Patents by Inventor Chiu-Min Lee

Chiu-Min Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9837592
    Abstract: A ceramic substrate is provided, including: a board having a first surface and a second surface opposing the first surface; first electrical contact pads disposed on the first surface; second electrical contact pads disposed on the second surface; conductive pillars disposed in the board and connecting the first surface and the second surface to electrically connect the electrical contact pad and the second electrical contact pad; a first heat conductive pad disposed on the first surface; a second heat conductive pad disposed on the second surface; and a heat conductive pillar disposed in the board and connecting the first surface and the second surface to contact and be coupled with the first heat conductive pad and the second heat conductive pad, wherein the heat conductive pillar has a width greater than or equal to widths of the conductive pillars and greater than or equal to 300 micrometers.
    Type: Grant
    Filed: October 17, 2014
    Date of Patent: December 5, 2017
    Assignee: Vikiing Tech Corporation
    Inventors: Chien-Hung Ho, Chiu-Min Lee, Chen-Shen Kuo
  • Patent number: 9768092
    Abstract: A carrier is disclosed, including: a main body having a first surface and a second surface opposing the first surface; a conductive part formed on the first surface of the main body; and a plurality of heat conductors that are not in contact with the conductive part and penetrate the main body to connect the first surface with the second surface. Therefore, heat generated by electronic elements can be effectively dissipated outside to improve the functionality and lifetime of electronic elements.
    Type: Grant
    Filed: August 18, 2014
    Date of Patent: September 19, 2017
    Assignee: Viking Tech Corporation
    Inventors: Chien-Hung Ho, Chiu-Min Lee, Chen-Shen Kuo
  • Publication number: 20150305201
    Abstract: A carrier is disclosed, including: a main body having a first surface and a second surface opposing the first surface; a conductive part formed on the first surface of the main body; and a plurality of heat conductors that are not in contact with the conductive part and penetrate the main body to connect the first surface with the second surface. Therefore, heat generated by electronic elements can be effectively dissipated outside to improve the functionality and lifetime of electronic elements.
    Type: Application
    Filed: August 18, 2014
    Publication date: October 22, 2015
    Inventors: Chien-Hung Ho, Chiu-Min Lee, Chen-Shen Kuo
  • Publication number: 20150303362
    Abstract: A ceramic substrate is provided, including: a board having a first surface and a second surface opposing the first surface; first electrical contact pads disposed on the first surface; second electrical contact pads disposed on the second surface; conductive pillars disposed in the board and connecting the first surface and the second surface to electrically connect the electrical contact pad and the second electrical contact pad; a first heat conductive pad disposed on the first surface; a second heat conductive pad disposed on the second surface; and a heat conductive pillar disposed in the board and connecting the first surface and the second surface to contact and be coupled with the first heat conductive pad and the second heat conductive pad, wherein the heat conductive pillar has a width greater than or equal to widths of the conductive pillars and greater than or equal to 300 micrometers.
    Type: Application
    Filed: October 17, 2014
    Publication date: October 22, 2015
    Inventors: Chien-Hung Ho, Chiu-Min Lee, Chen-Shen Kuo