Patents by Inventor Chiung-Hsiung Chen
Chiung-Hsiung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10173928Abstract: A dielectric ceramic composition includes a first inorganic component having a trigonal ditrigonal pyramidal crystal structure, a second inorganic component having a hexoctahedral crystal structure, and a solid solution portion of the trigonal ditrigonal pyramidal crystal structure and the hexoctahedral crystal structure is formed between the first inorganic component and the second inorganic component.Type: GrantFiled: December 19, 2017Date of Patent: January 8, 2019Assignee: Industrial Technology Research InstituteInventors: Chun-An Lu, Hong-Ching Lin, Chiung-Hsiung Chen, Yuan-Ling Tsai
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Publication number: 20180251405Abstract: A dielectric ceramic composition includes a first inorganic component having a trigonal ditrigonal pyramidal crystal structure, a second inorganic component having a hexoctahedral crystal structure, and a solid solution portion of the trigonal ditrigonal pyramidal crystal structure and the hexoctahedral crystal structure is formed between the first inorganic component and the second inorganic component.Type: ApplicationFiled: December 19, 2017Publication date: September 6, 2018Applicant: Industrial Technology Research InstituteInventors: Chun-An Lu, Hong-Ching Lin, Chiung-Hsiung Chen, Yuan-Ling Tsai
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Publication number: 20180169606Abstract: An apparatus for producing an inorganic powder and an apparatus for producing and classifying an inorganic powder are provided, wherein the apparatus for producing an inorganic powder includes an insulating tube, at least one pair of annular RF electrodes, and a gas supply apparatus. The pair of annular RF electrodes surrounds the outer circumference of the insulating tube to generate a first electric field region outside the insulating tube and generate a second electric field region having a plasma torch in the insulating tube after being turned on. The gas supply apparatus supplies a reaction mist and an inert gas into the insulating tube to thermally degrade and oxidize the reaction mist into an inorganic powder via the plasma torch.Type: ApplicationFiled: December 5, 2017Publication date: June 21, 2018Applicant: Industrial Technology Research InstituteInventors: Chun-An Lu, Yuan-Ling Tsai, Chiung-Hsiung Chen, Yi-Chen Wu, Shih-Chin Lin
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Patent number: 9707706Abstract: A flexible substrate embedded with wires includes a flexible substrate constituted by a polymer material, and a continuous wire pattern containing a plurality of pores embedded in the flexible substrate, wherein the polymer material fills the pores. A method for fabricating a flexible substrate embedded with wires providing a carrier; forming a continuous wire pattern on the carrier, the continuous wire pattern containing a plurality of pores; covering a polymer material over the continuous wire pattern and the carrier and to fill into the pores; and separating the polymer material and the carrier to form a flexible substrate embedded with the continuous wire pattern” where the only change is the addition of wires.Type: GrantFiled: February 20, 2015Date of Patent: July 18, 2017Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chun-Wei Su, Chyi-Ming Leu, Yu-Ju Kuo, Hong-Ching Lin, Chun-An Lu, Chiung-Hsiung Chen
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Publication number: 20160167080Abstract: A coating device is provided, and includes a coater and an electrical field generator. The coater contains a slurry or ink and has an outlet. The slurry or ink is coated on a substrate through the outlet. The substrate is disposed adjacent to the outlet, and loads the slurry or ink from the outlet of the coater to form a wet film. The electrical field generator is disposed under the substrate and provides the electrical field, and thus the wet film stacks tightly on the substrate due to the attraction of the electrical field.Type: ApplicationFiled: November 23, 2015Publication date: June 16, 2016Inventors: Chun-An Lu, Yuan-Ling Tsai, Chiung-Hsiung Chen, Jiun-Jang Yu, Chin-Tien Yang
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Patent number: 9160054Abstract: A radio frequency (RF) identification tag including a substrate, a planar antenna, an RF chip, a plurality of signal conductors and a plurality of ground conductors is provided. The RF chip receives an RF signal from the planar antenna to generate an identification code. The signal conductors are coupled to the planar antenna. The ground conductors, interlaced on two opposite sides of the signal conductors, and the signal conductors are adjacent to each other and disposed on the substrate to form a coplanar waveguide structure which includes an impedance match portion and a transmission portion. The impedance match portion has an input end coupled to the signal conductors and a ground plane coupled to the ground conductors. The RF chip is disposed between the input end and the ground plane. The transmission portion is connected between the impedance match portion and the planar antenna.Type: GrantFiled: June 15, 2012Date of Patent: October 13, 2015Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Jiun-Jang Yu, Chiung-Hsiung Chen, Chun-An Lu, Hong-Ching Lin
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Publication number: 20150245470Abstract: A flexible substrate embedded with wires is provided. The flexible substrate embedded with wires includes a flexible substrate constituted by a polymer material, and a continuous wire pattern containing a plurality of pores embedded in the flexible substrate, wherein the polymer material fills the pores. A method for fabricating a flexible substrate embedded with wires is also provided.Type: ApplicationFiled: February 20, 2015Publication date: August 27, 2015Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chun-Wei SU, Chyi-Ming LEU, Yu-Ju KUO, Hong-Ching LIN, Chun-An LU, Chiung-Hsiung CHEN
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Publication number: 20130123726Abstract: A radio frequency (RF) identification tag including a substrate, a planar antenna, an RF chip, a plurality of signal conductors and a plurality of ground conductors is provided. The RF chip receives an RF signal from the planar antenna to generate an identification code. The signal conductors are coupled to the planar antenna. The ground conductors, interlaced on two opposite sides of the signal conductors, and the signal conductors are adjacent to each other and disposed on the substrate to form a coplanar waveguide structure which includes an impedance match portion and a transmission portion. The impedance match portion has an input end coupled to the signal conductors and a ground plane coupled to the ground conductors. The RF chip is disposed between the input end and the ground plane. The transmission portion is connected between the impedance match portion and the planar antenna.Type: ApplicationFiled: June 15, 2012Publication date: May 16, 2013Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Jiun-Jang Yu, Chiung-Hsiung Chen, Chun-An Lu, Hong-Ching Lin
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Patent number: 8042744Abstract: A radio frequency identification (RFID) tag including a substrate, an RFID chip, a chip contact part, a folding circuit and a radiation part is provided. The chip contact part is formed on the substrate and electrically coupled to the RFID chip. The folding circuit is formed on the substrate and electrically coupled to the chip contact part. The folding circuit has a winding part, which forms a hollow region, for compensating the antenna electric length. The radiation part is formed on the substrate and electrically coupled to the folding circuit, wherein one terminal of the winding part of the folding circuit is open, and the other terminal is electrically coupled to the radiation part. At least one of the folding circuit and the radiation part is asymmetric to the chip contact part.Type: GrantFiled: July 21, 2009Date of Patent: October 25, 2011Assignee: Industrial Technology Research InstituteInventors: Jiun-Jang Yu, Hsin-Hsien Yeh, Hong-Ching Lin, Chiung-Hsiung Chen
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Publication number: 20100116893Abstract: A radio frequency identification (RFID) tag including a substrate, an RFID chip, a chip contact part, a folding circuit and a radiation part is provided. The chip contact part is formed on the substrate and electrically coupled to the RFID chip. The folding circuit is formed on the substrate and electrically coupled to the chip contact part. The folding circuit has a winding part, which forms a hollow region, for compensating the antenna electric length. The radiation part is formed on the substrate and electrically coupled to the folding circuit, wherein one terminal of the winding part of the folding circuit is open, and the other terminal is electrically coupled to the radiation part. At least one of the folding circuit and the radiation part is asymmetric to the chip contact part.Type: ApplicationFiled: July 21, 2009Publication date: May 13, 2010Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Jiun-Jang Yu, Hsin-Hsien Yeh, Hong-Ching Lin, Chiung-Hsiung Chen
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Publication number: 20090160653Abstract: An anti-metal radio frequency identification (RFID) tag and a manufacturing method thereof are described. The anti-metal RFID tag includes a substrate having a first surface and a second surface on an opposite side thereof; a planar integral antenna formed on the first surface of the substrate; a RFID transceiver chip (i.e., RFID chip) disposed on the surface of the substrate and coupled to a signal feed point of the planar integral antenna. The flexible planar integral antenna and substrate are folded and then fixed by a fixing mechanism to form an anti-metal RFID tag with a feed-in structure, a RFID transceiver chip, and a radiator on one side, and a ground plane on the opposite side. A spacer is further sandwiched in the center of the folded structure, which is helpful for improving the antenna gain of the anti-metal RFID tag.Type: ApplicationFiled: December 28, 2007Publication date: June 25, 2009Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Hsin-Hsien Yeh, Ying-Chang Hung, Jiun-Jang Yu, Hong-Ching Lin, Chiung-Hsiung Chen
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Patent number: 6822258Abstract: A self-organized nanometer interface structure is disclosed. During the reactive sputtering process, the chemical dynamics difference among reactants induces self-organization to form a special nanometer interface structure. The nanometer interface structure naturally form an interface potential difference so that it has a rectifying effect in a particular range of potential variation range. Therefore, it functions like a diode. Such a self-organized nanometer interface structure can be used in the manufacturing of diodes, transistors, light-emitting devices, and sonic devices. The invention has the advantages of a wide variety of material selections, highly compatible processes, easy operations, and low-cost fabrications.Type: GrantFiled: March 4, 2003Date of Patent: November 23, 2004Assignee: Industrial Technology Research Institute/Material ResearchInventors: Jong-Hong Lu, Huai-Luh Chang, Chiung-Hsiung Chen, Yi-Ping Huang, Sheng-Ju Liao, Yuh-Fwu Chou, Ho-Yin Pun
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Publication number: 20040119062Abstract: A self-organized nanometer interface structure is disclosed. During the reactive sputtering process, the chemical dynamics difference among reactants induces self-organization to form a special nanometer interface structure. The nanometer interface structure naturally form an interface potential difference so that it has a rectifying effect in a particular range of potential variation range. Therefore, it functions like a diode. Such a self-organized nanometer interface structure can be used in the manufacturing of diodes, transistors, light-emitting devices, and sonic devices. The invention has the advantages of a wide variety of material selections, highly compatible processes, easy operations, and low-cost fabrications.Type: ApplicationFiled: March 4, 2003Publication date: June 24, 2004Inventors: Jong-Hong Lu, Huai-Luh Chang, Chiung-Hsiung Chen, Yi-Ping Huang, Sheng-Ju Liao, Yuh-Fwu Chou, Ho-Yin Pun