Abstract: A composite metal foil and a method of manufacturing the same are provided. The composite metal foil includes at least a first metal layer and a second metal layer. The first metal layer is copper foil, nickel foil, stainless steel foil, or a combination thereof. The second metal layer is disposed on a surface of the first metal layer. A contact angle of a surface of the second metal layer to liquid lithium metal is lower than 90 degrees.

Abstract: A resin composition is provided. The resin composition includes a polyimide resin; a hydrocarbon resin or a fluorinated polymer resin; and a silica that is modified by a surface modifier. The content of the hydrocarbon resin is in a range from 1 to 13 parts by weight based on 100 parts by weight of the polyimide resin. The content of the fluorinated polymer resin is in a range from 1 to 60 parts by weight based on 100 parts by weight of the polyimide resin. The content of the silica is in a range from 1 to 10 parts by weight based on 100 parts by weight of the polyimide resin.

Abstract: An electrolytic copper foil is provided, in which the average grain size of the electrolytic copper foil in cross-section measured by electron back scattered diffraction (EBSD) is 1 ?m or less in diameter. Moreover, in an X-ray diffraction (XRD) pattern of a first surface of the electrolytic copper foil measured by X-ray diffraction, a ratio of the diffraction peak intensity of (111) crystal plane to the sum of the diffraction peak intensities of (111) crystal plane, (200) crystal plane, (220) crystal plane, and (311) crystal plane is 0.5 or more.

Abstract: A primer composition and a laminated substrate with a primer are provided. The primer composition includes 60 to 90 parts by weight of vinyl-aromatic-conjugated-diene copolymer, 1 to 16 parts by weight of a compound having at least three of terminal acryloyloxy groups and 5 to 24 parts by weight of a silane coupling agent, wherein the silane coupling agentis distinct from the compound having at least three of terminal acryloyloxy groups.

Abstract: A resin composition is provided. The resin composition includes a polyimide resin; a hydrocarbon resin or a fluorinated polymer resin; and a silica that is modified by a surface modifier. The content of the hydrocarbon resin is in a range from 1 to 13 parts by weight based on 100 parts by weight of the polyimide resin. The content of the fluorinated polymer resin is in a range from 1 to 60 parts by weight based on 100 parts by weight of the polyimide resin. The content of the silica is in a range from 1 to 10 parts by weight based on 100 parts by weight of the polyimide resin.

Abstract: An electrolyzed copper foil and a current collector of an energy storage device are provided. The electrolyzed copper foil includes a transition layer and a nano-twin copper layer formed on the transition layer. The transition layer has an equiaxial grain of a (111) plane having a volume ratio of 20-40%, a (200) plane having a volume ratio of 20-40%, and a (220) plane having a volume ratio of 20-40%. A thickness of the transition layer is 0.2 ?m to 1.5 ?m. The nano-twin copper layer has a columnar grain of the (111) plane having a volume ratio of more than 85%, and a thickness of the nano-twin copper layer is 3 ?m to 30 ?m.

Abstract: A resin composition is provided. The resin composition includes a polyimide resin; a hydrocarbon resin or a fluorinated polymer resin; and a silica that is modified by a surface modifier. The content of the hydrocarbon resin is in a range from 1 to 13 parts by weight based on 100 parts by weight of the polyimide resin. The content of the fluorinated polymer resin is in a range from 1 to 60 parts by weight based on 100 parts by weight of the polyimide resin. The content of the silica is in a range from 1 to 10 parts by weight based on 100 parts by weight of the polyimide resin.

Abstract: A method of manufacturing a copper foil for a high frequency circuit includes sequentially forming a fine roughness copper nodule layer on a surface of an electroplated copper layer, the fine roughness copper nodule layer being consisted essentially of copper particles or copper alloy particles with a particle size of 100 nm to 200 nm; then, performing electroplating with a Zn—Ni co-electroplating formula for 3 seconds or more to form a Zn—Ni plating layer on the fine roughness copper nodule layer, the Zn—Ni plating layer including 90-150 ?g/dm2 of zinc and 75-120 ?g/dm2 of nickel; forming a rust-proof layer on the Zn—Ni plating layer, the rust-proof layer including 20-40 ?g/dm2 of chromium; and next, forming a hydrophobic layer on the rust-proof layer, the hydrophobic layer having a water contact angle of 80 to 150 degrees.

Abstract: An electrolyzed copper foil and a current collector of an energy storage device are provided. The electrolyzed copper foil includes a transition layer and a nano-twin copper layer formed on the transition layer. The transition layer has an equiaxial grain of a (111) plane having a volume ratio of 20-40%, a (200) plane having a volume ratio of 20-40%, and a (220) plane having a volume ratio of 20-40%. A thickness of the transition layer is 0.2 ?m to 1.5 ?m. The nano-twin copper layer has a columnar grain of the (111) plane having a volume ratio of more than 85%, and a thickness of the nano-twin copper layer is 3 ?m to 30 ?m.

Abstract: A copper foil and a manufacturing method of the same, and a current collector of an energy storage device are provided. The manufacturing method includes forming a copper foil by direct-current electroplating on a surface of a cathode and separating the copper foil from the cathode after the electroplating, wherein the structure of the copper foil includes columnar grains of a (111) orientation having a volume ratio of 70% or more. The conditions of the direct-current electroplating include performing at a range of 35° C. to 55° C. using a plating solution containing 40 g/L to 120 g/L of copper ions, 40 g/L to 110 g/L of sulfuric acid, and 30 ppm to 90 ppm of chloride ions at a current density between 20 ASD and 60 ASD.

Abstract: A resin composition is provided. The resin composition includes a polyimide resin; a hydrocarbon resin or a fluorinated polymer resin; and a silica that is modified by a surface modifier. The content of the hydrocarbon resin is in a range from 1 to 13 parts by weight based on 100 parts by weight of the polyimide resin. The content of the fluorinated polymer resin is in a range from 1 to 60 parts by weight based on 100 parts by weight of the polyimide resin. The content of the silica is in a range from 1 to 10 parts by weight based on 100 parts by weight of the polyimide resin.

Abstract: A copper foil for a high frequency circuit and a method of manufacturing the same are provided. The copper foil for a high frequency circuit includes an electroplated copper layer, a fine roughness copper nodule layer, a Zn—Ni plating layer, a rust-proof layer, and a hydrophobic layer. The fine roughness copper nodule layer is located on a surface of the electroplated copper layer and is consisted essentially of copper particles or copper alloy particles with a particle size of 100 nm to 200 nm. The Zn—Ni plating layer is located on the fine roughness copper nodule layer and includes 90-150 ?g/dm2 of zinc and 75-120 ?g/dm2 of nickel. The rust-proof layer is located on the Zn—Ni plating layer and includes 20-40 ?g/dm2 of chromium. The hydrophobic layer is located on the rust-proof layer and has a contact angle of 80 to 150 degrees.

Abstract: A surface treatment for a wrought copper foil relatives to a surface treatment procedure for a wrought cooper foil for use on a flexible PCB. The surface treatment comprises the steps of bi-polar electrochemical degreasing, acid etching and nodularization, electroplating a barrier layer and an anti-tarnish layer and coating a silane coupling agent layer to a copper foil. One side of the copper foil is nodularization, and a Zn—Ni barrier layer and a Cr—Zn anti-tarnish layer are electroplated on the copper foil. Finally, the organic silane coupling agent is coated to the roughened surface of the copper foil to modify the surface characters to impart the peel strength. Whereby, the cooper foil has very low profile, high peel strength, finer-pattern property, low HCl undercut and high thermal oxidation property.