Abstract: A heat-dissipating assembly structure includes a first heat dissipating sheet attached to one side of a memory module and having first hooks at one long side, a second heat dissipating sheet attached to the opposite side of the memory module and having second hooks at one long side respectively hooked up with the first hooks, and pairs of guide plates respectively provided at the same long side of the left heat dissipating sheet and the same long side of the right heat dissipating sheet at different elevations for guiding the first hooks into engagement with the second hooks during installation of the heat-dissipating assembly structure.

Abstract: A heat-dissipating assembly structure is disclosed that includes a first and a second thermally conductive sheets, each of which includes a plurality of spaced fastening sections including a projection on its outer surface and two parallel guides with the projection disposed there-between; and a plurality of U-shaped clamps including two flexible latches at two opposite sides, each latch having a hook-shaped end. Attaching the first and second thermally conductive sheets to both side surfaces of a memory by adhesive respectively with the top of the memory being concealed, and pressing each of the clamps onto the corresponding fastening sections will secure the first and second thermally conductive members and the memory together by fastening the ends of the latches at the projections respectively. The heat-dissipating assembly structure of the present invention possesses an increased heat removal efficiency during operation.