Patents by Inventor Chiu-Mao Huang

Chiu-Mao Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11981811
    Abstract: Provided are a use of a thermoplastic polyurethane for forming an impact resistant layer and an impact resistant composite laminate. The thermoplastic polyurethane comprises a structural unit represented by Formula (I): wherein each R independently is an alkylene group having 2 to 8 carbon atoms or CH2CH2OCH2CH2; n is a number from 2 to 13; and the structural unit has a Mn ranging from 700 g/mole to 2500 g/mole. In addition, the impact resistant layer has a thickness of larger than 1.5 mm. The impact resistant composite laminate comprises a base layer and the impact resistant layer disposed on the base layer.
    Type: Grant
    Filed: March 8, 2022
    Date of Patent: May 14, 2024
    Assignee: SUNKO INK CO., LTD.
    Inventors: Chiu-Peng Tsou, Zhen-Wei Chen, Ting-Ti Huang, Sheng-Mao Tseng
  • Publication number: 20140049482
    Abstract: A touch detection structure and a touch display device using same are disclosed. The touch detection structure includes a frame, a plurality of transmitters, and a plurality of receivers. A printed circuit layer is directly formed on one surface of the frame by way of mechanical processing to electrically connect to the transmitters and the receivers. With the printed circuit layer being directly formed on the frame of the touch detection structure, the touch display device using such touch detection structure can save the costs for using and manufacturing circuit boards and has reduced overall thickness to enable convenient assembling thereof.
    Type: Application
    Filed: August 20, 2012
    Publication date: February 20, 2014
    Inventor: Chiu-Mao Huang
  • Publication number: 20140048677
    Abstract: A bearing cup base and a fan frame assembly provided with same are disclosed. The bearing cup base includes a base body having a first side, a bearing cup perpendicularly forward extended from the first side of the base body, and a printed circuit layer formed on the first side. By directly forming the printed circuit layer on the bearing cup base, a fan using the bearing cup base can be manufactured at largely reduced cost and can have a further reduced overall height.
    Type: Application
    Filed: August 20, 2012
    Publication date: February 20, 2014
    Inventor: Chiu-Mao Huang
  • Patent number: 8422231
    Abstract: A water-cooled communication chassis includes a chassis body and a water cooling unit. The chassis body includes at least one heat receiving portion, at least one heat dissipation portion, and at least one first water pipe system. The first water pipe system has a front part extended through the heat receiving portion and a rear part arranged on the heat dissipation portion, so that heat absorbed by the heat receiving portion is transferred via the first water pipe system to the heat dissipation portion and dissipated therefrom into ambient air. The water cooling unit communicates with the first water pipe system and drives a cooling fluid stored therein to circulate in between the first water pipe system and the water cooling unit, so that the heat absorbed by the heat receiving portion can be quickly and continuously carried away from the communication chassis by the circulating cooling fluid.
    Type: Grant
    Filed: July 7, 2011
    Date of Patent: April 16, 2013
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Chiu-Mao Huang, Chang-Mou Huang
  • Publication number: 20120080992
    Abstract: An LED bulb structure includes a base having a first end and a second end. The first end has a connection section. The second end has a surface section and an extension section substantially perpendicularly protruding from the second end without interfering with the surface section. The extension section has a mount face on which an LED module is disposed and a heat dissipation section disposed on an outer surface of the extension section. a transparent space being defined between the mount face and the surface section. When the LED bulb structure is horizontally locked in a socket on a wall of a building, the projection angle and range of the LED module are modified to enhance lighting efficiency of the LED module.
    Type: Application
    Filed: October 4, 2010
    Publication date: April 5, 2012
    Inventor: Chiu-Mao Huang
  • Patent number: 8052109
    Abstract: A cooling stand includes a base and a top plate made of a crystal glass material. At least one support member is provided on an upper face of the base for supporting the top plate above the base. One face of the top plate facing away from the base is an inclined supporting face, and the top plate and the base together define a rearward expanded space between them. A heat-producing article can be positioned on the inclined supporting face of the top plate, allowing a user to operate the heat-producing article in a position meeting the ergonomics. Meanwhile, heat produced by the heat-producing article can be highly efficiently absorbed by and then dissipated from the crystal glass material of the top plate through air convection at the rearward expanded space.
    Type: Grant
    Filed: February 4, 2009
    Date of Patent: November 8, 2011
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Chiu-Mao Huang, Tzu-Chun Hsueh, Hung-Chin Liao
  • Publication number: 20110222305
    Abstract: An LED car lamp structure with demisting and dehumidifying functions includes a car lamp assembly, at least one LED module, and at least one fan. The car lamp assembly includes a base and a light-transmitting lens connected to a front side of the base, so that the lens and the base form an integral body and define a closed chamber in between them. The LED module is connected to the base and has a plurality of LEDs oriented to the lens, so that light beams emitted from the LEDs are transmitted through the lens to external environment. The fan is connected to the base and located in the closed chamber. When the fan is started, air in the closed chamber is forced to flow and circulate therein, so that the closed chamber has evenly distributed temperature therein to prevent mists and condensate from forming in the car lamp assembly.
    Type: Application
    Filed: April 1, 2010
    Publication date: September 15, 2011
    Applicant: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Chiu-Mao Huang
  • Patent number: 8004842
    Abstract: A heat dissipation device for communication chassis, which includes an enclosure and at least one second heat pipe assembly. The enclosure includes at least one first copper heat absorption component, at least one first heat pipe assembly and multiple radiating fins disposed on an outer surface of the enclosure. The first heat pipe assembly is connected with the first copper heat absorption component and a section not in contact therewith so as to transfer heat absorbed by the first copper heat absorption component to the section to dissipate the heat. The second heat pipe assembly penetrates through the radiating fins of the enclosure for quickly and uniformly distributing the heat to all the radiating fins. Therefore, the heat conduction efficiency is greatly enhanced to provide better heat dissipation effect for the communication chassis.
    Type: Grant
    Filed: May 22, 2009
    Date of Patent: August 23, 2011
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Chiu-Mao Huang, Chang-Mou Huang
  • Patent number: 7924565
    Abstract: A heat dissipation structure for communication chassis. The heat dissipation structure includes an enclosure. At least one first copper heat absorption component and at least one first heat pipe assembly are disposed in the enclosure. The first heat pipe assembly is connected with the first copper heat absorption component and a section not in contact with the first copper heat absorption component. The first heat pipe assembly serves to quickly transfer heat absorbed by the first copper heat absorption component to the section not in contact with the first copper heat absorption component to dissipate the heat.
    Type: Grant
    Filed: May 12, 2009
    Date of Patent: April 12, 2011
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Chiu-Mao Huang, Chang-Mou Huang
  • Patent number: 7885071
    Abstract: A heat dissipation arrangement for communication chassis includes a chassis body defining an inner receiving space and being divided into at least one heat receiving portion and at least one heat dissipation portion; a first heat pipe set arranged in the receiving space to connect the heat receiving portion to the heat dissipation portion, so that heat absorbed by the heat receiving portion can be quickly transferred via the first heat pipe set to the heat dissipation portion; and at least one thermal module including a plurality of radiating fins and at least one second heat pipe, which is connected to the heat dissipation portion and extended through the radiating fins, allowing part of the heat transferred to the heat dissipation portion to be transferred to the radiating fins. The thermal module provides additional heat dissipating area, so that the communication chassis can provide excellent heat dissipation effect.
    Type: Grant
    Filed: March 24, 2009
    Date of Patent: February 8, 2011
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Chiu-Mao Huang, Chang-Moou Huang
  • Publication number: 20100296250
    Abstract: A heat dissipation device for communication chassis, which includes an enclosure and at least one second heat pipe assembly. The enclosure includes at least one first copper heat absorption component, at least one first heat pipe assembly and multiple radiating fins disposed on an outer surface of the enclosure. The first heat pipe assembly is connected with the first copper heat absorption component and a section not in contact therewith so as to transfer heat absorbed by the first copper heat absorption component to the section to dissipate the heat. The second heat pipe assembly penetrates through the radiating fins of the enclosure for quickly and uniformly distributing the heat to all the radiating fins. Therefore, the heat conduction efficiency is greatly enhanced to provide better heat dissipation effect for the communication chassis.
    Type: Application
    Filed: May 22, 2009
    Publication date: November 25, 2010
    Inventors: Chiu-Mao Huang, Chang-Mou Huang
  • Publication number: 20100290189
    Abstract: A heat dissipation structure for communication chassis. The heat dissipation structure includes an enclosure. At least one first copper heat absorption component and at least one first heat pipe assembly are disposed in the enclosure. The first heat pipe assembly is connected with the first copper heat absorption component and a section not in contact with the first copper heat absorption component. The first heat pipe assembly serves to quickly transfer heat absorbed by the first copper heat absorption component to the section not in contact with the first copper heat absorption component to dissipate the heat.
    Type: Application
    Filed: May 12, 2009
    Publication date: November 18, 2010
    Inventors: Chiu-Mao Huang, Chang-Mou Huang
  • Publication number: 20100243204
    Abstract: A heat radiating unit for adapter includes at least one receiving portion and a heat radiating portion. The receiving portion has at least one receiving space for receiving at least one adapter therein. The heat radiating portion includes a plurality of radiating fins, which are extended from an outer surface of the receiving portion in directions opposite to the receiving portion. With the heat radiating unit for adapter, heat produced by an adapter disposed in the receiving space can be transferred to and dissipated from the heat radiating portion to achieve good heat dissipation effect while largely increasing the usable life and power transmission efficiency of the adapter.
    Type: Application
    Filed: March 24, 2009
    Publication date: September 30, 2010
    Inventors: Chiu-Mao Huang, Tzu-Chun Hsueh, Hung-Chin Liao
  • Patent number: 7800907
    Abstract: A communication chassis heat dissipation structure includes a chassis body defining an inner receiving space. The chassis body is divided into at least one heat concentration portion and at least one heat dissipation portion. A first heat pipe set is arranged in the receiving space to extend between and connect to the heat concentration portion and the heat dissipation portion, so that heat absorbed by the heat concentration portion is quickly transferred via the first heat pipe set to the heat dissipation portion and then dissipates from the heat dissipation portion into ambient air. Therefore, heat inside the chassis body can be quickly dissipated outward, enabling a communication chassis to have excellent heat dissipation effect.
    Type: Grant
    Filed: March 24, 2009
    Date of Patent: September 21, 2010
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Chiu-Mao Huang, Chang-Moou Huang
  • Publication number: 20100208428
    Abstract: A communication chassis heat dissipation structure includes a chassis body defining an inner receiving space. The chassis body is divided into at least one heat concentration portion and at least one heat dissipation portion. A first heat pipe set is arranged in the receiving space to extend between and connect to the heat concentration portion and the heat dissipation portion, so that heat absorbed by the heat concentration portion is quickly transferred via the first heat pipe set to the heat dissipation portion and then dissipates from the heat dissipation portion into ambient air. Therefore, heat inside the chassis body can be quickly dissipated outward, enabling a communication chassis to have excellent heat dissipation effect.
    Type: Application
    Filed: March 24, 2009
    Publication date: August 19, 2010
    Applicant: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Chiu-Mao Huang, Chang-Moou Huang
  • Publication number: 20100208430
    Abstract: A heat dissipation arrangement for communication chassis includes a chassis body defining an inner receiving space and being divided into at least one heat receiving portion and at least one heat dissipation portion; a first heat pipe set arranged in the receiving space to connect the heat receiving portion to the heat dissipation portion, so that heat absorbed by the heat receiving portion can be quickly transferred via the first heat pipe set to the heat dissipation portion; and at least one thermal module including a plurality of radiating fins and at least one second heat pipe, which is connected to the heat dissipation portion and extended through the radiating fins, allowing part of the heat transferred to the heat dissipation portion to be transferred to the radiating fins. The thermal module provides additional heat dissipating area, so that the communication chassis can provide excellent heat dissipation effect.
    Type: Application
    Filed: March 24, 2009
    Publication date: August 19, 2010
    Applicant: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Chiu-Mao Huang, Chang-Moou Huang
  • Publication number: 20100193157
    Abstract: A cooling stand includes a base and a top plate made of a crystal glass material. At least one support member is provided on an upper face of the base for supporting the top plate above the base. One face of the top plate facing away from the base is an inclined supporting face, and the top plate and the base together define a rearward expanded space between them. A heat-producing article can be positioned on the inclined supporting face of the top plate, allowing a user to operate the heat-producing article in a position meeting the ergonomics. Meanwhile, heat produced by the heat-producing article can be highly efficiently absorbed by and then dissipated from the crystal glass material of the top plate through air convection at the rearward expanded space.
    Type: Application
    Filed: February 4, 2009
    Publication date: August 5, 2010
    Inventors: Chiu-Mao Huang, Tzu-Chun Hsueh, Hung-Chin Liao