adopts the heat dissipation structure is also disclosed.
    Type: Application
    Filed: February 2, 2023
    Publication date: June 8, 2023
    Inventor: Chiu-Lang LIN
  • Publication number: 20220080452
    Abstract: Disclosed herein is a method for applying a liquid metal on a surface of an object that is selected from the group consisting of a heat-emitting surface and a heat-conducting surface. The method includes applying the liquid metal onto the surface, and applying a force to the liquid metal using a tool to destroy cohesion of the liquid metal, followed by moving the tool back and forth to apply the liquid metal on the surface.
    Type: Application
    Filed: September 11, 2020
    Publication date: March 17, 2022
    Inventors: Li-Chen HSIEH, Chiu-Lang LIN
  • Publication number: 20210337696
    Abstract: A heat dissipation structure adapted to dissipate heat from a heat-generating structure includes a heat dissipation unit and a liquid metal layer. The heat dissipation unit includes a heat dissipation body and an anti-corrosion metal layer formed on the heat dissipation body. The liquid metal layer is disposed between the heat-generating structure and the anti-corrosion metal layer, and is opposite to the heat dissipation body. An electronic device that adopts the heat dissipation structure is also disclosed.
    Type: Application
    Filed: April 26, 2021
    Publication date: October 28, 2021
    Inventor: Chiu-Lang LIN
  • Publication number: 20170176113
    Abstract: A heat sink adapted to dissipate heat from a heat source includes a heat dissipating unit that includes at least one deformation portion protruding toward the heat source, and a reflective surface formed on the deformation portion and facing the heat source for reflecting radiant heat from the heat source. A case including the heat sink is also disclosed.
    Type: Application
    Filed: July 7, 2016
    Publication date: June 22, 2017
    Inventors: Chiu-Lang Lin, Li-Chen Hsieh
  • Patent number: 9097468
    Abstract: The present invention relates to a heat-dissipating device for an electronic device, comprising a graphite planar body, one or more metal layers, an insulation film and an adhesive. The heat-dissipating device is optionally attached to a heat sink. The method of using the heat-dissipating device to dissipate heat is also disclosed.
    Type: Grant
    Filed: February 5, 2012
    Date of Patent: August 4, 2015
    Assignee: WAH HONG INDUSTRIAL CORP.
    Inventors: Ko-Chun Chen, Chiu-Lang Lin
  • Patent number: 8955580
    Abstract: The present invention relates to a heat-dissipating device for an electronic device, comprising a graphite planar body, one or more metal layers, an insulation film and an adhesive. The heat-dissipating device is optionally attached to a heat sink. The method of using the heat-dissipating device to dissipate heat is also disclosed.
    Type: Grant
    Filed: May 16, 2011
    Date of Patent: February 17, 2015
    Assignee: Wah Hong Industrial Corp.
    Inventors: Ko-Chun Chen, Chiu-Lang Lin
  • Publication number: 20140185323
    Abstract: A backlight unit with a light source, a light guiding plate, a reflective film and an anisotropic heat dissipation layer is disclosed. At least some embodiments provide a display panel including the backlight unit and methods for reducing the temperature of a backlight unit by the anisotropic heat dissipation layer.
    Type: Application
    Filed: March 7, 2014
    Publication date: July 3, 2014
    Inventors: Ko-Chun CHEN, Chiu-Lang LIN
  • Publication number: 20140069622
    Abstract: A multi-layer heat dissipation composite for reducing the external surface temperature of an electronic device is disclosed. The heat dissipation composite comprises a reflective component and a component with anisotropic property. The heat dissipation composite further comprises an adhesive. Some embodiments also provide methods for reducing the external surface temperature of an electronic device.
    Type: Application
    Filed: July 9, 2013
    Publication date: March 13, 2014
    Inventors: Ko-Chun CHEN, Chiu-Lang Lin
  • Publication number: 20140049985
    Abstract: A backlight unit with a light source, a light guiding plate, a reflective film and an anisotropic heat dissipation layer is disclosed. At least some embodiments provide a display panel including the backlight unit and methods for reducing the temperature of a backlight unit by the anisotropic heat dissipation layer.
    Type: Application
    Filed: August 19, 2013
    Publication date: February 20, 2014
    Inventors: Ko-Chun CHEN, Chiu-Lang LIN
  • Publication number: 20140049984
    Abstract: A backlight unit with a light source, a light guiding plate, a reflective film and an anisotropic heat dissipation layer is disclosed. At least some embodiments provide a display panel including the backlight unit and methods for reducing the temperature of a backlight unit by the anisotropic heat dissipation layer.
    Type: Application
    Filed: August 19, 2013
    Publication date: February 20, 2014
    Inventors: Ko-Chun CHEN, Chiu-Lang LIN
  • Publication number: 20120132404
    Abstract: The present invention relates to a heat-dissipating device for an electronic device, comprising a graphite planar body, one or more metal layers, an insulation film and an adhesive. The heat-dissipating device is optionally attached to a heat sink. The method of using the heat-dissipating device to dissipate heat is also disclosed.
    Type: Application
    Filed: February 5, 2012
    Publication date: May 31, 2012
    Applicant: WAH HONG INDUSTRIAL CORP.
    Inventors: Ko-Chun CHEN, Chiu-Lang LIN
  • Publication number: 20110214851
    Abstract: The present invention relates to a heat-dissipating device for an electronic device, comprising a graphite planar body, one or more metal layers, an insulation film and an adhesive. The heat-dissipating device is optionally attached to a heat sink. The method of using the heat-dissipating device to dissipate heat is also disclosed.
    Type: Application
    Filed: May 16, 2011
    Publication date: September 8, 2011
    Applicant: WAH HONG INDUSTRIAL CORP.
    Inventors: Ko-Chun CHEN, Chiu-Lang LIN
  • Publication number: 20100243230
    Abstract: A heat-dissipating device includes: a planar body made of a graphite laminate and extending along an x-y plane of the graphite laminate; and a plating metal layer formed on the planar body. The heat-dissipating device further includes a metal panel. The planar body is connected substantially perpendicularly to the metal panel. A method of making the heat-dissipating device is also disclosed.
    Type: Application
    Filed: August 14, 2009
    Publication date: September 30, 2010
    Applicant: WAH HONG INDUSTRIAL CORP.
    Inventors: Ko-Chun Chen, Chiu-Lang Lin
  • Publication number: 20050281992
    Abstract: A reflecting mark for anti-counterfeit is provided. The reflecting mark comprises a top transparent film having a top corrugated surface, a bottom reflecting layer disposed under the film, and a figure layer disposed between the film and the reflecting layer. The figure layer comprises at least six layers each having a figure formed thereon. The figures are aligned. Each figure has a color formed by mixing two or more components of cyan (or green), magenta, yellow, and black together. For example, a CIS bearing the reflecting mark can be easily identified by people, thereby eliminating confusion in distinguishing a genuine CIS from a counterfeit one.
    Type: Application
    Filed: June 21, 2004
    Publication date: December 22, 2005
    Inventor: Chiu-Lang Lin
  • Patent number: D454338
    Type: Grant
    Filed: June 1, 2001
    Date of Patent: March 12, 2002
    Inventor: Chiu-Lang Lin
  • Patent number: D454547
    Type: Grant
    Filed: June 1, 2001
    Date of Patent: March 19, 2002
    Inventor: Chiu-Lang Lin
  • Patent number: D457455
    Type: Grant
    Filed: September 17, 2001
    Date of Patent: May 21, 2002
    Inventor: Chiu-Lang Lin
  • Patent number: D461457
    Type: Grant
    Filed: June 1, 2001
    Date of Patent: August 13, 2002
    Inventor: Chiu-Lang Lin
  • Patent number: D461458
    Type: Grant
    Filed: September 17, 2001
    Date of Patent: August 13, 2002
    Inventor: Chiu-Lang Lin