Abstract: A package-type solid electrolytic capacitor is provided which comprises a capacitor element including a chip from which an anode wire partially projects out, a resin package enclosing the capacitor element, and a diode also enclosed in the package. The diode has a negative pole electrically connected to the anode wire, and a positive pole electrically connected to the chip. The diode is designed to allow passage therethrough of a forward current under a forward bias which is lower than the reverse dielectric breakdown voltage of the capacitor element.

Abstract: A solid electrolytic capacitor comprises a capacitor element including a chip body and an anode wire projecting from the chip body, an anode lead electrically connected to the anode wire, a cathode lead paired with the anode lead, a fuse wire having a first end electrically connected to the cathode lead and a second end electrically connected to the chip body, and a resin package enclosing the capacitor element, part of the anode lead, part of the cathode lead, and the fuse wire. The first end of the fuse wire has a nail head form for bonding to the cathode lead with a sufficient adhesion area without increasing the length of the first end.

Abstract: A solid electrolytic capacitor comprises a capacitor element including a chip body and an anode wire projecting from the chip body, an anode lead electrically connected to the anode wire, a cathode lead paired with the anode lead, a first fuse wire connecting electrically between the chip body and the cathode lead, and a resin package enclosing the capacitor element, part of the anode lead, part of the cathode lead, and the first fuse wire. The capacitor further comprises an auxiliary lead separate from the anode and cathode leads, and a second fuse wire for electrically connecting the auxiliary lead to one of the chip body and the anode lead within the resin package.

Abstract: A solid electrolytic capacitor comprises a capacitor element including a chip body and an anode wire projecting from the chip body, an anode lead electrically connected to the anode wire, a cathode lead paired with the anode lead, a fuse wire having a first end electrically connected to the cathode lead and a second end electrically connected to the chip body, and a resin package enclosing the capacitor element, part of the anode lead, part of the cathode lead, and the fuse wire. The first end of the fuse wire has a nail head form for bonding to the cathode lead with a sufficient adhesion area without increasing the length of the first end.

Abstract: The present invention provides a process which is particularly suited for mass-producing solid electrolytic capacitors. The process utilizes a combination of a mold and a presser member. The mold has a series of molding recesses, and a lead receiving groove extending along and through the series of molding recesses. The presser member has a corresponding series of pressing projections. A portion of a continuous lead wire is placed in the groove, and powdered electrode material is loaded in the molding recesses. The presser member is then moved toward the mold, so that the powdered material is compacted within the molding recesses by the pressing projections. The resulting compacts are removed from the mold together with the wire. The same process steps are repeated with respect to other portions of the wire.